Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Catalyst Semiconductor |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
NO |
MATTE TIN |
DUAL |
R-PDIP-T28 |
5.5 V |
5.08 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
64 |
e3 |
.00015 Amp |
36.695 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||
Rochester Electronics |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
e3 |
11.8 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Rochester Electronics |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
11.8 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
32 |
e3 |
.0001 Amp |
11.8 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
32 |
e3 |
.0001 Amp |
11.8 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
64 words |
5 |
3/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
64X16 |
64 |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
10 ms |
SPI |
1024 bit |
2.5 V |
SPI BUS INTERFACE |
e0 |
.000003 Amp |
4.9 mm |
|||||||||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
3/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
128X16 |
128 |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
10 ms |
SPI |
2048 bit |
2.5 V |
SPI BUS INTERFACE |
e0 |
.000003 Amp |
4.9 mm |
|||||||||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
3 mA |
256 words |
3/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
256X16 |
256 |
0 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1000000 Write/Erase Cycles |
Not Qualified |
SPI |
4096 bit |
.000003 Amp |
||||||||||||||||||||||||||||||||||||||
Intersil |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
100 |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
6.35 mm |
1000000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
SOFTWARE DATA PROTECTION; 64 BYTE PAGE WRITE; 100 YEARS DATA RETENTION |
64 |
e0 |
.0002 Amp |
37.4 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
256X8 |
256 |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
1 ms |
I2C |
2048 bit |
4.5 V |
e3 |
30 |
260 |
.00005 Amp |
4.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDIP-T8 |
6 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
4.5 V |
e3 |
.000005 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
512X8 |
512 |
0 Cel |
MATTE TIN |
1010XXMR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
4.5 V |
e3 |
.0001 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
Atmel |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
SERIAL |
SYNCHRONOUS |
5 mA |
524288 words |
3.3 |
3.3 |
1 |
CHIP CARRIER |
LDCC20,.4SQ |
EEPROMs |
1.27 mm |
70 Cel |
512KX1 |
512K |
0 Cel |
TIN LEAD |
QUAD |
HARDWARE |
S-PQCC-J20 |
2 |
3.6 V |
4.572 mm |
15 MHz |
8.9662 mm |
Not Qualified |
524288 bit |
3 V |
IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO |
e0 |
225 |
8.9662 mm |
||||||||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2048 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
225 |
.0001 Amp |
13.97 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
37.0205 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
SERIAL |
ASYNCHRONOUS |
131072 words |
3.3 |
1 |
MICROELECTRONIC ASSEMBLY |
DIE OR CHIP |
70 Cel |
16KX8 |
128K |
0 Cel |
MATTE TIN |
UNSPECIFIED |
1 |
R-XXMA-X8 |
5.5 V |
5 MHz |
Not Qualified |
7 ms |
I2C |
131072 bit |
2.7 V |
ALSO SUPPORTS SYNCHRONOUS OPERATION |
e3 |
35 ns |
|||||||||||||||||||||||||||||||||
Fairchild Semiconductor |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
512 words |
3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
70 Cel |
512X8 |
512 |
0 Cel |
Tin/Lead (Sn/Pb) |
1010DDMR |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
15 ms |
I2C |
4096 bit |
2.7 V |
e0 |
.00001 Amp |
4.9 mm |
||||||||||||||||||||||||||
Fairchild Semiconductor |
EEPROM |
COMMERCIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
512 words |
3 |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
70 Cel |
512X8 |
512 |
0 Cel |
Tin/Lead (Sn/Pb) |
1010DDMR |
DUAL |
R-PDSO-G8 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3 mm |
Not Qualified |
15 ms |
I2C |
4096 bit |
2.7 V |
e0 |
.00001 Amp |
4.4 mm |
||||||||||||||||||||||||||
|
Winbond Electronics |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
64KX8 |
64K |
0 Cel |
DUAL |
R-PDIP-T28 |
5.25 V |
5.33 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
37.08 mm |
45 ns |
12 |
||||||||||||||||||||||||||||||||||
Xicor |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
3-STATE |
256X8 |
256 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
100000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
10 ms |
SPI |
2048 bit |
4.5 V |
100K ENDURANCE CYCLES; DATA RETENTION = 100 YEARS |
e0 |
.00015 Amp |
4.9 mm |
||||||||||||||||||||||||
Xicor |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
3-STATE |
256X8 |
256 |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
100000 Write/Erase Cycles |
2 MHz |
3.9 mm |
Not Qualified |
10 ms |
SPI |
2048 bit |
2.7 V |
100K ENDURANCE CYCLES; DATA RETENTION = 100 YEARS |
e0 |
.00015 Amp |
4.9 mm |
||||||||||||||||||||||||
Xicor |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
8 |
SMALL OUTLINE |
100 |
1.27 mm |
70 Cel |
3-STATE |
256X8 |
256 |
0 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.75 mm |
100000 Write/Erase Cycles |
1 MHz |
3.9 mm |
Not Qualified |
10 ms |
SPI |
2048 bit |
4.5 V |
100K ENDURANCE CYCLES; DATA RETENTION = 100 YEARS |
4.9 mm |
||||||||||||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
36288 words |
COMMON |
5 |
5 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
36288X1 |
36288 |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.5974 mm |
10 MHz |
7.62 mm |
Not Qualified |
36288 bit |
4.75 V |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
