INDUSTRIAL Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MT28EW128ABA1HJS-0SIT

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

8MX16

8M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

134217728 bit

2.7 V

e3

30

260

NOR TYPE

18.4 mm

70 ns

3

MT29F1G08ABADAH4-ITX:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

134217728 words

3.3

NO

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX8

128M

-40 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

1073741824 bit

2.7 V

2K

e1

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

3.3

NO

MTFC64GAPALNA-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

NO

8

GRID ARRAY, THIN PROFILE

BGA100,10X15,40

1 mm

85 Cel

64GX8

64G

-40 Cel

NO

TIN SILVER COPPER

YES

BOTTOM

HARDWARE

R-PBGA-B100

3.6 V

1.2 mm

200 MHz

14 mm

549755813888 bit

2.7 V

e1

30

260

NAND TYPE

18 mm

2.7

NO

MX25L1606EXCI-12G

Macronix

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

25 mA

2097152 words

3

3/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

Flash Memories

20

1 mm

85 Cel

2MX8

2M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

86 MHz

6 mm

Not Qualified

SPI

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00002 Amp

8 mm

3

N25Q128A11ESF40G

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

134217728 words

1.8

1.8

1

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

2 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

SPI

134217728 bit

1.7 V

30

260

NOR TYPE

.00001 Amp

10.3 mm

1.8

N25Q128A13E1241F

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

134217728 words

3

3/3.3

1

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

20

1 mm

85 Cel

128MX1

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

134217728 bit

2.7 V

e1

NOR TYPE

.0001 Amp

8 mm

3

S25FL128SDSMFV000

Infineon Technologies

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16777216 words

3

8

SMALL OUTLINE

1.27 mm

105 Cel

16MX8

16M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

3

3.6 V

2.65 mm

80 MHz

7.5 mm

500 ms

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

e3

10.3 mm

3

S29GL064S80TFV040

Infineon Technologies

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

105 Cel

8MX8

8M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

14 mm

67108864 bit

2.7 V

e3

18.4 mm

80 ns

3

S29GL512P11TFI020

Cypress Semiconductor

FLASH

INDUSTRIAL

56

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

110 mA

536870912 words

3

YES

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

512MX1

512M

-40 Cel

512

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

14 mm

Not Qualified

536870912 bit

2.7 V

8/16

e3

40

260

NOR TYPE

.000005 Amp

18.4 mm

YES

110 ns

3

YES

SST26VF016BT-104I/MF

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

16777216 words

3

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

100

1.27 mm

85 Cel

3-STATE

16MX1

16M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

Not Qualified

SPI

16777216 bit

2.7 V

e3

NOR TYPE

.000025 Amp

6 mm

3

W25Q01JVSFIQ

Winbond Electronics

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

134217728 words

3

8

SMALL OUTLINE

2

1.27 mm

85 Cel

128MX8

128M

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.64 mm

133 MHz

7.49 mm

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

10.31 mm

3

W25Q256JVFIM

Winbond Electronics

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

25 mA

33554432 words

3.3

8

SMALL OUTLINE

SOP16,.4

20

1.27 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.64 mm

100000 Write/Erase Cycles

133 MHz

7.49 mm

SPI

268435456 bit

3 V

ALSO OPERATES AT 104MHZ AT 2.7-3.0V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00002 Amp

