Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
FLASH CARD |
COMMERCIAL |
50 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
47185920 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
16 |
60 Cel |
45MX8 |
45M |
0 Cel |
UNSPECIFIED |
X-XXMA-X50 |
3.45 V |
Not Qualified |
377487360 bit |
3.15 V |
USER SELECTABLE 5V VCC |
NOR TYPE |
250 ns |
3 |
||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH CARD |
COMMERCIAL |
50 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
31457280 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
16 |
60 Cel |
30MX8 |
30M |
0 Cel |
UNSPECIFIED |
X-XXMA-X50 |
3.45 V |
Not Qualified |
251658240 bit |
3.15 V |
USER SELECTABLE 5V VCC |
NOR TYPE |
250 ns |
3 |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH CARD |
COMMERCIAL |
50 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3.3 |
16 |
MICROELECTRONIC ASSEMBLY |
60 Cel |
128MX16 |
128M |
0 Cel |
UNSPECIFIED |
X-XXMA-X50 |
3.465 V |
Not Qualified |
2147483648 bit |
3.135 V |
AND TYPE |
250 ns |
3.3 |
|||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH CARD |
50 |
UNSPECIFIED |
UNSPECIFIED |
NO |
UNSPECIFIED |
MICROELECTRONIC ASSEMBLY |
UNSPECIFIED |
X-XXMA-X50 |
Not Qualified |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH CARD |
50 |
UNSPECIFIED |
UNSPECIFIED |
NO |
UNSPECIFIED |
MICROELECTRONIC ASSEMBLY |
UNSPECIFIED |
X-XXMA-X50 |
Not Qualified |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH CARD |
COMMERCIAL |
68 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
15728640 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
60 Cel |
15MX8 |
15M |
0 Cel |
UNSPECIFIED |
X-XXMA-X68 |
5.5 V |
100000 Write/Erase Cycles |
Not Qualified |
125829120 bit |
4.5 V |
100000 WRITE ENDURANCE MIN |
NOR TYPE |
250 ns |
5 |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
1 |
20 |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
UNSPECIFIED |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
108 MHz |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
3 |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
DIE |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
27 mA |
8388608 words |
1.8 |
8 |
UNCASED CHIP |
DIE OR CHIP |
20 |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
2 V |
100000 Write/Erase Cycles |
133 MHz |
SPI |
67108864 bit |
1.7 V |
NOR TYPE |
.00005 Amp |
1.8 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
DIE |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
3.3 |
4 |
UNCASED CHIP |
20 |
85 Cel |
3-STATE |
2MX4 |
2M |
-40 Cel |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
133 MHz |
SPI |
8388608 bit |
2.7 V |
NOR TYPE |
.00005 Amp |
3.3 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
3.3 |
2 |
UNCASED CHIP |
DIE OR CHIP |
20 |
85 Cel |
3-STATE |
2MX2 |
2M |
-40 Cel |
UPPER |
HARDWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
133 MHz |
SPI |
4194304 bit |
2.7 V |
ALSO OPERATES WITH 1.65V MIN @108MHZ FREQ |
NOR TYPE |
.000019 Amp |
3.3 |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
2MX1 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
UPPER |
X-XUUC-N |
1 |
3.6 V |
70 MHz |
2097152 bit |
1.65 V |
e4 |
2.7 |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1048576 words |
3 |
1 |
UNCASED CHIP |
85 Cel |
1MX1 |
1M |
-40 Cel |
UPPER |
X-XUUC-N |
3.6 V |
104 MHz |
1048576 bit |
2.3 V |
3 |
|||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
2MX1 |
2M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
UPPER |
X-XUUC-N |
3.6 V |
104 MHz |
2097152 bit |
1.65 V |
IT ALSO OPERATES AT 2.3V MIN |
e4 |
NOR TYPE |
1.8 |
|||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
64MX1 |
64M |
-40 Cel |
UPPER |
X-XUUC-N |
2 V |
104 MHz |
67108864 bit |
1.7 V |
1.8 |
||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
4MX1 |
4M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
UPPER |
X-XUUC-N |
3.6 V |
104 MHz |
4194304 bit |
1.65 V |
e4 |
NOR TYPE |
1.8 |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
1 |
UNCASED CHIP |
85 Cel |
32MX1 |
32M |
-40 Cel |
UPPER |
X-XUUC-N |
3.6 V |
85 MHz |
33554432 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 |
|||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
