Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.41 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
8388608 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
67108864 bit |
2.7 V |
e4 |
.0001 Amp |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.29 mm |
SPI |
134217728 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.00005 Amp |
5.29 mm |
3 |
|||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1073741824 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 V |
2.65 mm |
166 MHz |
7.5 mm |
1073741824 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
268435456 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.3 mm |
133 MHz |
7.5 mm |
268435456 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
SPI |
512753664 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0003 Amp |
10.3 mm |
3 |
||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.64 mm |
100000 Write/Erase Cycles |
133 MHz |
7.49 mm |
SPI |
134217728 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00006 Amp |
10.31 mm |
3.3 |
||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.29 mm |
SPI |
134217728 bit |
2.7 V |
NOR TYPE |
.00005 Amp |
5.29 mm |
3 |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
50 MHz |
7.5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
2.7 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1073741824 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
1073741824 bit |
2.7 V |
30 |
260 |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.64 mm |
100000 Write/Erase Cycles |
133 MHz |
7.49 mm |
SPI |
268435456 bit |
3 V |
ALSO OPERATES AT 104MHZ AT 2.7-3.0V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
10.31 mm |
3.3 |
||||||||||||||||||||||||
|
Micron Technology |
FLASH |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
268435456 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
SPI |
268435456 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.000035 Amp |
10.3 mm |
3 |
||||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
268435456 words |
3.3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
256MX1 |
256M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
20 MHz |
7.5 mm |
Not Qualified |
8 ms |
268435456 bit |
2.7 V |
e4 |
40 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
67108864 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
DUAL |
HARDWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
536870912 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
536870912 bit |
2.7 V |
30 |
260 |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||||
|
Micron Technology |
FLASH |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
55 mA |
1073741824 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
SPI |
BOTTOM/TOP |
1073741824 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.00006 Amp |
10.3 mm |
3 |
|||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
SPI |
512753664 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0003 Amp |
10.3 mm |
3 |
||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
200 mA |
134217728 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
SPI |
1073741824 bit |
2.7 V |
e3 |
260 |
NOR TYPE |
.0002 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.64 mm |
133 MHz |
7.49 mm |
268435456 bit |
2.7 V |
10.31 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
104 MHz |
7.5 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
e3 |
NOR TYPE |
.000045 Amp |
10.3 mm |
3 |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
50 MHz |
7.5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
10.3 mm |
2.7 |
|||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
105 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
1073741824 bit |
2.7 V |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
128MX4 |
128M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
166 MHz |
7.52 mm |
536870912 bit |
2.7 V |
ALSO CONFIGURED WITH 1-BIT WIDTH |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 V |
2.65 mm |
166 MHz |
7.5 mm |
134217728 bit |
1.7 V |
10.3 mm |
1.8 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
SPI |
512753664 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0003 Amp |
10.3 mm |
3 |
||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
16 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
105 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.29 mm |
SPI |
134217728 bit |
2.7 V |
NOR TYPE |
.00008 Amp |
5.29 mm |
3 |
||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.64 mm |
100000 Write/Erase Cycles |
133 MHz |
7.49 mm |
SPI |
67108864 bit |
3 V |
IT ALSO OPERATES AT 2.7V @ 104MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
10.31 mm |
3.3 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
268435456 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
108 MHz |
7.5 mm |
Not Qualified |
8 ms |
SPI |
268435456 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
50 MHz |
7.5 mm |
Not Qualified |
15 ms |
SPI |
16777216 bit |
2.7 V |
e4 |
NOR TYPE |
.00001 Amp |
10.3 mm |
2.7 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
16777216 words |
3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
20 |
1.27 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.52 mm |
SPI |
67108864 bit |
2.65 V |
ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
10.3 mm |
3 |
|||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
8388608 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
50 MHz |
7.5 mm |
Not Qualified |
15 ms |
SPI |
67108864 bit |
2.7 V |
10 |
260 |
NOR TYPE |
.00005 Amp |
10.3 mm |
2.7 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
536870912 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
512MX1 |
512M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
536870912 bit |
2.7 V |
30 |
260 |
NOR TYPE |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
SPI |
512753664 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0003 Amp |
10.3 mm |
3 |
||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
104 MHz |
7.5 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
NOR TYPE |
.000045 Amp |
10.3 mm |
3 |
||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
125 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
500 ms |
268435456 bit |
2.7 V |
ALSO CONFIGURABLE AS 256M X 1 |
e3 |
10.3 mm |
3 |
|||||||||||||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
134217728 bit |
2.7 V |
e4 |
20 |
260 |
.0001 Amp |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.