10.31 mm

3.3

W25Q512JVBIQ

Winbond Electronics

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

40 mA

67108864 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

536870912 bit

3 V

ALSO OPERATES AT 2.7VMIN @104MHZ

NOR TYPE

.00006 Amp

8 mm

3.3

W25Q80DLZPIG

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

1048576 words

2.5

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

1MX8

1M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

80 MHz

5 mm

8388608 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

6 mm

2.7

W25Q80EWUXIETR

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

1048576 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

20

.5 mm

85 Cel

1MX8

1M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1.95 V

.6 mm

100000 Write/Erase Cycles

104 MHz

2 mm

SPI

8388608 bit

1.65 V

NOR TYPE

.0000075 Amp

3 mm

1.8

AM29LV320DB90EI

Spansion

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

30 mA

2097152 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.000005 Amp

18.4 mm

YES

90 ns

3

YES

AT25DF081A-SH-B

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

1048576 words

3/3.3

8

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

3-STATE

1MX8

1M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

2.16 mm

100000 Write/Erase Cycles

85 MHz

5.24 mm

Not Qualified

SPI

8388608 bit

2.7 V

e4

NOR TYPE

.00001 Amp

5.29 mm

AT25DF641-S3H-T

Atmel

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

19 mA

8388608 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

8MX8

8M

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE

R-PDSO-G16

3.6 V

2.65 mm

1000000 Write/Erase Cycles

85 MHz

7.5 mm

Not Qualified

5 ms

SPI

67108864 bit

2.7 V

e4

NOR TYPE

.000005 Amp

10.3 mm

2.7

AT25FF161A-MAHN-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

17.5 mA

2097152 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

20

.5 mm

85 Cel

3-STATE

2MX8

2M

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.6 mm

100000 Write/Erase Cycles

133 MHz

2 mm

SPI

16777216 bit

1.65 V

e4

NOR TYPE

.00005 Amp

3 mm

1.8

AT25SF321B-MHB-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

17 mA

4194304 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

20

1.27 mm

85 Cel

3-STATE

4MX8

4M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

108 MHz

5 mm

SPI

33554432 bit

2.7 V

e4

260

NOR TYPE

.000025 Amp

6 mm

3

AT25XE021A-XMHN-T

Renesas Electronics

FLASH

INDUSTRIAL

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2097152 words

1.8

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

2MX1

2M

-40 Cel

DUAL

R-PDSO-G8

1

3.6 V

1.2 mm

70 MHz

3 mm

2097152 bit

1.65 V

4.4 mm

1.8

AT25XE161D-MAHN-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

17.5 mA

2097152 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

20

.5 mm

85 Cel

3-STATE

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

.6 mm

100000 Write/Erase Cycles

108 MHz

2 mm

SPI

16777216 bit

1.65 V

NOR TYPE

.00005 Amp

3 mm

1.8

AT45DB321D-MU

Atmel

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

33554432 words

3

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

32MX1

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

1

3.6 V

1 mm

100000 Write/Erase Cycles

66 MHz

5 mm

Not Qualified

SPI

33554432 bit

2.7 V

ORGANIZED AS 8192 PAGES OF 528 BYTES EACH

e3

NOR TYPE

.00001 Amp

6 mm

2.7

CAT28F512LI-12

Catalyst Semiconductor

FLASH

INDUSTRIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

5

NO

5

8

IN-LINE

DIP32,.6

Flash Memories

2.54 mm

85 Cel

64KX8

64K

-40 Cel

YES

MATTE TIN

DUAL

R-PDIP-T32

5.5 V

5.08 mm

100000 Write/Erase Cycles

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

NOR TYPE

.00001 Amp

42.03 mm

120 ns

12

NO

CAT28F512LI12

Onsemi

FLASH

INDUSTRIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

5

NO

5

8

IN-LINE

DIP32,.6

Flash Memories

2.54 mm

85 Cel

64KX8

64K

-40 Cel

YES

TIN

DUAL

R-PDIP-T32

5.5 V

5.08 mm

100000 Write/Erase Cycles

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

260

NOR TYPE

.00001 Amp

42.03 mm

120 ns

12

NO

EM02APYD4-BA000-2

Delkin Devices

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2147483648 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

