Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Atmel |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-CDIP-T28 |
5.5 V |
Not Qualified |
131072 bit |
4.5 V |
e0 |
.0001 Amp |
120 ns |
12.5 |
||||||||||||
Cypress Semiconductor |
UVPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
150 ns |
||||||||||||||||||||||
Cypress Semiconductor |
UVPROM |
COMMERCIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.715 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
POWER SWITCHED PROM |
e0 |
.03 Amp |
31.877 mm |
45 ns |
|||||||||
Cypress Semiconductor |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
120 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
Not Qualified |
524288 bit |
4.5 V |
PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE |
e0 |
15 ns |
|||||||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
100 mA |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
32768 bit |
e0 |
200 ns |
21 |
||||||||||||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
75 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
250 ns |
12.5 |
||||||||||||||||||
Rochester Electronics |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
e0 |
.0001 Amp |
250 ns |
12.75 |
|||||||||||||||||
Intel |
CONFIGURATION MEMORY |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
SERIAL |
SYNCHRONOUS |
30 mA |
440800 words |
3.3 |
3.3/5 |
1 |
CHIP CARRIER |
LDCC20,.4SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
440800X1 |
440800 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
1 |
3.6 V |
4.572 mm |
8.9662 mm |
Not Qualified |
440800 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e0 |
.00006 Amp |
8.9662 mm |
3.3 |
||||||||||
Intel |
CONFIGURATION MEMORY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
50 mA |
1046496 words |
3.3 |
5 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
1046496X1 |
1046496 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
1 |
3.6 V |
4.318 mm |
7.62 mm |
Not Qualified |
1046496 bit |
3 V |
IT ALSO REQUIRES 5V NOMINAL SUPPLY |
e0 |
.0001 Amp |
9.398 mm |
3.3 |
||||||||||
Fujitsu |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
524288 bit |
e0 |
.0001 Amp |
250 ns |
|||||||||||||||||||
Motorola |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
4096 words |
COMMON |
8 |
IN-LINE |
DIP24,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
32768 bit |
e0 |
450 ns |
|||||||||||||||||||||||
National Semiconductor |
UVPROM |
COMMERCIAL |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T32 |
5.5 V |
5.969 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.0001 Amp |
120 ns |
|||||||||||
National Semiconductor |
UVPROM |
INDUSTRIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
40 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.0001 Amp |
120 ns |
12.75 |
||||||||||
National Semiconductor |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
40 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T28 |
5.5 V |
5.715 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
.0001 Amp |
150 ns |
|||||||||||
National Semiconductor |
UVPROM |
INDUSTRIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T24 |
5.5 V |
5.969 mm |
15.24 mm |
Not Qualified |
32768 bit |
4.5 V |
TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS |
e0 |
.0001 Amp |
200 ns |
||||||||||
Intel |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.75 V |
e0 |
37.15 mm |
250 ns |
12.5 |
||||||||||
Toshiba |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.25 V |
5.2 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.75 V |
e0 |
170 ns |
||||||||||||
Microchip Technology |
EPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
25 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
4.83 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
DATA RETENTION >200 YEARS |
e0 |
.0001 Amp |
36.32 mm |
100 ns |
5 |
||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.25 V |
4.907 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
250 ns |
13 |
||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
125 Cel |
64KX8 |
64K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.588 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
37.1475 mm |
150 ns |
|||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
36.83 mm |
250 ns |
||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
8 |
IN-LINE |
125 Cel |
3-STATE |
16KX8 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
5.5 V |
Not Qualified |
131072 bit |
4.5 V |
e0 |
200 ns |
||||||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.00025 Amp |
150 ns |
||||||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.00025 Amp |
200 ns |
||||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
COMMON |
5 |
5 |
16 |
IN-LINE, WINDOW |
DIP40,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-55 Cel |
DUAL |
R-GDIP-T40 |
5.5 V |
4.907 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
120 ns |
||||||||||||
Texas Instruments |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
250 ns |
13 |
||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-55 Cel |
DUAL |
R-GDIP-T32 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
41.91 mm |
200 ns |
||||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.84 mm |
15.24 mm |
Not Qualified |
524288 bit |
200 ns |
|||||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
125 Cel |
64KX8 |
64K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.588 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
37.1475 mm |
200 ns |
|||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.00025 Amp |
170 ns |
||||||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.84 mm |
15.24 mm |
Not Qualified |
524288 bit |
200 ns |
|||||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
25 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
16KX8 |
16K |
-55 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
131072 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
36.83 mm |
250 ns |
12.5 |
||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.588 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.0003 Amp |
37.1475 mm |
150 ns |
12.5 |
||||||||
Texas Instruments |
UVPROM |
MILITARY |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
60 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-55 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
7.493 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
120 ns |
||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
25 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.0003 Amp |
250 ns |
12.5 |
||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
25 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
36.83 mm |
250 ns |
12.5 |
||||||||
Texas Instruments |
UVPROM |
MILITARY |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
IN-LINE, WINDOW |
2.54 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-55 Cel |
DUAL |
R-GDIP-T40 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
52.07 mm |
300 ns |
||||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.00025 Amp |
120 ns |
13 |
||||||||||||||||
Texas Instruments |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
25 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.0003 Amp |
150 ns |
12.5 |
|||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T32 |
5.5 V |
7.493 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
|||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
32 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
60 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-55 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
7.493 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
200 ns |
||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
25 mA |
16384 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
16KX8 |
16K |
-55 Cel |
DUAL |
R-CDIP-T28 |
5.25 V |
4.91 mm |
15.24 mm |
Not Qualified |
131072 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
36.83 mm |
120 ns |
12.5 |
||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.84 mm |
15.24 mm |
Not Qualified |
524288 bit |
250 ns |
|||||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
60 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
64KX8 |
64K |
-55 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000325 Amp |
250 ns |
||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
300 ns |
|||||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.84 mm |
15.24 mm |
Not Qualified |
524288 bit |
300 ns |
|||||||||||||||||||||
Texas Instruments |
UVPROM |
COMMERCIAL |
28 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-GDIP-T28 |
5.84 mm |
15.24 mm |
Not Qualified |
524288 bit |
250 ns |
|||||||||||||||||||||
Texas Instruments |
UVPROM |
MILITARY |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP32,.6 |
EPROMs |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-55 Cel |
DUAL |
R-GDIP-T32 |
5.5 V |
4.91 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
41.91 mm |
300 ns |
EPROM, or Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can be programmed and erased multiple times. EPROM was commonly used in computer systems and electronic devices in the 1970s and 1980s, but has largely been replaced by more advanced memory technologies.
EPROM works by storing data in a grid of memory cells that can be individually programmed and erased using ultraviolet light. Each memory cell consists of a transistor and a floating gate. To program the memory cell, a high voltage is applied to the transistor, which charges the floating gate. To erase the memory cell, ultraviolet light is applied to the chip, which removes the charge from the floating gate. The programming and erasing process can be repeated multiple times, making EPROM a reprogrammable memory technology.
EPROM has several advantages over other types of computer memory, such as ROM and RAM. EPROM can be reprogrammed multiple times, which makes it a versatile and flexible memory technology. EPROM is also non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware.