Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
67108864 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
2.7 V |
16 |
e3 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
110 ns |
2.7 |
YES |
||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
536870912 bit |
2.7 V |
e3 |
18.4 mm |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256K |
30 mA |
1073741824 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
8589934592 bit |
2.7 V |
2K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
3 |
NO |
|||||||||||||||||||
|
Swissbit Ag |
FLASH CARD |
INDUSTRIAL |
50 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
536870912 words |
3.3 |
8 |
UNCASED CHIP |
85 Cel |
512MX8 |
512M |
-40 Cel |
UPPER |
R-XUUC-N50 |
3.63 V |
4.1 mm |
36.4 mm |
4294967296 bit |
2.97 V |
ALSO OPERATES AT 5V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
42.8 mm |
300 ns |
3.3 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
S-PDSO-N10 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
40 MHz |
3 mm |
SPI |
4194304 bit |
2.3 V |
e3 |
NOR TYPE |
.00001 Amp |
3 mm |
3.3 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
20 |
.5 mm |
105 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
S-PDSO-N10 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
40 MHz |
3 mm |
SPI |
4194304 bit |
2.3 V |
e3 |
NOR TYPE |
.00001 Amp |
3 mm |
3.3 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
524288 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
105 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
1 |
SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
40 MHz |
5 mm |
SPI |
4194304 bit |
2.3 V |
NOR TYPE |
.00001 Amp |
6 mm |
3.3 |
|||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
S-PDSO-N10 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
40 MHz |
3 mm |
SPI |
4194304 bit |
2.3 V |
e3 |
NOR TYPE |
.00001 Amp |
3 mm |
3.3 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
20 |
.5 mm |
105 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
S-PDSO-N10 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
40 MHz |
3 mm |
SPI |
4194304 bit |
2.3 V |
e3 |
NOR TYPE |
.00001 Amp |
3 mm |
3.3 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
524288 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
105 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
DUAL |
1 |
SOFTWARE |
R-PDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
40 MHz |
2 mm |
SPI |
4194304 bit |
2.3 V |
NOR TYPE |
.00001 Amp |
3 mm |
3.3 |
|||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
20 |
1.27 mm |
105 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
40 MHz |
3.9 mm |
SPI |
4194304 bit |
2.3 V |
e3 |
NOR TYPE |
.00001 Amp |
4.9 mm |
3.3 |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
30 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e3 |
NOR TYPE |
.000045 Amp |
6 mm |
3 |
|||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
128 |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
40 |
260 |
NOR TYPE |
.0001 Amp |
12.4 mm |
55 ns |
5 |
YES |
|||||||||||||||
|
Toshiba |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
70 mA |
4194304 words |
3 |
YES |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.3 V |
IT ALSO OPERATES AT 2.7 TO 3.6 VOLT |
8/16 |
30 |
260 |
NOR TYPE |
.00001 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
YES |
||||||||||||||||
|
Toshiba |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
8 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00001 Amp |
18.4 mm |
YES |
65 ns |
3 |
YES |
||||||||||||||||||
Toshiba |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
80 ns |
3 |
YES |
|||||||||||||||||||
Toshiba |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
.00005 Amp |
18.4 mm |
25 ns |
3.3 |
NO |
|||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
70 ns |
2.7 |
NO |
|||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
6 mm |
2.7 |
|||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.28 mm |
SPI |
67108864 bit |
3 V |
IT ALSO OPERATES AT 2.7V @ 104MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
5.28 mm |
3.3 |
|||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
8388608 words |
1.8 |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
8388608 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0000075 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||
Spansion |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
260 |
NOR TYPE |
.000005 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Advanced Micro Devices |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOR TYPE |
13.97 mm |
55 ns |
5 |
|||||||||||||||||||||||||||||||||||
Spansion |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
NOR TYPE |
13.97 mm |
55 ns |
5 |
|||||||||||||||||||||||||||||||||
Spansion |
FLASH |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
8 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
4.75 V |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
55 ns |
5 |
YES |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
5.25 V |
