Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
2GX8 |
2G |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
17179869184 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4294967296 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
34359738368 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
134217728 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
1073741824 bit |
2.7 V |
11 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
16K |
30 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
8K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.7 V |
512 |
NAND TYPE |
.00005 Amp |
18.4 mm |
45 ns |
3 |
NO |
||||||||||||||||||||||||
|
Toshiba |
EEPROM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
16777216 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
134217728 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16K |
30 mA |
33554432 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.71,20 |
Flash Memories |
.5 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
2K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
268435456 bit |
3 V |
512 |
NAND TYPE |
.0001 Amp |
18.4 mm |
35 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.25 V |
4.8 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
BULK ERASE; BLOCK ERASE |
e0 |
42 mm |
15000 ns |
5 |
||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
16K |
30 mA |
16777216 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
16MX8 |
16M |
0 Cel |
1K |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
134217728 bit |
2.7 V |
512 |
e0 |
NAND TYPE |
.00005 Amp |
18.4 mm |
45 ns |
3 |
NO |
||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
2.3 |
2/5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
EEPROMs |
10 |
.5 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
TIN LEAD |
1010XXXR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
.8 mm |
100000 Write/Erase Cycles |
.4 MHz |
2 mm |
Not Qualified |
12 ms |
I2C |
1024 bit |
1.8 V |
e0 |
.000005 Amp |
2.3 mm |
|||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.25 V |
5.2 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.75 V |
LG-MAX |
e0 |
37.7 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||
Toshiba |
EEPROM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
8 |
SMALL OUTLINE |
256X8 |
256 |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G8 |
5.5 V |
Not Qualified |
2048 bit |
1.8 V |
e0 |
3 |
||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
8388608 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
70 Cel |
8MX16 |
8M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
134217728 bit |
2.7 V |
e0 |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.7 V |
2K |
NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1.5 mA |
64 words |
2.3 |
2/3.3 |
16 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
EEPROMs |
10 |
.5 mm |
85 Cel |
64X16 |
64 |
-40 Cel |
TIN LEAD |
DUAL |
SOFTWARE |
R-PDSO-G8 |
3.6 V |
.9 mm |
100000 Write/Erase Cycles |
2 MHz |
2 mm |
Not Qualified |
3-WIRE |
1024 bit |
1.8 V |
e0 |
.000002 Amp |
2.3 mm |
|||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
40 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8K |
30 mA |
8388608 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.36,32 |
Flash Memories |
.8 mm |
70 Cel |
8MX8 |
8M |
0 Cel |
1K |
YES |
YES |
DUAL |
R-PDSO-G40 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
512 |
NAND TYPE |
.0001 Amp |
18.41 mm |
35 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16K |
20 mA |
67108864 words |
3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
536870912 bit |
2.7 V |
512 |
NAND TYPE |
.00005 Amp |
20 mm |
40 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
67 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1073741824 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
BOTTOM |
R-PBGA-B67 |
3.6 V |
1 mm |
6.5 mm |
8589934592 bit |
2.7 V |
8 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
40 |
TSOP2-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
5.25 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.75 V |
ORGANIZATION : MEMORY CELL ARRAY = 264X8KX8 |
e0 |
18.41 mm |
5 |
||||||||||||||||||||||||||||||||||
Toshiba |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
22 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
33554432 words |
3.3 |
8 |
UNCASED CHIP |
2.54 mm |
55 Cel |
32MX8 |
32M |
0 Cel |
UPPER |
R-XUUC-N22 |
3.6 V |
.84 mm |
37 mm |
Not Qualified |
268435456 bit |
3 V |
45 mm |
3 |
||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
22 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
134217728 words |
3.3 |
8 |
UNCASED CHIP |
2.54 mm |
55 Cel |
128MX8 |
128M |
0 Cel |
UPPER |
R-XUUC-N22 |
3.6 V |
.84 mm |
37 mm |
Not Qualified |
1073741824 bit |
3 V |
45 mm |
3 |
||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
16K |
30 mA |
67108864 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
536870912 bit |
2.7 V |
512 |
NAND TYPE |
.0001 Amp |
18.4 mm |
35 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
40 |
TSOP2-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
5.25 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.75 V |
BULK ERASE; BLOCK ERASE |
e0 |
18.41 mm |
15000 ns |
5 |
||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
10 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
40 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
4194304 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
3-STATE |
4MX8 |
4M |
0 Cel |
DUAL |
R-PDSO-G40 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
33554432 bit |
3 V |
18.41 mm |
35 ns |
3 |
||||||||||||||||||||||||||||||||||||
Toshiba |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
-10 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
5.3 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
37 mm |
170 ns |
12 |
||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
268435456 bit |
2.7 V |
18.4 mm |
3 |
||||||||||||||||||||||||||||||||||||||
Toshiba |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Toshiba |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Toshiba |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Toshiba |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
22 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
16777216 words |
3.3 |
8 |
UNCASED CHIP |
2.54 mm |
55 Cel |
16MX8 |
16M |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N22 |
3.6 V |
.84 mm |
37 mm |
Not Qualified |
134217728 bit |
3 V |
e0 |
45 mm |
3 |
||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
128K |
30 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
512MX8 |
512M |
0 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
10 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
3 |
NO |
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Toshiba |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
-10 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
5.3 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
37 mm |
200 ns |
12 |
||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
-10 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
5.5 V |
2.7 mm |
8.8 mm |
Not Qualified |
262144 bit |
4.5 V |
BULK ERASE |
e0 |
18.5 mm |
250 ns |
12 |
|||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
67 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B67 |
3.6 V |
1 mm |
6.5 mm |
1073741824 bit |
2.7 V |
8 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
150 ns |
5 |
||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
256 words |
8 |
SMALL OUTLINE |
256X8 |
256 |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G8 |
5.5 V |
Not Qualified |
2048 bit |
2.7 V |
e0 |
3 |
||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16K |
30 mA |
67108864 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
64MX8 |
64M |
0 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
536870912 bit |
3 V |
512 |
NAND TYPE |
.0001 Amp |
18.4 mm |
35 ns |
3 |
NO |
||||||||||||||||||||||||
Toshiba |
EEPROM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
-10 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
5.5 V |
2.7 mm |
8.8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
18.5 mm |
170 ns |
12 |
||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2147483648 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10 mm |
17179869184 bit |
1.7 V |
11 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
EEPROM |
OTHER |
8 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
128 words |
3 |
8 |
SMALL OUTLINE, SHRINK PITCH |
.5 mm |
70 Cel |
128X8 |
128 |
-30 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
3.6 V |
1 MHz |
2 mm |
Not Qualified |
3-WIRE |
1024 bit |
2.7 V |
e0 |
2.3 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.