TBGA Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

N25Q064A43E12A0F

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT29F512G08CUAAAH2Z:A

Micron Technology

FLASH

COMMERCIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

68719476736 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

64GX8

64G

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

549755813888 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

PC28F256G18AE

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

128K

50 mA

16777216 words

1.8

NO

1.8

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

128

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

2 V

1.2 mm

8 mm

Not Qualified

268435456 bit

1.7 V

e1

NOR TYPE

.00013 Amp

10 mm

YES

96 ns

2.7

NO

PC28F00AP33EF

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

64K

31 mA

67108864 words

3

NO

2.5/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

64MX16

64M

-40 Cel

1K

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

8 mm

Not Qualified

1073741824 bit

2.3 V

16

e1

NOR TYPE

.00024 Amp

10 mm

YES

95 ns

3

NO

PC28F00AP30BFB

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX16

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

2 V

1.2 mm

8 mm

BOTTOM

1073741824 bit

1.7 V

BOTTOM BOOT

e1

10 mm

100 ns

1.8

MT29F256G08CJAAAH2:A

Micron Technology

FLASH

COMMERCIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

32GX8

32G

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

274877906944 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

N25Q128A33E1440E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT29F16G08ABCBBH2-12IT:B

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2147483648 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

2GX8

2G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

17179869184 bit

2.7 V

e1

SLC NAND TYPE

18 mm

2.7

N25Q256A43E12H0G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

268435456 bit

2.7 V

NOR TYPE

8 mm

3

N25Q128A23E1240F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q064A43E14H0E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q128A41E12H0G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

134217728 bit

1.7 V

NOR TYPE

8 mm

1.8

MT29F64G08CBCABH2-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8GX8

8G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

68719476736 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

MT29F64G08CBAAAH2IT:A

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8589934592 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8GX8

8G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

68719476736 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

N25Q512A71G12A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

536870912 bit

1.7 V

NOR TYPE

8 mm

1.8

PC28F512P30BFB

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16K,64K

31 mA

33554432 words

1.8

NO

1.8,1.8/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,20

Flash Memories

1 mm

85 Cel

32MX16

32M

-40 Cel

4,511

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

2 V

1.2 mm

8 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

BOTTOM BOOT

16

e1

NOR TYPE

.000225 Amp

10 mm

YES

100 ns

3

NO

N25Q128A13E12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

128MX1

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

e1

NOR TYPE

8 mm

3

N25Q256A41E1240E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

268435456 bit

1.7 V

8 mm

1.8

N25Q128A33E12H0G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q064A11E1240G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

67108864 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q512A13G12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

536870912 bit

2.7 V

NOR TYPE

8 mm

3

N25Q128A23E1440F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q064A41E12H0F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

67108864 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q128A21E12H0G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

134217728 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q064A11E12A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

67108864 bit

1.7 V

NOR TYPE

8 mm

1.8

M58LT128KSB8ZA6E

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8MX16

8M

-40 Cel

BOTTOM

R-PBGA-B64

2 V

1.2 mm

10 mm

BOTTOM

134217728 bit

1.7 V

NOR TYPE

13 mm

85 ns

1.8

N25Q064A13E14A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT35XU512ABA2G12-0SIT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

200 MHz

6 mm

536870912 bit

1.7 V

e1

30

260

8 mm

1.8

MT29F32G08AFABAH2-12IT:B

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

4GX8

4G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

34359738368 bit

2.7 V

e1

SLC NAND TYPE

18 mm

2.7

MT29F128G08CEAAAH2ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

17179869184 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

137438953472 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

M25PX16SOVZM3EPB

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

2097152 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

2MX8

2M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

75 MHz

6 mm

16777216 bit

2.7 V

8 mm

3

MT28GU256AAA2EGC-0AAT

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

16777216 words

1.8

16

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

16MX16

16M

-40 Cel

BOTTOM

R-PBGA-B64

2 V

1.2 mm

133 MHz

8 mm

268435456 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

10 mm

1.8

N25Q256A43E12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

268435456 bit

2.7 V

NOR TYPE

8 mm

3

M58LT128KSB8ZA6F

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8MX16

8M

-40 Cel

BOTTOM

R-PBGA-B64

2 V

1.2 mm

10 mm

BOTTOM

134217728 bit

1.7 V

NOR TYPE

13 mm

85 ns

1.8

MT35XL02GCBA2G12-0SITTR

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

256MX8

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

2147483648 bit

2.7 V

e1

30

260

NOR TYPE

8 mm

3

N25Q128A23E14A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q128A41E12A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

134217728 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q064A33E1440F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q064A13E12A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q032A31E12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

32MX1

32M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

33554432 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q064A43E12H0E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q256A41E12A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

268435456 bit

1.7 V

8 mm

1.8

N25Q512A33G12H0G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

536870912 bit

2.7 V

NOR TYPE

8 mm

3

MT29F64G08CBAABH2-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8GX8

8G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

68719476736 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

N25Q032A13E1240F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

4194304 words

3

3/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

20

1 mm

85 Cel

4MX8

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

33554432 bit

2.7 V

e1

NOR TYPE

.0001 Amp

8 mm

3

N25Q032A21E12H0E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32MX1

32M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

33554432 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q128A21E12H0F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

134217728 bit

1.7 V

NOR TYPE

8 mm

1.8

MT29F512G08CUAAAH2ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

68719476736 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64GX8

64G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

549755813888 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.