1.2 mm |
12 mm |
BOTTOM |
4194304 bit |
4.75 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
18.4 mm |
55 ns |
5 |
||||||||||||||||||||||||||||||
Spansion |
FLASH |
INDUSTRIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
262144 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.8,20 |
Flash Memories |
20 |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
3 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
2097152 bit |
2.7 V |
MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; TOP BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
3 |
YES |
|||||||||||||||||
Adesto Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100 MHz |
7.5 mm |
67108864 bit |
2.7 V |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
262144 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256KX1 |
256K |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
104 MHz |
3.9 mm |
262144 bit |
2.3 V |
4.925 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
18 mA |
65536 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
104 MHz |
2 mm |
SPI |
524288 bit |
2.3 V |
e4 |
NOR TYPE |
.000015 Amp |
3 mm |
3 |
||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18 mA |
65536 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
20 |
.65 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
104 MHz |
3 mm |
SPI |
524288 bit |
2.3 V |
e4 |
NOR TYPE |
.000015 Amp |
4.4 mm |
3 |
||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
18 mA |
16777216 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
5 mm |
SPI |
16777216 bit |
2.3 V |
.00005 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
18.5 mA |
4194304 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
108 MHz |
2 mm |
SPI |
4194304 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
3 mm |
3 |
||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18.5 mA |
4194304 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.24 mm |
SPI |
4194304 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
5.29 mm |
3 |
||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18.5 mA |
4194304 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.24 mm |
SPI |
4194304 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
5.29 mm |
3 |
|||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.24 mm |
SPI |
8388608 bit |
2.5 V |
NOR TYPE |
.00003 Amp |
5.29 mm |
3 |
|||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
3.3 |
4 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX4 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.24 mm |
SPI |
8388608 bit |
2.7 V |
NOR TYPE |
.00005 Amp |
5.29 mm |
3.3 |
||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1,1,1 |
NO |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.75 V |
e3 |
40 |
245 |
NOR TYPE |
.00003 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
1,1,1 |
NO |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.5 V |
e3 |
40 |
245 |
NOR TYPE |
.00003 Amp |
13.97 mm |
90 ns |
5 |
YES |
||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
2097152 words |
1.8 |
1.8/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
70 MHz |
3.9 mm |
Not Qualified |
SPI |
2097152 bit |
1.65 V |
e4 |
NOR TYPE |
.000008 Amp |
4.925 mm |
2.7 |
||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
4194304 words |
3 |
1.8/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
85 MHz |
5.24 mm |
Not Qualified |
SPI |
4194304 bit |
2.3 V |
e4 |
260 |
NOR TYPE |
.00004 Amp |
5.29 mm |
3 |
||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4(UNSPEC) |
20 |
.5 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
MATTE TIN |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
1 |
3.6 V |
.52 mm |
100000 Write/Erase Cycles |
133 MHz |
1.605 mm |
SPI |
8388608 bit |
2.3 V |
IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE |
e3 |
NOR TYPE |
.00004 Amp |
2.317 mm |
3 |
|||||||||||||||||||||||
|
Onsemi |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
YES |
TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
260 |
NOR TYPE |
.00001 Amp |
13.97 mm |
90 ns |
12 |
NO |
|||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
67108864 bit |
2.7 V |
NOR TYPE |
.000005 Amp |
6 mm |
3.3 |
|||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
67108864 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
18.4 mm |
70 ns |
2.7 |
||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
4MX8 |
4M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
133 MHz |
5 mm |
33554432 bit |
2.3 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
3 |
|||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
105 Cel |
64MX8 |
64M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.49 mm |
536870912 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.31 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
262144 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
256KX1 |
256K |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
104 MHz |
3.9 mm |
262144 bit |
2.3 V |
e3 |
30 |
260 |
4.9 mm |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.