Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor |
UVPROM |
MILITARY |
24 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
120 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.3 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
1 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS |
e0 |
.12 Amp |
31.877 mm |
12 ns |
12.5 |
||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
150 ns |
12.5 |
||||||||
|
Nte Electronics |
UVPROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
160 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
DUAL |
R-XDIP-T24 |
5.25 V |
Not Qualified |
16384 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
350 ns |
25 |
||||||||||||
|
Intel |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
SERIAL |
SYNCHRONOUS |
30 mA |
440800 words |
3.3 |
3.3/5 |
1 |
CHIP CARRIER |
LCC20,.39SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
440800X1 |
440800 |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
440800 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e3 |
.00006 Amp |
8.9662 mm |
3.3 |
||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0002 Amp |
36.92 mm |
150 ns |
12.75 |
||||||||
Rochester Electronics |
UVPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
5.588 mm |
15.24 mm |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
37.1475 mm |
120 ns |
||||||||||||||||||
Spansion |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
5.588 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
37.1475 mm |
150 ns |
|||||||||||||||||||
National Semiconductor |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.25 V |
5.715 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.75 V |
e0 |
.0001 Amp |
150 ns |
13 |
||||||||||
National Semiconductor |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.0001 Amp |
200 ns |
13 |
||||||||||
National Semiconductor |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.0001 Amp |
150 ns |
13 |
||||||||||
Rochester Electronics |
UVPROM |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
8 |
IN-LINE |
2.54 mm |
16KX8 |
16K |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.08 mm |
15.24 mm |
131072 bit |
4.5 V |
e0 |
37.084 mm |
200 ns |
|||||||||||||||||||||
Intel |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
100 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
131072 bit |
e0 |
150 ns |
12.5 |
|||||||||||||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
100 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
131072 bit |
e0 |
250 ns |
12.5 |
||||||||||||||||||
Intel |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
131072 bit |
4.75 V |
e0 |
37.15 mm |
200 ns |
12.5 |
||||||||||
Intel |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
131072 bit |
4.5 V |
e0 |
37.15 mm |
200 ns |
12.5 |
||||||||||
Cypress Semiconductor |
UVPROM |
COMMERCIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.3 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
POWER SWITCHED PROM |
e0 |
.04 Amp |
31.877 mm |
20 ns |
|||||||||
Cypress Semiconductor |
UVPROM |
COMMERCIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.3 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
POWER SWITCHED PROM |
e0 |
.04 Amp |
31.877 mm |
20 ns |
|||||||||
National Semiconductor |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
250 ns |
12.5 |
|||||||||||||||||||
Nte Electronics |
UVPROM |
COMMERCIAL |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
IN-LINE |
70 Cel |
4KX8 |
4K |
0 Cel |
DUAL |
R-XDIP-T24 |
5.25 V |
Not Qualified |
32768 bit |
4.75 V |
300 ns |
||||||||||||||||||||||||
Nte Electronics |
UVPROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
70 Cel |
3-STATE |
1KX8 |
1K |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T24 |
5.25 V |
Not Qualified |
8192 bit |
4.75 V |
e0 |
450 ns |
|||||||||||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE |
70 Cel |
64KX8 |
64K |
0 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
70 ns |
||||||||||||||||||||||
Intel |
CONFIGURATION MEMORY |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
50 mA |
1695680 words |
3.3 |
3.3/5 |
1 |
FLATPACK, THIN PROFILE |
TQFP32,.35SQ,32 |
Flash Memories |
.8 mm |
70 Cel |
3-STATE |
1695680X1 |
1695680 |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-PQFP-G32 |
3 |
3.6 V |
1.2 mm |
7 mm |
Not Qualified |
1695680 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e0 |
30 |
235 |
.0001 Amp |
7 mm |
3.3 |
||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T32 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
245 |
.0001 Amp |
41.885 mm |
100 ns |
||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T32 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
.0001 Amp |
41.885 mm |
100 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T40 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
.0001 Amp |
52.195 mm |
100 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T40 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
245 |
.0001 Amp |
52.195 mm |
120 ns |
||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T40 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
