Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
FLASH |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X12,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
16,254 |
YES |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
8 mm |
.000065 ms |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
11.6 mm |
YES |
65 ns |
3 |
YES |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
105 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6.15 mm |
BOTTOM |
16777216 bit |
1.65 V |
NOR TYPE |
8.15 mm |
1.8 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
4194304 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA56,8X8,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
16,126 |
YES |
YES |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
7 mm |
.00006 ms |
BOTTOM/TOP |
67108864 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
9 mm |
YES |
60 ns |
3 |
YES |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
OTHER |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA56,8X8,32 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
16,126 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B56 |
3 |
3.6 V |
1 mm |
7 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
9 mm |
YES |
60 ns |
3 |
YES |
||||||||||||||
Infineon Technologies |
FLASH |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X12,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-40 Cel |
16,254 |
YES |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
8 mm |
.00006 ms |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
11.6 mm |
YES |
60 ns |
3 |
YES |
|||||||||||||||||||
Infineon Technologies |
FLASH |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
4194304 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
16,126 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
6.15 mm |
.000055 ms |
BOTTOM/TOP |
67108864 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
55 ns |
3 |
YES |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
COMMERCIAL EXTENDED |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32K,128K |
55 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
8,62 |
YES |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.1 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
8 |
e1 |
40 |
260 |
NOR TYPE |
.00004 Amp |
11.6 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
Infineon Technologies |
FLASH |
80 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA80,8X12,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-40 Cel |
16,254 |
YES |
YES |
BOTTOM |
R-PBGA-B80 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
8 mm |
.00006 ms |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
11 mm |
YES |
60 ns |
3 |
YES |
|||||||||||||||||||
Infineon Technologies |
FLASH |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
2097152 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
16,62 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
6.15 mm |
.00007 ms |
BOTTOM/TOP |
33554432 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||||
Infineon Technologies |
FLASH |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X12,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-40 Cel |
16,254 |
YES |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
8 mm |
.000065 ms |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
11.6 mm |
YES |
65 ns |
3 |
YES |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
53 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
30 mA |
1048576 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA53,10X11,16/8 |
8 |
Flash Memories |
.4 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
YES |
YES |
BOTTOM |
R-PBGA-B53 |
1.95 V |
.6 mm |
2.51 mm |
Not Qualified |
BOTTOM |
16777216 bit |
1.65 V |
BOTTOM BOOT BLOCK |
NOR TYPE |
.00003 Amp |
4.26 mm |
YES |
70 ns |
1.8 |
YES |
|||||||||||||||||||
Infineon Technologies |
FLASH |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
8.15 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
1073741824 bit |
2.7 V |
SLC NAND TYPE |
11 mm |
3 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
80 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA80,8X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
16,254 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B80 |
3 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
11 mm |
YES |
65 ns |
3 |
YES |
||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
105 Cel |
256MX8 |
256M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
2147483648 bit |
1.7 V |
SLC NAND TYPE |
11 mm |
1.8 |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
11 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
OTHER |
80 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
TSSOP56,.8,20 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
16,254 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B80 |
3 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
11 mm |
YES |
60 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
BOTTOM |
8388608 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
8.15 mm |
70 ns |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
COMMERCIAL EXTENDED |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32K,128K |
55 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
8,62 |
YES |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.1 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
8 |
e1 |
40 |
260 |
NOR TYPE |
.00004 Amp |
11.6 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
536870912 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
105 Cel |
512MX8 |
512M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
4294967296 bit |
1.7 V |
SLC NAND TYPE |
11 mm |
1.8 |
|||||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
NOR TYPE |
8.15 mm |
60 ns |
3 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
67 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B67 |
3.6 V |
1 mm |
6.5 mm |
1073741824 bit |
2.7 V |
SLC NAND TYPE |
8 mm |
3 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
16777216 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
