Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
1024 words |
3.3 |
3/5 |
1 |
SMALL OUTLINE |
SOC6,.17 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-C6 |
1 |
5.25 V |
1.5 mm |
50000 Write/Erase Cycles |
3.76 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e0 |
20 |
240 |
3.94 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
1024 words |
3.3 |
3/5 |
1 |
SMALL OUTLINE |
SOC6,.17 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-C6 |
1 |
5.25 V |
1.5 mm |
50000 Write/Erase Cycles |
3.76 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e0 |
20 |
240 |
3.94 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
256 words |
5 |
3/5 |
1 |
SMALL OUTLINE |
SOC6,.17 |
EEPROMs |
1.27 mm |
85 Cel |
256X1 |
256 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-C6 |
1 |
6 V |
1.5 mm |
100000 Write/Erase Cycles |
.0163 MHz |
3.76 mm |
Not Qualified |
10 ms |
1-WIRE |
256 bit |
2.8 V |
MICROLAN COMPATIBLE |
e0 |
3.94 mm |
||||||||||||||||||||||||||||
|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
1024 words |
3.3 |
3/5 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,40/20 |
EEPROMs |
40 |
.5 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B6 |
5.25 V |
.77 mm |
50000 Write/Erase Cycles |
1.68 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e3 |
1.68 mm |
|||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
1024 words |
3.3 |
3/5 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,40/20 |
EEPROMs |
10 |
.5 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B6 |
5.25 V |
.67 mm |
50000 Write/Erase Cycles |
1.75 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e0 |
1.98 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
3 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
ASYNCHRONOUS |
1024 words |
3.3 |
3/5 |
1 |
CYLINDRICAL |
SIP3,.1,50 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBCY-T3 |
5.25 V |
50000 Write/Erase Cycles |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e0 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
3 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
ASYNCHRONOUS |
1024 words |
3.3 |
3/5 |
1 |
CYLINDRICAL |
SIP3,.1,50 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBCY-T3 |
5.25 V |
50000 Write/Erase Cycles |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e0 |
20 |
240 |
||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
256 words |
5 |
3/5 |
1 |
SMALL OUTLINE |
SOC6,.17 |
EEPROMs |
1.27 mm |
85 Cel |
256X1 |
256 |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-C6 |
1 |
6 V |
1.5 mm |
100000 Write/Erase Cycles |
.0163 MHz |
3.76 mm |
Not Qualified |
10 ms |
1-WIRE |
256 bit |
2.8 V |
MICROLAN COMPATIBLE |
e0 |
20 |
245 |
3.94 mm |
||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
3 |
TO-92 |
ROUND |
PLASTIC/EPOXY |
NO |
1 |
MOS |
THROUGH-HOLE |
SERIAL |
ASYNCHRONOUS |
256 words |
5 |
3/5 |
1 |
CYLINDRICAL |
SIP3,.1,50 |
EEPROMs |
1.27 mm |
85 Cel |
256X1 |
256 |
-40 Cel |
TIN LEAD |
BOTTOM |
O-PBCY-T3 |
6 V |
100000 Write/Erase Cycles |
.0163 MHz |
Not Qualified |
10 ms |
1-WIRE |
256 bit |
2.8 V |
MICROLAN COMPATIBLE |
e0 |
||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
3 |
TO-92 |
ROUND |
PLASTIC/EPOXY |
NO |
1 |
MOS |
THROUGH-HOLE |
SERIAL |
ASYNCHRONOUS |
256 words |
5 |
3/5 |
1 |
CYLINDRICAL |
SIP3,.1,50 |
EEPROMs |
1.27 mm |
85 Cel |
256X1 |
256 |
-40 Cel |
TIN LEAD |
BOTTOM |
O-PBCY-T3 |
6 V |
100000 Write/Erase Cycles |
.0163 MHz |
Not Qualified |
10 ms |
1-WIRE |
256 bit |
2.8 V |
MICROLAN COMPATIBLE |
e0 |
||||||||||||||||||||||||||||||||
|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
4096 words |
5 |
3/5 |
1 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
6 V |
2.13 mm |
50000 Write/Erase Cycles |
.0163 MHz |
5.285 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e3 |
30 |
260 |
5.31 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
4096 words |
5 |
3/5 |
1 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
6 V |
2.13 mm |
50000 Write/Erase Cycles |
.0163 MHz |
5.285 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
5.31 mm |
||||||||||||||||||||||||||||||
|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
4096 words |
5 |
3/5 |
1 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G8 |
1 |
6 V |
2.13 mm |
50000 Write/Erase Cycles |
.0163 MHz |
5.285 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e3 |
30 |
260 |
5.31 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
4096 words |
5 |
3/5 |
1 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G8 |
1 |
6 V |
2.13 mm |
50000 Write/Erase Cycles |
.0163 MHz |
5.285 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
20 |
240 |
5.31 mm |
||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
ROUND |
METAL |
YES |
1 |
MOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
64 words |
3.3 |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
Other Memory ICs |
85 Cel |
