Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
SYNCHRONOUS |
2K,16K |
50 mA |
1048576 words |
3.3 |
NO |
2.5/3.3,3/3.3 |
32 |
FLATPACK |
QFP80,.7X.9,32 |
Flash Memories |
.8 mm |
125 Cel |
1MX32 |
1M |
-40 Cel |
8,31 |
YES |
QUAD |
R-PQFP-G80 |
3.6 V |
3.4 mm |
14 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
NOR TYPE |
.00015 Amp |
20 mm |
YES |
45 ns |
3.3 |
NO |
||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
125 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
8 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
5.25 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
4.75 V |
e0 |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
YES |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.25 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.75 V |
BULK ERASE |
e0 |
NOR TYPE |
.0001 Amp |
41.91 mm |
120 ns |
12 |
NO |
||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
10 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
40 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
YES |
80 ns |
3 |
YES |
||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
2.62 mm |
13.3 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
100000 PROGRAM/ERASE CYCLES; USER CONFIGURABLE AS 128K X 16; BLOCK ERASE; TOP BOOT BLOCK |
NOR TYPE |
28.2 mm |
80 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
125 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.455 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
13.995 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
125 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.455 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
NOR TYPE |
.00005 Amp |
13.995 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
|
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
125 Cel |
512KX8 |
512K |
-40 Cel |
8 |
YES |
TIN/TIN BISMUTH |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
3 mm |
100000 Write/Erase Cycles |
12.6 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
28.5 mm |
70 ns |
5 |
YES |
||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
TSOP1-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
2097152 bit |
4.5 V |
NOR TYPE |
18.4 mm |
70 ns |
12 |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
MATTE TIN |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
BOTTOM |
2097152 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
.0001 Amp |
41.91 mm |
55 ns |
5 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDSO-G48 |
5.25 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
2097152 bit |
4.75 V |
100000 PROGRAM/ERASE CYCLES; USER CONFIGURABLE AS 128K X 16; BLOCK ERASE; TOP BOOT BLOCK |
NOR TYPE |
18.4 mm |
100 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
524288 words |
3.3 |
YES |
3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
MATTE TIN |
YES |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
TOP BOOT BLOCK |
e3 |
NOR TYPE |
.0001 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
131072 words |
3.3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3.6 V |
3.56 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
2.7 V |
e0 |
NOR TYPE |
.0001 Amp |
13.97 mm |
90 ns |
2.7 |
YES |
||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOR TYPE |
18.4 mm |
200 ns |
12 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
16 |
.5 mm |
125 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-G48 |
5.25 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.75 V |
NOR TYPE |
18.4 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
BOTTOM |
2097152 bit |
4.5 V |
BOTTOM BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
4194304 bit |
3 V |
10000 PROGRAM/ERASE CYCLES; BLOCK ERASE; USER CONFIGURABLE AS 256K X 16 |
NOR TYPE |
18.4 mm |
150 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
65536 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
64KX16 |
64K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
2.62 mm |
13.3 mm |
Not Qualified |
TOP |
1048576 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
28.2 mm |
70 ns |
5 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
2.62 mm |
100000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
28.2 mm |
90 ns |
5 |
YES |
|||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K,16K |
30 mA |
524288 words |
3 |
NO |
2.5/3.3,3/3.3 |
32 |
FLATPACK |
QFP80,.7X.9,32 |
Flash Memories |
.8 mm |
125 Cel |
512KX32 |
512K |
-40 Cel |
8,31 |
YES |
QUAD |
R-PQFP-G80 |
1 |
3.6 V |
3.4 mm |
14 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK |
NOR TYPE |
.000005 Amp |
20 mm |
YES |
70 ns |
3 |
NO |
|||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
131072 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,3 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
18.4 mm |
45 ns |
5 |
YES |
||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
13.97 mm |
55 ns |
5 |
YES |
||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
30 mA |
196608 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
125 Cel |
192KX8 |
192K |
-40 Cel |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
Not Qualified |
1572864 bit |
e0 |
NOR TYPE |
.0001 Amp |
120 ns |
NO |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDSO-G40 |
5.25 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
2097152 bit |
4.75 V |
100000 PROGRAM/ERASE CYCLES; BLOCK ERASE; TOP BOOT BLOCK |
NOR TYPE |
18.4 mm |
120 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,2K,16K |
1048576 words |
3.3 |
NO |
3.3 |
32 |
FLATPACK |
QFP80,.7X.9,32 |
Flash Memories |
.8 mm |
125 Cel |
1MX32 |
1M |
-40 Cel |
4,8,62 |
YES |
QUAD |
R-PQFP-G80 |
3.6 V |
3.4 mm |
14 mm |
Not Qualified |
BOTTOM |
33554432 bit |
3 V |
SYNCHRONOUS BURST MODE OPERATION POSSIBLE; BOTTOM BOOT BLOCK |
4 |
NOR TYPE |
.0001 Amp |
20 mm |
YES |
