LBGA Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

M58BW016BB100ZA6F

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016DB100ZA6F

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016BB80ZA6T

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW16FT4ZA3F

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

2K,16K

50 mA

1048576 words

3.3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

33554432 bit

2.7 V

NOR TYPE

.00015 Amp

12 mm

YES

45 ns

3.3

NO

M58BW016FT7ZA3F

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

40 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

3.6 V

1.6 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000005 Amp

12 mm

YES

70 ns

3

NO

M58BW016DT80ZA3

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW16FB5ZA3

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

50 mA

1048576 words

2.7

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

3.3 V

1.7 mm

10 mm

Not Qualified

BOTTOM

33554432 bit

2.5 V

NOR TYPE

.00015 Amp

12 mm

YES

55 ns

3.3

NO

M58BW016DB100ZA6

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016DB80ZA3T

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW016DB90ZA6F

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016DT90ZA3F

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016DB80ZA6FT

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW016DB80ZA3FF

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3.6 V

1.6 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW016BB80ZA3FT

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW016BT100ZA6T

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016BB90ZA6T

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016BB90ZA3

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016FB80ZA3FF

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3.6 V

1.6 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW32FT5ZA3T

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

4K,2K,16K

50 mA

524288 words

2.7

NO

3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

4,8,62

YES

BOTTOM

R-PBGA-B80

3.3 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.5 V

4

NOR TYPE

.00015 Amp

12 mm

YES

55 ns

3.3

NO

M58BW016DB90ZA3F

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW32FT4ZA3F

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

4K,2K,16K

50 mA

524288 words

3.3

NO

3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

4,8,62

YES

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

4

NOR TYPE

.00015 Amp

12 mm

YES

45 ns

3.3

NO

M58BW016DT90ZA6FT

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016BT80ZA3

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW016DB90ZA3

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016DB70ZA3FF

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3.6 V

1.6 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

70 ns

3

NO

M58BW016BB100ZA6T

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016BB90ZA6FT

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016BT80ZA6

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW016DT100ZA3FT

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016DT7ZA3FT

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

1

3.6 V

1.6 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

NOR TYPE

.000005 Amp

12 mm

YES

70 ns

3

NO

M58BW016BT90ZA6

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016DT70ZA3FT

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

3.6 V

1.6 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000005 Amp

12 mm

YES

70 ns

3

NO

M58BW16FT5ZA3F

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

2K,16K

50 mA

1048576 words

2.7

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

3.3 V

1.7 mm

10 mm

Not Qualified

TOP

33554432 bit

2.5 V

NOR TYPE

.00015 Amp

12 mm

YES

55 ns

3.3

NO

M58BW016DT80ZA6F

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW16FT5ZA3

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

2K,16K

50 mA

1048576 words

2.7

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

3.3 V

1.7 mm

10 mm

Not Qualified

TOP

33554432 bit

2.5 V

NOR TYPE

.00015 Amp

12 mm

YES

55 ns

3.3

NO

M58BW16FB5ZA3F

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

50 mA

1048576 words

2.7

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

3.3 V

1.7 mm

10 mm

Not Qualified

BOTTOM

33554432 bit

2.5 V

NOR TYPE

.00015 Amp

12 mm

YES

55 ns

3.3

NO

M58BW016BB80ZA6FT

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW016BT90ZA6FT

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016DB100ZA6T

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016BT100ZA6FT

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016DT100ZA6

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016DT80ZA3T

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

M58BW016DBXXZA3T

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3

32

GRID ARRAY, LOW PROFILE

1 mm

125 Cel

512KX32

512K

-40 Cel

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

12 mm

80 ns

3

M58BW016BT100ZA6

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016BT100ZA3T

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

100 ns

3

NO

M58BW016BB90ZA6

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

90 ns

3

NO

M58BW016FB70ZA3FT

STMicroelectronics

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

8,31

YES

BOTTOM

R-PBGA-B80

3.6 V

1.6 mm

10 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000005 Amp

12 mm

YES

70 ns

3

NO

M58BW016BT80ZA6FT

STMicroelectronics

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

30 mA

524288 words

3

NO

2.5/3.3,3/3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

8,31

YES

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

R-PBGA-B80

3.6 V

1.7 mm

10 mm

Not Qualified

TOP

16777216 bit

2.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

NOR TYPE

.000005 Amp

12 mm

YES

80 ns

3

NO

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.