Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
134217728 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
18.4 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
134217728 words |
3.3 |
NO |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
1073741824 bit |
2.7 V |
2K |
e1 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
3.3 |
NO |
||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
NO |
8 |
GRID ARRAY, THIN PROFILE |
BGA100,10X15,40 |
1 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
NO |
TIN SILVER COPPER |
YES |
BOTTOM |
HARDWARE |
R-PBGA-B100 |
3.6 V |
1.2 mm |
200 MHz |
14 mm |
549755813888 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
18 mm |
2.7 |
NO |
||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
3/3.3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
1 |
Flash Memories |
20 |
1 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
86 MHz |
6 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
134217728 words |
1.8 |
1.8 |
1 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
2 V |
2.65 mm |
100000 Write/Erase Cycles |
108 MHz |
7.5 mm |
Not Qualified |
SPI |
134217728 bit |
1.7 V |
30 |
260 |
NOR TYPE |
.00001 Amp |
10.3 mm |
1.8 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
20 mA |
134217728 words |
3 |
3/3.3 |
1 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
Flash Memories |
20 |
1 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
108 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
e1 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
|||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
80 MHz |
7.5 mm |
500 ms |
134217728 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
e3 |
10.3 mm |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
14 mm |
67108864 bit |
2.7 V |
e3 |
18.4 mm |
80 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3 |
YES |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e3 |
NOR TYPE |
.000025 Amp |
6 mm |
3 |
||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
3 |
8 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.64 mm |
133 MHz |
7.49 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.31 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.64 mm |
100000 Write/Erase Cycles |
133 MHz |
7.49 mm |
SPI |
268435456 bit |
3 V |
ALSO OPERATES AT 104MHZ AT 2.7-3.0V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
10.31 mm |
3.3 |
||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
40 mA |
67108864 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
4 |
20 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
3 V |
ALSO OPERATES AT 2.7VMIN @104MHZ |
NOR TYPE |
.00006 Amp |
8 mm |
3.3 |
|||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1048576 words |
2.5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
80 MHz |
5 mm |
8388608 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
1048576 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.6 mm |
100000 Write/Erase Cycles |
104 MHz |
2 mm |
SPI |
8388608 bit |
1.65 V |
NOR TYPE |
.0000075 Amp |
3 mm |
1.8 |
||||||||||||||||||||||||||||
Spansion |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
30 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
1048576 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
85 MHz |
5.24 mm |
Not Qualified |
SPI |
8388608 bit |
2.7 V |
e4 |
NOR TYPE |
.00001 Amp |
5.29 mm |
|||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
19 mA |
8388608 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
1000000 Write/Erase Cycles |
85 MHz |
7.5 mm |
Not Qualified |
5 ms |
SPI |
67108864 bit |
2.7 V |
e4 |
NOR TYPE |
.000005 Amp |
10.3 mm |
2.7 |
||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
133 MHz |
2 mm |
SPI |
16777216 bit |
1.65 V |
e4 |
NOR TYPE |
.00005 Amp |
3 mm |
1.8 |
|||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
108 MHz |
5 mm |
SPI |
33554432 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.000025 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
1.2 mm |
70 MHz |
3 mm |
2097152 bit |
1.65 V |
4.4 mm |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
108 MHz |
2 mm |
SPI |
16777216 bit |
1.65 V |
NOR TYPE |
.00005 Amp |
3 mm |
1.8 |
||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
66 MHz |
5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
ORGANIZED AS 8192 PAGES OF 528 BYTES EACH |
e3 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
|||||||||||||||||||||
|
Catalyst Semiconductor |
FLASH |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
YES |
MATTE TIN |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
NOR TYPE |
.00001 Amp |
42.03 mm |
120 ns |
12 |
NO |
|||||||||||||||||||||||
|
Onsemi |
FLASH |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
YES |
TIN |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
260 |
NOR TYPE |
.00001 Amp |
42.03 mm |
120 ns |
12 |
NO |
||||||||||||||||||||||
|
Delkin Devices |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
17179869184 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||||||
|
Delkin Devices |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
34359738368 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH CARD |
INDUSTRIAL |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.3 V |
1.4 mm |
52 MHz |
14 mm |
137438953472 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
18 mm |
2.7 |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.5 mm |
100000 Write/Erase Cycles |
50 MHz |
5.99 mm |
Not Qualified |
15 ms |
SPI |
16777216 bit |
2.7 V |
e3 |
NOR TYPE |
.00001 Amp |
5.3 mm |
2.7 |
|||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
32K,128K |
15 mA |
8388608 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
8,62 |
YES |
YES |
DUAL |
R-PDSO-G56 |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
8 |
NOR TYPE |
.0001 Amp |
YES |
70 ns |
YES |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
2097152 words |
3.3 |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
1,2,1,63 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
3 V |
BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
2097152 words |
3.3 |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
1,2,1,63 |
YES |
TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
3 V |
BOTTOM BOOT BLOCK |
e3/e6 |
NOT SPECIFIED |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B100 |
3 |
3.6 V |
1.2 mm |
14 mm |
137438953472 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
137438953472 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
67108864 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
200 MHz |
6 mm |
536870912 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.285 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
5.285 mm |
2.7 |
|||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
GRID ARRAY, THIN PROFILE |
BGA24,4X6,40 |
2 |
Flash Memories |
20 |
1 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
134217728 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
|||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
8388608 words |
1.8 |
8 |
GRID ARRAY |
BGA24,5X5,40 |
1 |
20 |
1 mm |
105 Cel |
NO |
8MX8 |
8M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
2 V |
1.2 mm |
133 MHz |
6 mm |
SPI |
67108864 bit |
1.7 V |
.00009 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
8388608 words |
1.8 |
8 |
GRID ARRAY |
BGA24,5X5,40 |
1 |
20 |
1 mm |
105 Cel |
NO |
8MX8 |
8M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
2 V |
1.2 mm |
133 MHz |
6 mm |
SPI |
67108864 bit |
1.7 V |
.00009 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
TOP |
4194304 bit |
2.7 V |
ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
18.4 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
64 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
BOTTOM/TOP |
33554432 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
TIN LEAD |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
8/16 |
e0 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
134217728 words |
3 |
YES |
1.8/3.3,3/3.3 |
1 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
134217728 bit |
2.7 V |
8/16 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
268435456 words |
3 |
YES |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
256 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,8X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
1073741824 bit |
1.7 V |
2K |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
45 ns |
1.8 |
NO |
||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
8388608 words |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.23 |
20 |
1.27 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1.95 V |
1.75 mm |
100000 Write/Erase Cycles |
40 MHz |
3.9 mm |
SPI |
8388608 bit |
1.65 V |
e3 |
NOR TYPE |
.00001 Amp |
4.9 mm |
1.8 |
|||||||||||||||||||||||
|
Toshiba |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
10 |
260 |
.00005 Amp |
18.4 mm |
25 ns |
3.3 |
NO |
||||||||||||||||||||||
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
128K |
80 mA |
8388608 words |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
YES |
DUAL |
R-PDSO-G56 |
Not Qualified |
134217728 bit |
4/8 |
30 |
235 |
NOR TYPE |
.00012 Amp |
YES |
75 ns |
NO |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.