45 ns |
3.3 |
NO |
||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.455 mm |
Not Qualified |
1048576 bit |
4.75 V |
100 ERASE/PROGRAM CYCLES |
NOR TYPE |
13.995 mm |
120 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
35 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
16 |
Flash Memories |
.5 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
2097152 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.00005 Amp |
18.4 mm |
120 ns |
12 |
NO |
|||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TSOP1-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
16 |
.5 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
1048576 bit |
4.5 V |
NOR TYPE |
18.4 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.25 V |
2.62 mm |
13.3 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.75 V |
100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 256K X 16; BLOCK ERASE; BOTTOM BOOT BLOCK |
NOR TYPE |
28.2 mm |
100 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K,16K |
30 mA |
524288 words |
3 |
NO |
2.5/3.3,3/3.3 |
32 |
FLATPACK |
QFP80,.7X.9,32 |
Flash Memories |
.8 mm |
125 Cel |
512KX32 |
512K |
-40 Cel |
8,31 |
YES |
TIN LEAD |
QUAD |
R-PQFP-G80 |
3.6 V |
3.4 mm |
14 mm |
Not Qualified |
TOP |
16777216 bit |
2.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
20 mm |
YES |
90 ns |
3 |
NO |
||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
TSOP1-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
125 Cel |
YES |
3-STATE |
256KX8 |
256K |
-40 Cel |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
2097152 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
18.4 mm |
150 ns |
12 |
NO |
|||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,96K,128K |
35 mA |
131072 words |
5 |
NO |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,1 |
YES |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
100 Write/Erase Cycles |
Not Qualified |
BOTTOM |
2097152 bit |
e0 |
NOR TYPE |
.00005 Amp |
100 ns |
NO |
||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
125 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
100000 Write/Erase Cycles |
11.455 mm |
Not Qualified |
4194304 bit |
4.75 V |
e0 |
NOR TYPE |
.0001 Amp |
13.995 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
65536 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
64KX16 |
64K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
2.62 mm |
13.3 mm |
Not Qualified |
TOP |
1048576 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
28.2 mm |
70 ns |
5 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOR TYPE |
41.91 mm |
70 ns |
5 |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
8K |
25 mA |
262144 words |
NO |
3.3,5 |
32 |
FLATPACK |
QFP80,.7X.9,32 |
Flash Memories |
.8 mm |
125 Cel |
256KX32 |
256K |
-40 Cel |
32 |
YES |
Tin/Lead (Sn85Pb15) |
QUAD |
R-PQFP-G80 |
Not Qualified |
8388608 bit |
e0 |
NOR TYPE |
.000005 Amp |
100 ns |
NO |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
131072 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,3 |
YES |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
3 mm |
100000 Write/Erase Cycles |
12.6 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
TOP BOOT BLOCK |
40 |
245 |
NOR TYPE |
.0001 Amp |
28.5 mm |
70 ns |
5 |
YES |
|||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
125 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-G40 |
5.25 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
4194304 bit |
4.75 V |
100000 PROGRAM/ERASE CYCLES; TOP BOOT BLOCK |
NOR TYPE |
18.4 mm |
70 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
196608 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
125 Cel |
3-STATE |
192KX8 |
192K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.455 mm |
Not Qualified |
BOTTOM |
1572864 bit |
4.5 V |
NOR TYPE |
13.995 mm |
150 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K,16K |
30 mA |
524288 words |
3 |
NO |
2.5/3.3,3/3.3 |
32 |
FLATPACK |
QFP80,.7X.9,32 |
Flash Memories |
.8 mm |
125 Cel |
512KX32 |
512K |
-40 Cel |
8,31 |
YES |
QUAD |
R-PQFP-G80 |
3.6 V |
3.4 mm |
14 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
20 mm |
YES |
80 ns |
3 |
NO |
||||||||||||||||||||
|
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
2.62 mm |
100000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
40 |
245 |
NOR TYPE |
.0001 Amp |
28.2 mm |
55 ns |
5 |
YES |
|||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
16 |
.5 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDSO-G48 |
5.25 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
2097152 bit |
4.75 V |
NOR TYPE |
18.4 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2K,16K |
30 mA |
524288 words |
3 |
NO |
2.5/3.3,3/3.3 |
32 |
GRID ARRAY, LOW PROFILE |
BGA80,8X10,40 |
Flash Memories |
1 mm |
125 Cel |
512KX32 |
512K |
-40 Cel |
8,31 |
YES |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
BOTTOM |
R-PBGA-B80 |
3.6 V |
1.7 mm |
10 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK |
e1 |
NOR TYPE |
.000005 Amp |
12 mm |
YES |
100 ns |
3 |
NO |
|||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE, WINDOW |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-GDIP-T32 |
5.25 V |
5.72 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
100 ERASE/PROGRAM CYCLES |
NOR TYPE |
41.885 mm |
200 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
125 Cel |
256KX8 |
256K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.455 mm |
Not Qualified |
2097152 bit |
4.75 V |
NOR TYPE |
13.995 mm |
120 ns |
12 |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
5.25 V |
2.62 mm |
13.3 mm |
Not Qualified |
BOTTOM |
1048576 bit |
4.75 V |
CONFG AS 64K X 16; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
28.2 mm |
90 ns |
5 |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.