64X1 |
64 |
-40 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
1 |
6 V |
Not Qualified |
1-WIRE |
64 bit |
2.8 V |
e0 |
15000 ns |
||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
64 words |
1 |
DISK BUTTON |
85 Cel |
64X1 |
64 |
-40 Cel |
MATTE TIN |
END |
O-MEDB-N2 |
6 V |
Not Qualified |
1-WIRE |
64 bit |
2.8 V |
e3 |
|||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
EEPROM |
COMMERCIAL EXTENDED |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1024 words |
3.3 |
1 |
DISK BUTTON |
85 Cel |
1KX1 |
1K |
-20 Cel |
MATTE TIN |
END |
O-MEDB-N2 |
5.25 V |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
e3 |
||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1024 words |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
SRAMs |
85 Cel |
1KX1 |
1K |
-20 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
1 |
5.25 V |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
e0 |
20 |
240 |
||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
3 |
ROUND |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
ASYNCHRONOUS |
4096 words |
5 |
3/5 |
1 |
CYLINDRICAL |
SIP3,.1,50 |
EEPROMs |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
MATTE TIN |
BOTTOM |
O-PBCY-T3 |
1 |
6 V |
50000 Write/Erase Cycles |
.0163 MHz |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e3 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
3 |
ROUND |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
ASYNCHRONOUS |
4096 words |
5 |
3/5 |
1 |
CYLINDRICAL |
SIP3,.1,50 |
EEPROMs |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
TIN LEAD |
BOTTOM |
O-PBCY-T3 |
1 |
6 V |
50000 Write/Erase Cycles |
.0163 MHz |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
245 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
6 V |
2.13 mm |
5.285 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
5.31 mm |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
262144 words |
3.3 |
1 |
DISK BUTTON |
85 Cel |
256KX1 |
256K |
-40 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
1 |
5.25 V |
Not Qualified |
1-WIRE |
262144 bit |
2.8 V |
e0 |
||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
7 mA |
262144 words |
3.3 |
3/5 |
1 |
DISK BUTTON |
BUTTON,.68IN |
EEPROMs |
10 |
85 Cel |
256KX1 |
256K |
-40 Cel |
MATTE TIN |
END |
O-MEDB-N2 |
5.25 V |
100000 Write/Erase Cycles |
Not Qualified |
1-WIRE |
262144 bit |
2.8 V |
e3 |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
ROUND |
METAL |
YES |
1 |
MOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
32 words |
5 |
3/5 |
8 |
DISK BUTTON |
BUTTON,.68IN |
EEPROMs |
85 Cel |
32X8 |
32 |
-40 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
1 |
6 V |
.0163 MHz |
Not Qualified |
1-WIRE |
256 bit |
2.8 V |
MICROLAN COMPATIBLE |
e0 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
4096 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
5.25 V |
1.75 mm |
3.9 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
9.9 mm |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
3 |
TO-92 |
ROUND |
PLASTIC/EPOXY |
NO |
1 |
MOS |
THROUGH-HOLE |
SERIAL |
ASYNCHRONOUS |
32 words |
5 |
3/5 |
8 |
CYLINDRICAL |
SIP3,.1,50 |
EEPROMs |
1.27 mm |
85 Cel |
32X8 |
32 |
-40 Cel |
TIN LEAD |
BOTTOM |
O-PBCY-T3 |
6 V |
100000 Write/Erase Cycles |
.0163 MHz |
Not Qualified |
10 ms |
1-WIRE |
256 bit |
2.8 V |
MICROLAN COMPATIBLE |
e0 |
||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
512 words |
8 |
DISK BUTTON |
85 Cel |
512X8 |
512 |
-40 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
1 |
6 V |
.0163 MHz |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
4096 words |
3 |
3/5 |
1 |
SMALL OUTLINE |
SOP16,.25 |
EEPROMs |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
5.25 V |
1.75 mm |
50000 Write/Erase Cycles |
3.9 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e3 |
30 |
260 |
9.9 mm |
|||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
1024 words |
5 |
3/5 |
1 |
SMALL OUTLINE |
SOC6,.17 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-C6 |
1 |
5.25 V |
1.5 mm |
50000 Write/Erase Cycles |
3.76 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
e0 |
3.94 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
1024 words |
3/5 |
1 |
SMALL OUTLINE |
SOC6,.17 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDSO-C6 |
1 |
5.25 V |
1.5 mm |
50000 Write/Erase Cycles |
3.937 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
e0 |
4.2926 mm |
|||||||||||||||||||||||||||||||
|
Maxim Integrated |
EEPROM |
1-WIRE |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
4096 words |
3 |
3/5 |
1 |
SMALL OUTLINE |
SOP16,.25 |
EEPROMs |
1.27 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
5.25 V |
1.75 mm |
50000 Write/Erase Cycles |
3.9 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
9.9 mm |
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Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
64 words |