AUTOMOTIVE |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
1 |
UNCASED CHIP |
125 Cel |
2MX1 |
2M |
-40 Cel |
UPPER |
X-XUUC-N |
1 |
3.6 V |
85 MHz |
2097152 bit |
1.7 V |
NOR TYPE |
1.8 |
|||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
8 |
UNCASED CHIP |
DIE OR CHIP |
20 |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
108 MHz |
SPI |
8388608 bit |
2.5 V |
NOR TYPE |
.00003 Amp |
3 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
1 |
UNCASED CHIP |
85 Cel |
64MX1 |
64M |
-40 Cel |
UPPER |
X-XUUC-N |
3.6 V |
85 MHz |
67108864 bit |
2.3 V |
IT ALSO OPERATES AT FREQUENCY 50 MHZ AT 1.7 TO 3.6 V SUPPLY VOLTAGE |
NOT SPECIFIED |
NOT SPECIFIED |
1.8 |
||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
64MX1 |
64M |
-40 Cel |
UPPER |
X-XUUC-N |
1.95 V |
104 MHz |
67108864 bit |
1.65 V |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
DIE |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
1.8 |
8 |
UNCASED CHIP |
DIE OR CHIP |
20 |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
133 MHz |
SPI |
16777216 bit |
1.65 V |
NOR TYPE |
.00005 Amp |
1.8 |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
AUTOMOTIVE |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1048576 words |
1 |
UNCASED CHIP |
125 Cel |
1MX1 |
1M |
-40 Cel |
UPPER |
X-XUUC-N |
1 |
3.6 V |
20000 Write/Erase Cycles |
104 MHz |
1048576 bit |
1.7 V |
.00006 Amp |
1.8 |
|||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
DIE |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
19 mA |
67108864 words |
3 |
1 |
UNCASED CHIP |
20 |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
UNSPECIFIED |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
104 MHz |
SPI |
67108864 bit |
2.7 V |
NOR TYPE |
.000025 Amp |
3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
128MX1 |
128M |
-40 Cel |
UPPER |
X-XUUC-N |
2 V |
104 MHz |
134217728 bit |
1.7 V |
1.8 |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH 1.8V PROM |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
32MX1 |
32M |
-40 Cel |
UPPER |
X-XUUC-N |
3.6 V |
104 MHz |
33554432 bit |
1.65 V |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FLASH 1.8V PROM |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
32MX1 |
32M |
-40 Cel |
UPPER |
X-XUUC-N |
3.6 V |
104 MHz |
33554432 bit |
1.65 V |
|||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
1.8 |
2 |
UNCASED CHIP |
20 |
85 Cel |
3-STATE |
2MX2 |
2M |
-40 Cel |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
3.6 V |
100000 Write/Erase Cycles |
133 MHz |
SPI |
4194304 bit |
1.65 V |
NOR TYPE |
.00005 Amp |
1.8 |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
32MX1 |
32M |
-40 Cel |
UPPER |
X-XUUC-N |
2 V |
104 MHz |
33554432 bit |
1.7 V |
1.8 |
|||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
UNCASED CHIP |
DIE OR CHIP |
20 |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
108 MHz |
SPI |
33554432 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.000025 Amp |
3 |
||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
SERIAL |
SYNCHRONOUS |
19 mA |
4194304 words |
3 |
16 |
UNCASED CHIP |
DIE OR CHIP |
20 |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
104 MHz |
SPI |
67108864 bit |
2.7 V |
NOR TYPE |
.000025 Amp |
3 |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
3.3 |
4 |
20 |
85 Cel |
3-STATE |
2MX4 |
2M |
-40 Cel |
UPPER |
HARDWARE |
X-XUUC-N |
3.6 V |
100000 Write/Erase Cycles |
133 MHz |
SPI |
8388608 bit |
2.7 V |
ALSO OPERATES AT 108MHZ @1.65V MINIMUM SUPPLY |
NOR TYPE |
.000019 Amp |
3.3 |
||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
DIE |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16 mA |
4194304 words |
3 |
1 |
20 |
3-STATE |
4MX1 |
4M |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
85 MHz |
SPI |
4194304 bit |
2.3 V |
NOR TYPE |
.00004 Amp |
3 |
|||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
8 |
UNCASED CHIP |
DIE OR CHIP |
20 |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
1 |
3.6 V |
100000 Write/Erase Cycles |
133 MHz |
SPI |
8388608 bit |
2.3 V |
IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE |
NOR TYPE |
.00004 Amp |
3 |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1048576 words |
1.8 |
1 |
UNCASED CHIP |
85 Cel |
