Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | Cycle Time | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
14 MHz |
3.9 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
30 |
260 |
YES |
9.9 mm |
600 ns |
||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.25 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
14 MHz |
3.9 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
30 |
260 |
YES |
9.9 mm |
600 ns |
||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
FIFOs |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
2 mm |
33 MHz |
5.3 mm |
Not Qualified |
64 bit |
2 V |
e4 |
30 |
260 |
YES |
6.2 mm |
600 ns |
||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
71.428 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
6 V |
4.7 mm |
14 MHz |
7.62 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
21.6 mm |
600 ns |
|||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
71.428 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDIP-T16 |
6 V |
4.7 mm |
14 MHz |
7.62 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
30 |
260 |
YES |
21.6 mm |
600 ns |
|||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
2/6 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
FIFOs |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.1 mm |
33 MHz |
4.4 mm |
Not Qualified |
64 bit |
2 V |
e4 |
30 |
260 |
YES |
5 mm |
600 ns |
||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.1 mm |
4.4 mm |
Not Qualified |
64 bit |
2 V |
e4 |
30 |
260 |
YES |
5 mm |
600 ns |
|||||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
2/6 |
4 |
SMALL OUTLINE |
SOP16,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
2.65 mm |
12 MHz |
7.5 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
98 ns |
|||||||
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
2.65 mm |
7.5 mm |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
YES |
10.3 mm |
98 ns |
|||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
64 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
9.9 mm |
120 ns |
||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.1 mm |
4.4 mm |
Not Qualified |
64 bit |
2 V |
e4 |
YES |
5 mm |
600 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
64 words |
5 |
9 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X9 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
6 V |
2.65 mm |
7.5 mm |
Not Qualified |
576 bit |
2 V |
e4 |
YES |
17.9 mm |
520 ns |
|||||||||||||||
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
DUAL |
R-PDSO-G16 |
5.5 V |
2.65 mm |
7.5 mm |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
YES |
10.3 mm |
108 ns |
|||||||||||||||||||
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
2.65 mm |
7.5 mm |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
YES |
10.3 mm |
98 ns |
|||||||||||||||||||
NXP Semiconductors |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
40 ns |
1 |
TTL |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
16X5 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
80 bit |
4.5 V |
YES |
12.8 mm |
22 ns |
||||||||||||||||||
NXP Semiconductors |
COMMERCIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TTL |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
DUAL |
R-PDSO-G16 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
64 bit |
4.5 V |
YES |
10.3 mm |
||||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
108 ns |
|||||||||||||||
NXP Semiconductors |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
5.5 V |
4.06 mm |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
YES |
26.695 mm |
||||||||||||||||||||
NXP Semiconductors |
AUTOMOTIVE |
UNSPECIFIED |
UNSPECIFIED |
YES |
71.428 ns |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
64 words |
5 |
9 |
UNCASED CHIP |
125 Cel |
64X9 |
64 |
-40 Cel |
UPPER |
X-XUUC-N |
6 V |
Not Qualified |
576 bit |
2 V |
YES |
520 ns |
|||||||||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
71.428 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
64 words |
5 |
9 |
IN-LINE |
2.54 mm |
125 Cel |
64X9 |
64 |
-40 Cel |
TIN |
DUAL |
R-PDIP-T28 |
6 V |
5.1 mm |
15.24 mm |
Not Qualified |
576 bit |
2 V |
e3 |
YES |
35.5 mm |
520 ns |
||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
2 mm |
5.3 mm |
Not Qualified |
64 bit |
4.5 V |
e4 |
YES |
6.2 mm |
120 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
64 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
9.9 mm |
120 ns |
||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
71.428 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
6 V |
4.7 mm |
7.62 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
21.6 mm |
600 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
4 |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
2 mm |
5.3 mm |
Not Qualified |
64 bit |
2 V |
e4 |
YES |
6.2 mm |
600 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
4 |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
2 mm |
5.3 mm |
Not Qualified |
64 bit |
2 V |
e4 |
YES |
6.2 mm |
600 ns |
|||||||||||||||
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
DUAL |
R-PDSO-G16 |
5.5 V |
2.65 mm |
7.5 mm |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
