Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
1073741824 bit |
2.7 V |
CONTAINS ADDITIONAL 32M BIT SPARE MEMORY |
SLC NAND TYPE |
18.4 mm |
2.7 |
||||||||||||||||||||||||||||||||||||
Sharp Corporation |
FLASH |
COMMERCIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
70 Cel |
2MX16 |
2M |
0 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.19 mm |
14 mm |
Not Qualified |
33554432 bit |
2.7 V |
NOR TYPE |
18.4 mm |
120 ns |
3 |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
20 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
4/8 |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
512K |
50 mA |
4294967296 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
8K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
34359738368 bit |
2.7 V |
4K |
SLC NAND TYPE |
18.4 mm |
20 ns |
3.3 |
NO |
|||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
5.5 V |
1.2 mm |
12 mm |
BOTTOM |
8388608 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
18.4 mm |
70 ns |
5 |
|||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
100 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
8/16 |
e3 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
30 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000015 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
18.4 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
45 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
16,126 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
60 ns |
3 |
YES |
||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
32 |
YES |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
12.4 mm |
70 ns |
5 |
YES |
||||||||||||||||||
|
Microchip Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
2097152 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
16777216 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||
|
Microchip Technology |
FLASH |
OTHER |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16K,8K,32K,64K |
18 mA |
2097152 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX8 |
2M |
0 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
33 MHz |
8 mm |
Not Qualified |
TOP |
16777216 bit |
3 V |
e3 |
NOR TYPE |
.0001 Amp |
12.4 mm |
11 ns |
3 |
NO |
||||||||||||||||||
Toshiba |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
80 ns |
3 |
YES |
|||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
18.4 mm |
3.3 |
||||||||||||||||||||||||||||||||||
|
Dialog Semiconductor |
FLASH |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
33554432 words |
3 |
1 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
20 |
.55 mm |
85 Cel |
3-STATE |
32MX1 |
32M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G28 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
66 MHz |
8 mm |
SPI |
33554432 bit |
2.7 V |
NOR TYPE |
.00005 Amp |
11.8 mm |
2.7 |
||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
2147483648 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
16K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
17179869184 bit |
2.7 V |
2K |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
18.4 mm |
25 ns |
3.3 |
NO |
||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
1,2,1,7 |
YES |
Tin (Sn) |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
e3 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Macronix |
FLASH |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
50 mA |
134217728 words |
3 |
NO |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
10 |
.5 mm |
85 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
1K |
NO |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
60000 Write/Erase Cycles |
12 mm |
.00002 ms |
1073741824 bit |
2.7 V |
2K |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
3 |
NO |
|||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
17179869184 bit |
2.7 V |
e3 |
30 |
260 |
SLC NAND TYPE |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,32K,64K |
80 mA |
1048576 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,2,30 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
4.5 V |
CONFIGURABLE AS 2M X 8 |
e0 |
NOR TYPE |
.003 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
1048576 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
16 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10 mm |
Not Qualified |
8388608 bit |
4.5 V |
DEEP POWER-DOWN |
e0 |
NOR TYPE |
.0000012 Amp |
18.4 mm |
120 ns |
12 |
NO |
||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
55 mA |
524288 words |
5 |
NO |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
-40 Cel |
1,2,1,7 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
4.5 V |
100,000 ERASE CYCLES; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
80 ns |
5 |
NO |
|||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
10 |
.5 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
YES |
DUAL |
R-PDSO-G32 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
BOTTOM |
2097152 bit |
4.75 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||||
Fujitsu Semiconductor America |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
16777216 bit |
4.5 V |
NOR TYPE |
18.4 mm |
70 ns |
5 |
|||||||||||||||||||||||||||||||||
Fujitsu |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
1048576 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
16777216 bit |
4.5 V |
CONFIGURABLE AS 2M X 8 |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
45 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.65 V |
e0 |
NOR TYPE |
.000025 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
524288 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3 |
30 |
260 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
55 ns |
5 |
YES |
||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
2147483648 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
18.4 mm |
3.3 |
||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
1073741824 words |
3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
8K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
8589934592 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
|||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
15 mA |
262144 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1K |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
20 ms |
BOTTOM/TOP |
2097152 bit |
3 V |
e3 |
30 |
260 |
NOR TYPE |
.00005 Amp |
18.4 mm |
100 ns |
3 |
YES |
|||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
20 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
4/8 |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
Spansion |
FLASH |
INDUSTRIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
45 mA |
4194304 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
64 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10 mm |
Not Qualified |
33554432 bit |
4.5 V |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
5 |
YES |
||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
NO |
||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
1081344 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
Flash Memories |
.55 mm |
70 Cel |
1081344X8 |
1081344 |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE |
R-PDSO-G28 |
3 |
3.6 V |
1.2 mm |
20 MHz |
8 mm |
Not Qualified |
SPI |
8650752 bit |
2.7 V |
ORGANIZED AS 4096 PAGES OF 264 BYTES EACH |
e0 |
240 |
NOR TYPE |
.00001 Amp |
11.8 mm |
2.7 |
|||||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
8388608 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
4/8 |
e0 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
150 ns |
2.7 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
35 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
2147483648 bit |
2.7 V |
1K |
SLC NAND TYPE |
.0001 Amp |
18.4 mm |
25 ns |
3.3 |
NO |
|||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
524288 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
8,15 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||||
|
Spansion |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
45 mA |
524288 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
2,4,2,14 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
3 |
YES |
|||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
10 |
.5 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
YES |
DUAL |
R-PDSO-G32 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
BOTTOM |
2097152 bit |
4.75 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||||
Intel |
FLASH |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
10 |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
DUAL |
R-PDSO-G32 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
.000045 ms |
1048576 bit |
4.75 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
45 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
FLASH |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
DUAL |
R-PDSO-G32 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
.000045 ms |
1048576 bit |
4.75 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
45 ns |
5 |
YES |
|||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
2K |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
256 |
e0 |
240 |
NOR TYPE |
.0001 Amp |
18.4 mm |
120 ns |
5 |
YES |
||||||||||||||||
Microchip Technology |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
32MX1 |
32M |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
13 MHz |
8 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
HARDWARE DATA PROTECTION; SPI SERIAL INTERFACE |
e0 |
240 |
NOR TYPE |
.00001 Amp |
18.4 mm |
2.7 |
|||||||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
1 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
3 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
67108864 bit |
2.7 V |
ORGANISED AS 8192 PAGES OF 1056 BYTES EACH |
e0 |
NOR TYPE |
18.4 mm |
2.7 |
||||||||||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,32K,64K |
80 mA |
1048576 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
8,2,30 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
4.5 V |
CONFIGURABLE AS 2M X 8 |
e0 |
NOR TYPE |
.003 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
50 mA |
262144 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
BOTTOM |
2097152 bit |
3 V |
e0 |
240 |
NOR TYPE |
.00005 Amp |
18.4 mm |
90 ns |
3 |
YES |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
64 mA |
4194304 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
16 |
Flash Memories |
.5 mm |
70 Cel |
4MX8 |
4M |
0 Cel |
64 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
3 V |
128/256 |
e0 |
NOR TYPE |
.00001 Amp |
18.4 mm |
70 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
1048576 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
1,2,1,7 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
4.5 V |
CONFG AS 512K X 16; USER SELECTABLE AS 5V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
18.4 mm |
80 ns |
5 |
NO |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.