1MX1 |
1M |
-40 Cel |
Matte Tin (Sn) |
UPPER |
X-XUUC-N |
3.6 V |
104 MHz |
1048576 bit |
1.7 V |
e3 |
NOR TYPE |
1.8 |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
DIE |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16 mA |
4194304 words |
3 |
1 |
UNCASED CHIP |
DIE OR CHIP |
20 |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
UPPER |
HARDWARE/SOFTWARE |
X-XUUC-N |
3.6 V |
104 MHz |
SPI |
4194304 bit |
2.5 V |
NOR TYPE |
.000025 Amp |
3 |
||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY |
85 Cel |
4MX16 |
4M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
X-PBGA-B |
3 |
1.95 V |
Not Qualified |
67108864 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
e1 |
260 |
90 ns |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
1.8 |
16 |
GRID ARRAY |
70 Cel |
16MX16 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
X-PBGA-B |
2 |
1.95 V |
Not Qualified |
TOP |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
e1 |
NOR TYPE |
80 ns |
1.8 |
||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
COMMERCIAL |
22 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
55 Cel |
4MX8 |
4M |
0 Cel |
UNSPECIFIED |
X-XXMA-X22 |
3.6 V |
Not Qualified |
33554432 bit |
3 V |
35 ns |
3 |
|||||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
COMMERCIAL |
22 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
55 Cel |
2MX8 |
2M |
0 Cel |
UNSPECIFIED |
X-XXMA-X22 |
3.6 V |
Not Qualified |
16777216 bit |
3 V |
45 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
1.8 |
16 |
GRID ARRAY |
70 Cel |
16MX16 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
X-PBGA-B |
2 |
1.95 V |
Not Qualified |
BOTTOM |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
e1 |
NOR TYPE |
80 ns |
1.8 |
||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
COMMERCIAL |
22 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
10 |
55 Cel |
16MX8 |
16M |
0 Cel |
UNSPECIFIED |
X-XXMA-X22 |
3.6 V |
Not Qualified |
134217728 bit |
2.7 V |
HARDWARE DATA PROTECTION; DATA RETENTION 10 YEARS |
35 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
COMMERCIAL |
22 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
10 |
55 Cel |
8MX8 |
8M |
0 Cel |
UNSPECIFIED |
X-XXMA-X22 |
3.6 V |
Not Qualified |
67108864 bit |
2.7 V |
HARDWARE DATA PROTECTION; DATA RETENTION 10 YEARS |
35 ns |
2.7 |
|||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
COMMERCIAL |
22 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
55 Cel |
3-STATE |
4MX8 |
4M |
0 Cel |
UNSPECIFIED |
X-XXMA-X22 |
5.5 V |
Not Qualified |
33554432 bit |
4.5 V |
5 |
|||||||||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
COMMERCIAL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY |
70 Cel |
4MX16 |
4M |
0 Cel |
TIN LEAD |
BOTTOM |
X-PBGA-B |
3 |
1.95 V |
Not Qualified |
67108864 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
e0 |
240 |
90 ns |
1.8 |
||||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
OTHER |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY |
85 Cel |
4MX16 |
4M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
X-PBGA-B |
3 |
1.95 V |
Not Qualified |
67108864 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
e1 |
260 |
80 ns |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY |
70 Cel |
4MX16 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
X-PBGA-B |
3 |
1.95 V |
Not Qualified |
67108864 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
e1 |
260 |
90 ns |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Samsung |
FLASH |
COMMERCIAL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
1.8 |
16 |
GRID ARRAY |
70 Cel |
16MX16 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
X-PBGA-B |
2 |
1.95 V |
Not Qualified |
BOTTOM |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
e1 |
NOR TYPE |
90 ns |
1.8 |
||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
COMMERCIAL |
22 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
CMOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
10 |
55 Cel |
8MX8 |
8M |
0 Cel |
UNSPECIFIED |
X-XXMA-X22 |
3.6 V |
Not Qualified |
67108864 bit |
2.7 V |
HARDWARE DATA PROTECTION; DATA RETENTION 10 YEARS |
2.7 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.