YES |
10.3 mm |
108 ns |
|||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
100 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.7 mm |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
21.6 mm |
120 ns |
|||||||||||||||
NXP Semiconductors |
COMMERCIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
DUAL |
R-PDIP-T16 |
5.5 V |
4.06 mm |
7.62 mm |
Not Qualified |
64 bit |
4.5 V |
YES |
19.09 mm |
||||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
108 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
64 words |
5 |
9 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X9 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
576 bit |
e4 |
YES |
17.9 mm |
117 ns |
|||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.1 mm |
4.4 mm |
Not Qualified |
64 bit |
2 V |
e4 |
YES |
5 mm |
600 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
64 words |
5 |
9 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X9 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
576 bit |
e4 |
YES |
17.9 mm |
117 ns |
|||||||||||||||||
NXP Semiconductors |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
40 ns |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
16X5 |
16 |
0 Cel |
DUAL |
R-PDIP-T20 |
5.5 V |
4.2 mm |
7.62 mm |
Not Qualified |
80 bit |
4.5 V |
YES |
26.73 mm |
22 ns |
||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
64 words |
5 |
9 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X9 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
6 V |
2.65 mm |
7.5 mm |
Not Qualified |
576 bit |
2 V |
e4 |
YES |
17.9 mm |
520 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
9.9 mm |
600 ns |
||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
71.428 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
4.5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
64 bit |
2 V |
REGISTER BASED; BUBBLE BACK 750NS |
e4 |
YES |
9.9 mm |
600 ns |
||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
6 V |
4.7 mm |
7.62 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
21.6 mm |
98 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
100 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
16X4 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
2 mm |
5.3 mm |
Not Qualified |
64 bit |
4.5 V |
e4 |
YES |
6.2 mm |
120 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.7 mm |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
21.6 mm |
108 ns |
|||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
6 V |
2.65 mm |
7.5 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
98 ns |
|||||||||||||||
NXP Semiconductors |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
40 ns |
1 |
TTL |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
5 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
16X5 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
80 bit |
4.5 V |
YES |
12.8 mm |
22 ns |
||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
100 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
64 words |
5 |
9 |
IN-LINE |
2.54 mm |
125 Cel |
64X9 |
64 |
-40 Cel |
TIN |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
576 bit |
e3 |
YES |
35.5 mm |
117 ns |
||||||||||||||||||
NXP Semiconductors |
COMMERCIAL |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TTL |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
64 bit |
4.5 V |
YES |
12.8 mm |
||||||||||||||||||||
|
NXP Semiconductors |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
83.33 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
6 V |
2.65 mm |
7.5 mm |
Not Qualified |
256 bit |
2 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
10.3 mm |
98 ns |
|||||||||||||||
NXP Semiconductors |
AUTOMOTIVE |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
5 |
SMALL OUTLINE |
125 Cel |
64X5 |
64 |
-40 Cel |
DUAL |
R-PDSO-G20 |
6 V |
Not Qualified |
320 bit |
2 V |
YES |
|||||||||||||||||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
83.33 ns |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1 mA |
64 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
FIFOs |
2.54 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.7 mm |
12 MHz |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 2.7US |
e4 |
YES |
21.6 mm |
108 ns |
||||||||
NXP Semiconductors |
AUTOMOTIVE |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
9 |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
64X9 |
64 |
-40 Cel |
DUAL |
R-PDSO-G28 |
6 V |
2 mm |
5.3 mm |
Not Qualified |
576 bit |
2 V |
YES |
10.2 mm |
|||||||||||||||||||||
|
NXP Semiconductors |
OTHER FIFO |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
116.28 ns |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64 words |
5 |
5 |
9 |
SMALL OUTLINE |
SOP28,.4 |
FIFOs |
1.27 mm |
125 Cel |
3-STATE |
64X9 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
2.65 mm |
10 MHz |
7.5 mm |
Not Qualified |
576 bit |
4.5 V |
REGISTER BASED; BUBBLE BACK 3US |
e4 |
260 |
YES |
17.9 mm |
117 ns |
FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.
FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.
FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.
One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.