e3 |
.0001 Amp |
52.195 mm |
45 ns |
|||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
40 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
262144 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T40 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
e3 |
.0001 Amp |
52.195 mm |
80 ns |
|||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
70 Cel |
8KX8 |
8K |
0 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
65536 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
20 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
.0001 Amp |
250 ns |
12.5 |
|||||||||||||||||
|
STMicroelectronics |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-CDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
200 ns |
12.5 |
||||||||
Nte Electronics |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
DUAL |
R-PDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
65536 bit |
4.5 V |
LG-MAX; IT ALSO OPERATES AT 6 V NOMINAL SUPPLY VOLTAGE PROGRAMMING MODE |
37.34 mm |
150 ns |
|||||||||||||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
5.588 mm |
15.24 mm |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
42.1005 mm |
90 ns |
||||||||||||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-CDIP-T32 |
5.5 V |
5.588 mm |
15.24 mm |
1048576 bit |
4.5 V |
e0 |
42.1005 mm |
90 ns |
||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
SERIAL |
SYNCHRONOUS |
50 mA |
1046496 words |
3.3 |
3.3/5 |
1 |
CHIP CARRIER |
LCC20,.39SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
1046496X1 |
1046496 |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
3 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
1046496 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e3 |
30 |
245 |
.0001 Amp |
8.9662 mm |
3.3 |
||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T32 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.75 V |
e3 |
245 |
.0001 Amp |
41.885 mm |
80 ns |
||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
36.92 mm |
150 ns |
||||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
200 ns |
12.5 |
||||||||
|
STMicroelectronics |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-CDIP-T28 |
5.5 V |
5.97 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.0001 Amp |
36.92 mm |
250 ns |
12.5 |
||||||||
Intel |
UVPROM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
30 mA |
8192 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N32 |
Not Qualified |
65536 bit |
e0 |
.00014 Amp |
250 ns |
12.5 |
||||||||||||||||
|
Macronix |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Macronix |
|||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
131072 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
120 ns |
13 |
||||||||||
Renesas Electronics |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
524288 bit |
e0 |
150 ns |
||||||||||||||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCJ |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LDCC32,.5X.6 |
EPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
QUAD |
R-CQCC-J32 |
5.5 V |
4.06 mm |
11.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.0002 Amp |
13.945 mm |
35 ns |
12.75 |
|||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
32 |
WQCCJ |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER, WINDOW |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
QUAD |
R-CQCC-J32 |
5.5 V |
4.06 mm |
11.24 mm |
Not Qualified |
262144 bit |
4.5 V |
13.945 mm |
45 ns |
|||||||||||||||||||
STMicroelectronics |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.3 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.0002 Amp |
37.085 mm |
45 ns |
12.75 |
|||||||||
STMicroelectronics |
UVPROM |
MILITARY |
32 |
WQCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
133 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER, WINDOW |
LCC32,.45X.55 |
EPROMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
3.3 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.0005 Amp |
13.97 mm |
55 ns |
12.5 |
EPROM, or Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can be programmed and erased multiple times. EPROM was commonly used in computer systems and electronic devices in the 1970s and 1980s, but has largely been replaced by more advanced memory technologies.
EPROM works by storing data in a grid of memory cells that can be individually programmed and erased using ultraviolet light. Each memory cell consists of a transistor and a floating gate. To program the memory cell, a high voltage is applied to the transistor, which charges the floating gate. To erase the memory cell, ultraviolet light is applied to the chip, which removes the charge from the floating gate. The programming and erasing process can be repeated multiple times, making EPROM a reprogrammable memory technology.
EPROM has several advantages over other types of computer memory, such as ROM and RAM. EPROM can be reprogrammed multiple times, which makes it a versatile and flexible memory technology. EPROM is also non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware.