Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
14 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.28 mm |
4-WIRE |
134217728 bit |
2.7 V |
.000065 Amp |
5.28 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.285 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
5.285 mm |
3 |
|||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
|||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
4194304 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
50 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
e3 |
NOR TYPE |
.00003 Amp |
4.9 mm |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
86 MHz |
3.9 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
4.9 mm |
3 |
||||||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
524288 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
70 Cel |
3-STATE |
512KX1 |
512K |
0 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
33 MHz |
3.9 mm |
Not Qualified |
SPI |
524288 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000015 Amp |
4.9 mm |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
1.8 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
2.16 mm |
80 MHz |
5.23 mm |
67108864 bit |
1.65 V |
ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
5.28 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
8 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
50 mA |
33554432 words |
3 |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
125 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
.00006 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
2 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.23 mm |
SPI |
67108864 bit |
2.65 V |
ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT |
NOR TYPE |
.00002 Amp |
5.28 mm |
3.3 |
|||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
1.8 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
.5 mm |
85 Cel |
4MX4 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
80 MHz |
2 mm |
16777216 bit |
1.65 V |
IT IS ALSO CONFIGURED AS 16M X 1 |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
536870912 words |
1.8 |
1 |
SMALL OUTLINE |
85 Cel |
512MX1 |
512M |
-40 Cel |
DUAL |
R-PDSO-N8 |
2 V |
166 MHz |
536870912 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
1.8 |
|||||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
2097152 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
80 MHz |
3.9 mm |
SPI |
16777216 bit |
2.3 V |
ALSO IT CAN BE CONFIGURED AS 8M X 2 BIT |
NOR TYPE |
.00005 Amp |
4.9 mm |
3 |
||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
1048576 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
8388608 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00006 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
1048576 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
33 MHz |
3.9 mm |
Not Qualified |
SPI |
1048576 bit |
2.7 V |
e3 |
10 |
260 |
NOR TYPE |
.000015 Amp |
4.9 mm |
||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
1 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
134217728 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
6 mm |
1.8 |
||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
10 mA |
2097152 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 |
.5 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
80 MHz |
2 mm |
16777216 bit |
1.65 V |
IT IS ALSO CONFIGURED AS 16M X 1 |
NOR TYPE |
.000000035 Amp |
3 mm |
1.8 |
||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
1048576 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
1MX1 |
1M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
33 MHz |
3.9 mm |
Not Qualified |
SPI |
1048576 bit |
2.7 V |
e3 |
10 |
260 |
NOR TYPE |
.000015 Amp |
4.9 mm |
||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
8388608 words |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.23 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1.95 V |
1.75 mm |
100000 Write/Erase Cycles |
40 MHz |
3.9 mm |
SPI |
8388608 bit |
1.65 V |
e3 |
NOR TYPE |
.00001 Amp |
4.9 mm |
1.8 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.41 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
TOTEM POLE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.285 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
5.285 mm |
3 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
2 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.23 mm |
SPI |
33554432 bit |
2.65 V |
ALSO IT CAN BE CONFIGURED AS 32M X 1 BIT |
NOR TYPE |
.00002 Amp |
5.28 mm |
3 |
|||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18.5 mA |
4194304 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
SPI |
4194304 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
4.925 mm |
3 |
|||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
4194304 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
104 MHz |
3.9 mm |
SPI |
4194304 bit |
2.5 V |
NOR TYPE |
.000025 Amp |
4.925 mm |
3 |
|||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
SPI |
33554432 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.000025 Amp |
4.925 mm |
3 |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
120 MHz |
6 mm |
SPI |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
|||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.285 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
5.285 mm |
3 |
|||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
40 mA |
67108864 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
3 V |
ALSO OPERATES AT 2.7VMIN @104MHZ |
NOR TYPE |
.00006 Amp |
8 mm |
3.3 |
|||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
1.8/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
133 MHz |
3.9 mm |
Not Qualified |
SPI |
8388608 bit |
2.3 V |
IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE |
e4 |
NOR TYPE |
.00004 Amp |
4.925 mm |
3 |
||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
DUAL |
HARDWARE |
R-XDSO-N8 |
3 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
66 MHz |
6 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
ORGANIZED AS 8192 PAGES OF 1056 BYTES EACH |
e4 |
40 |
260 |
NOR TYPE |
.000015 Amp |
8 mm |
2.7 |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
4194304 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.75 mm |
10000 Write/Erase Cycles |
50 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
4.9 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.03 mm |
100000 Write/Erase Cycles |
104 MHz |
5.25 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000045 Amp |
5.26 mm |
3 |
||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
15 mA |
524288 words |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
100000 Write/Erase Cycles |
50 MHz |
Not Qualified |
SPI |
4194304 bit |
30 |
260 |
NOR TYPE |
.00001 Amp |
2.7 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
108 MHz |
5.28 mm |
67108864 bit |
2.7 V |
IT ALSO HAVE X1 MEMORY WIDTH |
e3 |
5.28 mm |
3 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
1048576 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
1MX1 |
1M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
33 MHz |
3.9 mm |
Not Qualified |
SPI |
1048576 bit |
2.7 V |
e3 |
10 |
260 |
NOR TYPE |
.000015 Amp |
4.9 mm |
||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
1 |
SMALL OUTLINE |
SOP8,.3 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.03 mm |
100000 Write/Erase Cycles |
104 MHz |
5.25 mm |
SPI |
67108864 bit |
2.7 V |
NOR TYPE |
.045 Amp |
5.26 mm |
|||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
133 MHz |
3.9 mm |
SPI |
16777216 bit |
2.3 V |
e3 |
260 |
NOR TYPE |
.00002 Amp |
4.9 mm |
3 |
||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
105 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.28 mm |
33554432 bit |
2.3 V |
30 |
250 |
5.28 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
134217728 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00006 Amp |
6 mm |
3.3 |
||||||||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
524288 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
4194304 bit |
2.7 V |
e0 |
.00005 Amp |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
50 mA |
33554432 words |
3 |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
.00006 Amp |
8 mm |
3 |
||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
3.3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
133 MHz |
3.9 mm |
16777216 bit |
3 V |
ALSO IT OPERATES AT 2.7V TO 3V WITH 104 MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
4.85 mm |
3 |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
2.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
85 MHz |
5 mm |
67108864 bit |
1.7 V |
e4 |
NOR TYPE |
6 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.03 mm |
100000 Write/Erase Cycles |
104 MHz |
5.25 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000025 Amp |
5.26 mm |
3 |
|||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
2097152 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
2MX1 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
80 MHz |
3.9 mm |
Not Qualified |
SPI |
2097152 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
4.9 mm |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
86 MHz |
5.23 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.00002 Amp |
5.28 mm |
3 |
|||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
SPI |
8388608 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
4.925 mm |
3 |
||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
10000 Write/Erase Cycles |
50 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
2.7 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.