3.3 |
1 |
DISK BUTTON |
85 Cel |
64X1 |
64 |
-40 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
6 V |
Not Qualified |
1-WIRE |
64 bit |
2.8 V |
e0 |
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Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
512 words |
5 |
8 |
GRID ARRAY |
85 Cel |
512X8 |
512 |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B6 |
6 V |
.864 mm |
1.91 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
2.85 mm |
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|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
4096 words |
5 |
3/5 |
1 |
CHIP CARRIER |
SURF MNT 2,.25SQ |
EEPROMs |
85 Cel |
4KX1 |
4K |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N2 |
6 V |
1 mm |
50000 Write/Erase Cycles |
6 mm |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e4 |
6 mm |
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Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
1024 words |
5 |
3/5 |
1 |
SMALL OUTLINE |
SOC6,.17 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
1KX1 |
1K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-C6 |
5.25 V |
1.5 mm |
50000 Write/Erase Cycles |
3.76 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
e0 |
20 |
240 |
3.94 mm |
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Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
C BEND |
SERIAL |
256 words |
3/5 |
4 |
SMALL OUTLINE |
SOC6,.17 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
256X4 |
256 |
-40 Cel |
DUAL |
R-PDSO-C6 |
50000 Write/Erase Cycles |
Not Qualified |
1024 bit |
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Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
LSOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
C BEND |
SERIAL |
ASYNCHRONOUS |
32 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE |
SOC6,.17 |
EEPROMs |
1.27 mm |
85 Cel |
32X8 |
32 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-C6 |
6 V |
1.5 mm |
100000 Write/Erase Cycles |
.0163 MHz |
3.76 mm |
Not Qualified |
10 ms |
1-WIRE |
256 bit |
2.8 V |
MICROLAN COMPATIBLE |
e0 |
3.94 mm |
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Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
512 words |
8 |
DISK BUTTON |
85 Cel |
512X8 |
512 |
-40 Cel |
TIN LEAD |
END |
O-MEDB-N2 |
1 |
6 V |
.0163 MHz |
Not Qualified |
1-WIRE |
4096 bit |
2.8 V |
e0 |
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|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
4096 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.95 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N6 |
1 |
1.89 V |
.8 mm |
3 mm |
1-WIRE |
4096 bit |
1.71 V |
e3 |
30 |
260 |
3 mm |
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Maxim Integrated |
EEPROM |
1-WIRE |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Maxim Integrated |
EEPROM |
OTHER |
5 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
128 words |
COMMON |
2.5 |
2.5/5 |
8 |
SMALL OUTLINE |
TSOP5/6,.11,37 |
Other Memory ICs |
.95 mm |
85 Cel |
128X8 |
128 |
-30 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
Not Qualified |
1-WIRE |
1024 bit |
2.2 V |
e3 |
15000 ns |
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Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.1242 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
20.828 mm |
250 ns |
5 |
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|
Maxim Integrated |
EEPROM |
INDUSTRIAL |
2 |
VBCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
BUTT |
SERIAL |
ASYNCHRONOUS |
1024 words |
3/5 |
1 |
CHIP CARRIER, VERY THIN PROFILE |
SURF MNT 2,.25SQ |
EEPROMs |
40 |
85 Cel |
1KX1 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
S-XBCC-B2 |
5.25 V |
1 mm |
50000 Write/Erase Cycles |
6 mm |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
MEMORY ORGANIZED AS FOUR PAGES OF 256 BITS |
e4 |
6 mm |
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|
Maxim Integrated |
EEPROM |
OTHER |
2 |
ROUND |
METAL |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1024 words |
1 |
DISK BUTTON |
85 Cel |
1KX1 |
1K |
-20 Cel |
MATTE TIN |
END |
O-MEDB-N2 |
5.25 V |
Not Qualified |
1-WIRE |
1024 bit |
2.8 V |
e3 |
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Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
GOLD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.81 mm |
12.195 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e4 |
200 ns |
5 |
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Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F32 |
5.5 V |
3.63 mm |
10.414 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
200 ns |
5 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
EEPROM |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDFP-F32 |
5.5 V |
3.1242 mm |
11.05 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
e0 |
20.828 mm |
150 ns |
5 |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.