OTHER EEPROM 1,939

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

KS24A010C

Samsung

EEPROM

OTHER

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

1024 words

2.5

1

IN-LINE

2.54 mm

70 Cel

1KX1

1K

-25 Cel

DUAL

R-PDIP-T8

5.5 V

5.08 mm

.4 MHz

7.62 mm

Not Qualified

5 ms

I2C

1024 bit

1.8 V

9.2 mm

KS24A2561CT

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

262144 words

2.5

2/5

1

SMALL OUTLINE

TSSOP8(UNSPEC)

EEPROMs

50

.65 mm

70 Cel

256KX1

256K

-25 Cel

TIN LEAD

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.2 mm

500000 Write/Erase Cycles

1 MHz

3 mm

Not Qualified

5 ms

I2C

262144 bit

1.8 V

e0

.000001 Amp

4.4 mm

S524C80D41-SC

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

512 words

3.3

8

SMALL OUTLINE

1.27 mm

70 Cel

512X8

512

-25 Cel

TIN LEAD

DUAL

R-PDSO-G8

5.5 V

1.95 mm

.1 MHz

3.95 mm

Not Qualified

10 ms

I2C

4096 bit

2.5 V

e0

4.92 mm

S524A60X81-DC

Samsung

EEPROM

OTHER

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

1024 words

2.5

8

IN-LINE

2.54 mm

70 Cel

1KX8

1K

-25 Cel

DUAL

R-PDIP-T8

5.5 V

5.08 mm

.4 MHz

7.62 mm

Not Qualified

5 ms

I2C

8192 bit

1.8 V

9.2 mm

K8S1215EZC-FE1DT

Samsung

EEPROM CARD

OTHER

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

512

YES

BOTTOM

R-PBGA-B64

1

Not Qualified

536870912 bit

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

S524A40X10-DC

Samsung

EEPROM

OTHER

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

128 words

2.5

2/5

8

IN-LINE

DIP8,.3

EEPROMs

100

2.54 mm

70 Cel

128X8

128

-25 Cel

1010DDDR

DUAL

HARDWARE/SOFTWARE

R-PDIP-T8

5.5 V

5.08 mm

1000000 Write/Erase Cycles

.4 MHz

7.62 mm

Not Qualified

5 ms

I2C

1024 bit

1.8 V

.000001 Amp

9.2 mm

K8S1215EBC-DE1DT

Samsung

EEPROM CARD

OTHER

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B64

1

Not Qualified

BOTTOM

536870912 bit

e3

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

S524C20D21-RCB0

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

SERIAL

3 mA

256 words

3/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

100

.635 mm

70 Cel

256X8

256

-25 Cel

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

1000000 Write/Erase Cycles

Not Qualified

I2C

2048 bit

.000005 Amp

K8P2716UZC-QE4ET

Samsung

EEPROM CARD

OTHER

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

55 mA

8388608 words

YES

1.8/3.3,3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

1

Not Qualified

134217728 bit

8/16

e3

260

NOR TYPE

.00004 Amp

YES

80 ns

2.7

YES

K8S1315EZC-SE1FT

Samsung

EEPROM CARD

OTHER

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

512

YES

MATTE TIN

BOTTOM

R-PBGA-B64

1

Not Qualified

536870912 bit

e3

NOR TYPE

.00003 Amp

YES

95 ns

2.7

YES

S524A40X21-SC

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

256 words

2.5

2/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

100

1.27 mm

70 Cel

256X8

256

-25 Cel

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.8 mm

1000000 Write/Erase Cycles

.4 MHz

3.95 mm

Not Qualified

5 ms

I2C

2048 bit

1.8 V

.000001 Amp

4.92 mm

KFG2816Q1M-DEB

Samsung

EEPROM CARD

OTHER

67

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

32K

25 mA

8388608 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA67,8X10,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-30 Cel

256

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B67

1

Not Qualified

134217728 bit

512

e3

NAND TYPE

.00005 Amp

14.5 ns

2.7

NO

KS24A020CS

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2048 words

2.5

1

SMALL OUTLINE

1.27 mm

70 Cel

2KX1

2K

-25 Cel

DUAL

R-PDSO-G8

5.5 V

1.95 mm

.4 MHz

3.95 mm

Not Qualified

5 ms

I2C

2048 bit

1.8 V

4.92 mm

KS24C01CSTF

Samsung

EEPROM CARD

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

SERIAL

3 mA

128 words

3/5

8

SMALL OUTLINE

SOP8,.25

EEPROMs

100

1.27 mm

70 Cel

128X8

128

-25 Cel

TIN LEAD

1010DDDR

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1000000 Write/Erase Cycles

Not Qualified

I2C

1024 bit

e0

.000005 Amp

2.7

KS24A011CT

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1024 words

2.5

1

SMALL OUTLINE

.65 mm

70 Cel

1KX1

1K

-25 Cel

DUAL

R-PDSO-G8

5.5 V

1.2 mm

.4 MHz

3 mm

Not Qualified

5 ms

I2C

1024 bit

1.8 V

4.4 mm

KS24C020C

Samsung

EEPROM

OTHER

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

2048 words

2.5

3/5

1

IN-LINE

DIP8,.3

EEPROMs

100

2.54 mm

70 Cel

2KX1

2K

-25 Cel

Tin/Lead (Sn/Pb)

1010DDDR

DUAL

HARDWARE/SOFTWARE

R-PDIP-T8

5.5 V

5.08 mm

1000000 Write/Erase Cycles

.4 MHz

7.62 mm

Not Qualified

10 ms

I2C

2048 bit

2.2 V

e0

.000005 Amp

9.2 mm

KS24A021CSTF

Samsung

EEPROM

OTHER

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2048 words

2.5

1

SMALL OUTLINE

1.27 mm

70 Cel

2KX1

2K

-25 Cel

DUAL

R-PDSO-G8

5.5 V

1.95 mm

.4 MHz

3.95 mm

Not Qualified

5 ms

I2C

2048 bit

1.8 V

4.92 mm

S524AB0XB1-RC

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

2.5

2/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

EEPROMs

100

.65 mm

70 Cel

8KX8

8K

-25 Cel

1010DDDR

DUAL

HARDWARE

R-PDSO-G8

5.5 V

1.2 mm

1000000 Write/Erase Cycles

.4 MHz

3 mm

Not Qualified

5 ms

I2C

65536 bit

1.8 V

.000001 Amp

4.4 mm

KS24A1281CTTF

Samsung

EEPROM

OTHER

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

131072 words

2.5

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

128KX1

128K

-25 Cel

DUAL

R-PDSO-G8

5.5 V

1.2 mm

1 MHz

3 mm

Not Qualified

5 ms

I2C

131072 bit

1.8 V

4.4 mm

EEPROM

EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.

EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.

One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.

EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.

One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.