e3 |
30 |
250 |
.00005 Amp |
9.3599 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
256X8 |
256 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.8 V |
e3 |
30 |
260 |
4.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
16 words |
4.5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
16X8 |
16 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
4 ms |
I2C |
128 bit |
2.5 V |
e3 |
.000001 Amp |
9.46 mm |
4.5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.3 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
4KX8 |
4K |
0 Cel |
Matte Tin (Sn) - annealed |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
6 V |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
2.5 V |
2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED |
e3 |
40 |
260 |
.000001 Amp |
4.9 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
SEPARATE |
5 |
8 |
UNCASED CHIP |
DIE OR CHIP |
200 |
70 Cel |
3-STATE |
4KX8 |
4K |
0 Cel |
UPPER |
1 |
HARDWARE |
R-XUUC-N |
5.5 V |
1000000 Write/Erase Cycles |
10 MHz |
5 ms |
SPI |
32768 bit |
4.5 V |
ALSO OPERATES WITH 2.5V MIN @ 5MHZ AND 1.8VMIN @3MHZ |
5 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1.5 mA |
256 words |
3 |
3/5 |
16 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
256X16 |
256 |
0 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
6 V |
1.75 mm |
1000000 Write/Erase Cycles |
2 MHz |
3.9 mm |
Not Qualified |
6 ms |
MICROWIRE |
4096 bit |
2.5 V |
e3 |
30 |
260 |
.000001 Amp |
4.9 mm |
3 |
||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
2.7 V |
AUTOMATIC WRITE |
64 |
e0 |
240 |
.00002 Amp |
17.9 mm |
250 ns |
3 |
YES |
|||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0002 Amp |
37.0205 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e0 |
30 |
225 |
.0001 Amp |
13.97 mm |
150 ns |
5 |
YES |
||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
37.0205 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
NO |
TIN |
DUAL |
R-PDSO-G24 |
1 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
16384 bit |
4.5 V |
e3 |
30 |
260 |
.0001 Amp |
15.4 mm |
200 ns |
5 |
YES |
|||||||||||||||||||||
Holtek Semiconductor |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
SERIAL |
5 mA |
8192 words |
2.5/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
65536 bit |
.000004 Amp |
|||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4294967296 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
34359738368 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Xicor |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
70 Cel |
3-STATE |
256X8 |
256 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
4.32 mm |
100000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
SPI |
2048 bit |
4.5 V |
100K ENDURANCE CYCLES; DATA RETENTION = 100 YEARS |
e0 |
.00015 Amp |
10.03 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
128X8 |
128 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
4.5 V |
e3 |
30 |
260 |
.0001 Amp |
4.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
256X8 |
256 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
4.5 V |
e3 |
30 |
260 |
.0001 Amp |
4.9 mm |
5 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDIP-T8 |
6 V |
4.32 mm |
1000000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.8 V |
e3 |
.000005 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
256X8 |
256 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
4.5 V |
e3 |
30 |
260 |
.0001 Amp |
4.9 mm |
5 |
||||||||||||||||||||
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
8 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
5 mA |
262144 words |
COMMON |
3.3 |
3.3 |
1 |
SMALL OUTLINE, THIN PROFILE |
TSOP8,.25 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
1.1938 mm |
15 MHz |
3.937 mm |
Not Qualified |
262144 bit |
3 V |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
e0 |
30 |
225 |
.00005 Amp |
4.9276 mm |
|||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
512X8 |
512 |
0 Cel |
MATTE TIN |
1010XXMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
4096 bit |
4.5 V |
e3 |
30 |
260 |
.0001 Amp |
4.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
1KX8 |
1K |
0 Cel |
MATTE TIN |
1010XMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e3 |
30 |
260 |
4.9 mm |
5 |
||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
3.3 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
2KX8 |
2K |
0 Cel |
TIN LEAD |
1010MMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.73 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
2.7 V |
2-WIRE SERIAL INTERFACE |
e0 |
.000004 Amp |
4.89 mm |
|||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
16K |
30 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
8K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.7 V |
512 |
NAND TYPE |
.00005 Amp |
18.4 mm |
45 ns |
3 |
NO |
||||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
65536 words |
5 |
YES |
5 |
16 |
IN-LINE |
DIP40,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-CDIP-T40 |
5.5 V |
4.06 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; PAGE WRITE |
64 |
e0 |
.0004 Amp |
50.755 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP14,.25 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
256X8 |
256 |
0 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G14 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
4.5 V |
2-WIRE SERIAL INTERFACE |
e0 |
.000018 Amp |
8.65 mm |
|||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2048 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G24 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
1 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
.0001 Amp |
15.4 mm |
200 ns |
5 |
YES |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.