TBGA Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MT29F32G08AECBBH2-12:B

Micron Technology

FLASH

COMMERCIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

4GX8

4G

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

34359738368 bit

2.7 V

e1

SLC NAND TYPE

18 mm

2.7

MT29F64G08CBAABH2-12Z:A

Micron Technology

FLASH

COMMERCIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

8GX8

8G

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

68719476736 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

N25Q256A81E1240E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

33554432 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1 mm

85 Cel

32MX8

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

108 MHz

6 mm

SPI

268435456 bit

1.7 V

NOR TYPE

.00002 Amp

8 mm

1.8

N25Q128A41E12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

134217728 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q512A13G1240G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

536870912 bit

2.7 V

NOR TYPE

8 mm

3

N25Q128A33E1240F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q064A11E12H0G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

67108864 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q512A31G1240G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

536870912 bit

1.7 V

NOR TYPE

8 mm

1.8

M25PX64SVZM3E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

8388608 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

8MX8

8M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

75 MHz

6 mm

67108864 bit

2.7 V

8 mm

2.7

M25PX16-VZM3TGB

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

2.5/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

20

1 mm

125 Cel

2MX8

2M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

75 MHz

6 mm

Not Qualified

SPI

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00001 Amp

8 mm

3

M25PX16SVZM3EPB

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

2097152 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

2MX8

2M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

75 MHz

6 mm

16777216 bit

2.7 V

8 mm

3

MT28F128J3FS-12

Micron Technology

FLASH

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

3

16

GRID ARRAY, THIN PROFILE

8

1 mm

85 Cel

8MX16

8M

0 Cel

TIN LEAD SILVER

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

134217728 bit

2.7 V

e0

NOR TYPE

13 mm

120 ns

2.7

N25Q512A43G12A0F

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

536870912 bit

2.7 V

NOR TYPE

8 mm

3

N25Q512A31G12A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

536870912 bit

1.7 V

NOR TYPE

8 mm

1.8

MT29F256G08CJAAAH2IT:A

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32GX8

32G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

274877906944 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

M58LT128KSB7ZA6T

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8MX16

8M

-40 Cel

BOTTOM

R-PBGA-B64

2 V

1.2 mm

10 mm

BOTTOM

134217728 bit

1.7 V

NOR TYPE

13 mm

70 ns

1.8

M25PX16STVZM6TP

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

2.5/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

20

1 mm

85 Cel

2MX8

2M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

75 MHz

6 mm

Not Qualified

SPI

16777216 bit

2.3 V

e1

NOR TYPE

.00001 Amp

8 mm

3

MT35XU256ABA1G12-0AATTR

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

105 Cel

32MX8

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

200 MHz

6 mm

SPI

268435456 bit

1.7 V

e1

30

260

NOR TYPE

8 mm

1.8

N25Q256A33E12A0F

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

268435456 bit

2.7 V

NOR TYPE

8 mm

3

N25Q064A13E1247E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOR TYPE

8 mm

2.7

M25PX16STVZM3EPB

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

2097152 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

2MX8

2M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

75 MHz

6 mm

16777216 bit

2.7 V

8 mm

3

N25Q064A43E12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q064A23E1440G

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT29F256G08CMCABH2-12Z:A

Micron Technology

FLASH

COMMERCIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

32GX8

32G

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

274877906944 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

N25Q128A33E12H0F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q064A13E12H0E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q512A83G1240E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

15 mA

536870912 words

3

1

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

512MX1

512M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

108 MHz

6 mm

SPI

536870912 bit

2.7 V

e1

NOR TYPE

.0005 Amp

8 mm

3

PC28F256P30B85A

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS/ASYNCHRONOUS

16K,64K

51 mA

16777216 words

1.8

NO

1.8,1.8/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

4,255

YES

BOTTOM

R-PBGA-B64

2 V

1.2 mm

52 MHz

10 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

4

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000115 Amp

13 mm

YES

85 ns

1.8

NO

M25PX16STVZM6EPBA

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

2097152 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

2MX8

2M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

75 MHz

6 mm

16777216 bit

2.7 V

8 mm

3

N25Q064A13E12H0F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

67108864 words

3

3/3.3

1

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

20

1 mm

85 Cel

64MX1

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

67108864 bit

2.7 V

e1

NOR TYPE

.0001 Amp

8 mm

3

N25Q064A41E12A0F

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

64MX1

64M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

67108864 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q128A11E12H0E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

134217728 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q512A23G12H0E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

536870912 bit

2.7 V

NOR TYPE

8 mm

3

N25Q256A41E12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

268435456 bit

1.7 V

8 mm

1.8

M25PX64STVZM3EB

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

8388608 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

8MX8

8M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

75 MHz

6 mm

67108864 bit

2.7 V

8 mm

2.7

N25Q256A83E1241E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

268435456 bit

2.7 V

NOR TYPE

8 mm

3

N25Q128A21E12A0F

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

134217728 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q032A11E12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

32MX1

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

33554432 bit

1.7 V

e1

NOR TYPE

8 mm

1.8

M25PX64SOVZM6EBA

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

8388608 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8MX8

8M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

75 MHz

6 mm

67108864 bit

2.7 V

8 mm

2.7

N25Q256A83E12A0G

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

268435456 bit

2.7 V

NOR TYPE

8 mm

3

N25Q512A11G12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

512MX1

512M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

536870912 bit

1.7 V

e1

NOR TYPE

8 mm

1.8

N25Q512A43G12H0F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

536870912 bit

2.7 V

NOR TYPE

8 mm

3

MT29F128G08CFAAAH2ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

17179869184 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

137438953472 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

MT29F128G08CFAAAH2IT:A

Micron Technology

FLASH

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

17179869184 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

137438953472 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

N25Q256A31E1240E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

268435456 bit

1.7 V

8 mm

1.8

MT29F128G08CFAABH2-12Z:A

Micron Technology

FLASH

COMMERCIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

3.3

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

16GX8

16G

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

12 mm

137438953472 bit

2.7 V

e1

MLC NAND TYPE

18 mm

2.7

N25Q512A31G12A0E

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

108 MHz

6 mm

536870912 bit

1.7 V

NOR TYPE

8 mm

1.8

N25Q128A33E14A0F

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

128MX1

128M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.