TBGA Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S70FL01GSDSBHV010

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

200 mA

134217728 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

20

1 mm

105 Cel

128MX8

128M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

1000000 Write/Erase Cycles

80 MHz

6 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

.0006 Amp

8 mm

3

S25FL256SAGBHBD00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL128SAGBHIC00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

Flash Memories

20

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FL256SDSBHEA00

Infineon Technologies

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

125 Cel

3-STATE

32MX8

32M

-55 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100 Write/Erase Cycles

80 MHz

6 mm

SPI

268435456 bit

2.7 V

NOR TYPE

.0003 Amp

8 mm

3

S25FL256SDSBHBA03

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL512SAGBHNC13

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

128MX4

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

536870912 bit

2.7 V

IT IS ALSO CONFIGURED AS 512M X 1

NOR TYPE

8 mm

3

S25FL128SAGBHV311

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

6 mm

500 ms

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL128SAGBHV211

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

6 mm

500 ms

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL128SDSBHV213

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

BOTTOM

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL512SAGBHM213

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

125 Cel

3-STATE

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

512753664 bit

2.7 V

e1

NOR TYPE

.0003 Amp

8 mm

3

S25FL256SDPBHEC13

Infineon Technologies

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

125 Cel

3-STATE

32MX8

32M

-55 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100 Write/Erase Cycles

66 MHz

6 mm

SPI

268435456 bit

2.7 V

NOR TYPE

.0003 Amp

8 mm

3

S25FL128SAGBHB200

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL512SAGBHVC13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

3/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

Flash Memories

20

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

SPI

512753664 bit

2.7 V

e1

NOR TYPE

.0003 Amp

8 mm

3

S70FL01GSAGBHMC13

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

200 mA

134217728 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

125 Cel

3-STATE

128MX8

128M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

S25FL256SAGBHBA03

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

64MX4

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

3

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

e1

8 mm

3

S25FL256LAGBHN030

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

268435456 bit

2.7 V

IT ALSO HAVE MEMORY WIDTH X 1

NOR TYPE

8 mm

3

S25FL256LAGBHV023

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

50 mA

33554432 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

105 Cel

3-STATE

32MX8

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

268435456 bit

2.7 V

NOR TYPE

.00006 Amp

8 mm

3

S25HL02GTFABHA053

Infineon Technologies

FLASH

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

130 mA

268435456 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

3-STATE

256MX8

256M

-40 Cel

BOTTOM

HARDWARE

S-PBGA-B24

3.6 V

1.2 mm

2560000 Write/Erase Cycles

166 MHz

8 mm

SPI

2147483648 bit

2.7 V

NOR TYPE

.000041 Amp

8 mm

3

S25FL128SDPBHI310

Infineon Technologies

FLASH

INDUSTRIAL

TBGA

1

CMOS

SERIAL

SYNCHRONOUS

134217728 words

3

1

1 mm

85 Cel

128MX1

128M

-40 Cel

3.6 V

1.2 mm

133 MHz

6 mm

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL128SDSBHV313

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHB203

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL512SDSBHA210

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

512753664 bit

2.7 V

ITS ALSO CONFIGURABLE AS 512MX1

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

8 mm

3

S25FL128SAGBHA300

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHAB03

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SDPBHID10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

2

Flash Memories

20

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

66 MHz

6 mm

Not Qualified

500 ms

SPI

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FL128SAGBHAD03

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL064P0XBHB023

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

26 mA

8388608 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

0.2

1 mm

105 Cel

3-STATE

8MX8

8M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

104 MHz

6 mm

SPI

67108864 bit

2.7 V

NOR TYPE

.00001 Amp

8 mm

3

S25FL128SDPBHB210

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3

3.6 V

1.2 mm

66 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

8 mm

3

S25FL128SAGBHID00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

2

Flash Memories

20

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FL128SAGBHIB13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

Flash Memories

20

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FL512SDPBHV310

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

3/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

4

Flash Memories

20

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

66 MHz

6 mm

Not Qualified

SPI

512753664 bit

2.7 V

NOR TYPE

.0003 Amp

8 mm

3

S25FL512SDSBHEA13

Infineon Technologies

FLASH

MILITARY

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

67108864 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

125 Cel

3-STATE

64MX8

64M

-55 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

536870912 bit

2.7 V

NOR TYPE

.0003 Amp

8 mm

3

S25FS128SAGBHA300

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

2

1 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

8 mm

1.8

S25FL256SDPBHVD11

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

32MX8

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

6 mm

500 ms

268435456 bit

2.7 V

NOR TYPE

8 mm

3

S25FL128SAGBHMC03

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL512SAGBHBD10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

4

20

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

512753664 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0003 Amp

8 mm

3

S25FL128LAGBHN020

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

134217728 bit

2.7 V

IT ALSO HAVE MEMORY WIDTH X 1

NOR TYPE

8 mm

3

S25FL128SAGBHBA00

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

8 mm

3

S25FL128SAGBHIA11

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL128SAGBHID01

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL128SDPBHVD10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

16777216 words

3

3/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

2

Flash Memories

20

1 mm

105 Cel

16MX8

16M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

66 MHz

6 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0003 Amp

8 mm

3

S25FL128SDSBHIB10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SAGBHI313

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

2

Flash Memories

20

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FL128SAGBHAB03

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL256SAGBHMA13

Infineon Technologies

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

125 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

S25FL128SDSBHVC13

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

105 Cel

32MX4

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

8 mm

3

S25FL128SDPBHID11

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

500 ms

134217728 bit

2.7 V

NOR TYPE

8 mm

3

S25FL256SDSBHAC03

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

4

GRID ARRAY, THIN PROFILE

2

1 mm

85 Cel

64MX4

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

80 MHz

6 mm

500 ms

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

NOR TYPE

8 mm

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.