8.15 mm |
55 ns |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
125 Cel |
512KX16 |
512K |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
TOP |
8388608 bit |
3 V |
TOP BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
8.15 mm |
55 ns |
3 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
BOTTOM |
16777216 bit |
3 V |
BOTTOM BOOT BLOCK |
NOR TYPE |
8.15 mm |
55 ns |
3 |
||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
67 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B67 |
1.95 V |
1 mm |
6.5 mm |
1073741824 bit |
1.7 V |
SLC NAND TYPE |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
12 mA |
524288 words |
3.3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
TOP BOOT BLOCK |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
55 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
OTHER |
80 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA80,8X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
16,254 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B80 |
3 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
11 mm |
YES |
60 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
105 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6.15 mm |
TOP |
16777216 bit |
1.65 V |
NOR TYPE |
8.15 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
80 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
BOTTOM |
R-PBGA-B80 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
NOR TYPE |
11 mm |
60 ns |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
TOP |
16777216 bit |
3 V |
TOP BOOT BLOCK |
NOR TYPE |
8.15 mm |
55 ns |
3 |
||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
67 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
536870912 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
BOTTOM |
R-PBGA-B67 |
3.6 V |
1 mm |
6.5 mm |
4294967296 bit |
2.7 V |
SLC NAND TYPE |
8 mm |
3 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
3 |
NO |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
268435456 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
1.7 V |
2K |
SLC NAND TYPE |
.00005 Amp |
11 mm |
45 ns |
1.8 |
NO |
|||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
105 Cel |
256MX8 |
256M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
2147483648 bit |
1.7 V |
SLC NAND TYPE |
11 mm |
1.8 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
COMMERCIAL EXTENDED |
84 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32K,128K |
55 mA |
16777216 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA84,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
8,126 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B84 |
3 |
3.1 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
268435456 bit |
2.7 V |
8 |
e1 |
40 |
260 |
NOR TYPE |
.00004 Amp |
11.6 mm |
YES |
65 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
67 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
105 Cel |
128MX8 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B67 |
3.6 V |
1 mm |
6.5 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
8 mm |
3 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
105 Cel |
128MX8 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
1073741824 bit |
1.7 V |
SLC NAND TYPE |
11 mm |
1.8 |
|||||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
2097152 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA56,8X8,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
16,62 |
YES |
YES |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
7 mm |
.000055 ms |
BOTTOM/TOP |
33554432 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
9 mm |
YES |
55 ns |
3 |
YES |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
COMMERCIAL EXTENDED |
84 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32K,128K |
55 mA |
16777216 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA84,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
8,126 |
YES |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
YES |
BOTTOM |
R-PBGA-B84 |
3 |
3.1 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
268435456 bit |
2.7 V |
8 |
e1 |
40 |
260 |
NOR TYPE |
.00004 Amp |
11.6 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
Infineon Technologies |
FLASH |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
2097152 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA56,8X8,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
16,62 |
YES |
YES |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
7 mm |
.000055 ms |
BOTTOM/TOP |
33554432 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
9 mm |
YES |
55 ns |
3 |
YES |
||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
67 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B67 |
1.95 V |
1 mm |
6.5 mm |
2147483648 bit |
1.7 V |
SLC NAND TYPE |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X12,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-40 Cel |
16,254 |
YES |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
8 mm |
.00006 ms |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
11.6 mm |
YES |
60 ns |
3 |
YES |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
128K |
35 mA |
536870912 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
4294967296 bit |
2.7 V |
2K |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.0001 Amp |
11 mm |
3 |
NO |
||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
TOP |
16777216 bit |
2.7 V |
TOP BOOT BLOCK |
NOR TYPE |
8.15 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6.15 mm |
TOP |
16777216 bit |
2.7 V |
TOP BOOT BLOCK |
NOR TYPE |
8.15 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
64 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X12,32 |
20 |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
16,254 |
YES |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
8 mm |
.00007 ms |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOR TYPE |
.000005 Amp |
11.6 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
4294967296 bit |
1.7 V |
2K |
SLC NAND TYPE |
.00005 Amp |
11 mm |
45 ns |
1.8 |
NO |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.