2GX8

2G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

17179869184 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

13 mm

3.3

EM04APGD4-BA000-2

Delkin Devices

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

4GX8

4G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

34359738368 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

13 mm

3.3

GLS85VM1016B-M-I-LFWE-ND212

Greenliant Systems

FLASH CARD

INDUSTRIAL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

3

8

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

16GX8

16G

-40 Cel

BOTTOM

R-PBGA-B100

3.3 V

1.4 mm

52 MHz

14 mm

137438953472 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

18 mm

2.7

M25PE16-VMW6TG

STMicroelectronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

2MX8

2M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

2.5 mm

100000 Write/Erase Cycles

50 MHz

5.99 mm

Not Qualified

15 ms

SPI

16777216 bit

2.7 V

e3

NOR TYPE

.00001 Amp

5.3 mm

2.7

M29DW128G70NF6E

STMicroelectronics

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

32K,128K

15 mA

8388608 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

8,62

YES

YES

DUAL

R-PDSO-G56

Not Qualified

BOTTOM/TOP

134217728 bit

8

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W320DB70N6

STMicroelectronics

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

2097152 words

3.3

YES

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

33554432 bit

3 V

BOTTOM BOOT BLOCK

e0

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

M29W320DB70N6F

STMicroelectronics

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

2097152 words

3.3

YES

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

1,2,1,63

YES

TIN/TIN BISMUTH

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

33554432 bit

3 V

BOTTOM BOOT BLOCK

e3/e6

NOT SPECIFIED

260

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

MTFC16GAKAENA-4MIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16GX8

16G

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B100

3

3.6 V

1.2 mm

14 mm

137438953472 bit

2.7 V

e1

30

260

18 mm

2.7

MTFC16GAPALNA-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

14 mm

137438953472 bit

2.7 V

e1

30

260

18 mm

2.7

MX25UM51245GXDI00

Macronix

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

1

1 mm

85 Cel

64MX8

64M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

200 MHz

6 mm

536870912 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

N25Q032A13ESE40G

Micron Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

4194304 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

4MX8

4M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

108 MHz

5.285 mm

Not Qualified

SPI

33554432 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

5.285 mm

2.7

S25FL128SAGBHI300

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,4X6,40

2

Flash Memories

20

1 mm

85 Cel

32MX4

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

134217728 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

NOR TYPE

.0001 Amp

8 mm

3

S25FS064SAGBHB020

Infineon Technologies

FLASH

INDUSTRIAL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

8388608 words

1.8

8

GRID ARRAY

BGA24,5X5,40

1

20

1 mm

105 Cel

NO

8MX8

8M

-40 Cel

BOTTOM

R-PBGA-B24

3

2 V

1.2 mm

133 MHz

6 mm

SPI

67108864 bit

1.7 V

.00009 Amp

8 mm

1.8

S25FS064SAGBHB023

Infineon Technologies

FLASH

INDUSTRIAL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

100 mA

8388608 words

1.8

8

GRID ARRAY

BGA24,5X5,40

1

20

1 mm

105 Cel

NO

8MX8

8M

-40 Cel

BOTTOM

R-PBGA-B24

3

2 V

1.2 mm

133 MHz

6 mm

SPI

67108864 bit

1.7 V

.00009 Amp

8 mm

1.8

S29AL004D70TFI010

Cypress Semiconductor

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

262144 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

256KX16

256K

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

4194304 bit

2.7 V

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

18.4 mm

70 ns

3

S29GL032N90TFI010

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

64K

50 mA

2097152 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

64

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM/TOP

33554432 bit

2.7 V

8/16

e3

40

260

NOR TYPE

.000005 Amp

18.4 mm

YES

90 ns

3

YES

S29GL064N90FAI030

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

TOP

67108864 bit

2.7 V

8/16

e0

260

NOR TYPE

.000005 Amp

13 mm

YES

90 ns

3

YES

S29GL128P11FFIV22

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

110 mA

134217728 words

3

YES

1.8/3.3,3/3.3

1

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

128MX1

128M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

134217728 bit

2.7 V

8/16

e1

40

260

NOR TYPE

.000005 Amp

13 mm

YES

110 ns

3

YES

S29GL256P10TFI020

Infineon Technologies

FLASH

INDUSTRIAL

56

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

110 mA

268435456 words

3

YES

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

256MX1

256M

-40 Cel

256

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

14 mm

Not Qualified

268435456 bit

2.7 V

8/16

e3

40

260

NOR TYPE

.000005 Amp

18.4 mm

YES

100 ns

3

YES

S34MS01G100BHI000

Cypress Semiconductor

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

134217728 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,8X12,32

Flash Memories

.8 mm

85 Cel

128MX8

128M

-40 Cel

1K

YES

YES

BOTTOM

R-PBGA-B63

3

1.95 V

1 mm

9 mm

Not Qualified

1073741824 bit

1.7 V

2K

260

SLC NAND TYPE

.00005 Amp

11 mm

45 ns

1.8

NO

SST25WF080BT-40I/SN

Microchip Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

SERIAL

SYNCHRONOUS

15 mA

8388608 words

1.8

1

SMALL OUTLINE

SOP8,.23

20

1.27 mm

85 Cel

3-STATE

8MX1

8M

-40 Cel

MATTE TIN

DUAL

1

SOFTWARE

R-PDSO-G8

1.95 V

1.75 mm

100000 Write/Erase Cycles

40 MHz

3.9 mm

SPI

8388608 bit

1.65 V

e3

NOR TYPE

.00001 Amp

4.9 mm

1.8

TC58NVG2S3ETAI0

Toshiba

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

ASYNCHRONOUS

128K

30 mA

536870912 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

Not Qualified

4294967296 bit

2.7 V

2K

10

260

.00005 Amp

18.4 mm

25 ns

3.3

NO

TE28F128J3D75B

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

80 mA

8388608 words

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

DUAL

R-PDSO-G56

Not Qualified

134217728 bit

4/8

30

235

NOR TYPE

.00012 Amp

YES

75 ns

NO

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.