Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.8 mm |
105 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.6 mm |
133 MHz |
3 mm |
33554432 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
67108864 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.49 mm |
SPI |
536870912 bit |
2.3 V |
e3 |
10 |
260 |
NOR TYPE |
.00014 Amp |
10.31 mm |
3 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
67108864 bit |
2.65 V |
ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT |
e3 |
NOR TYPE |
.00002 Amp |
8 mm |
3.3 |
||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
2 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.23 mm |
SPI |
134217728 bit |
1.65 V |
NOR TYPE |
.000005 Amp |
5.28 mm |
1.8 |
|||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
8 |
YES |
Tin/Bismuth (Sn/Bi) |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
4.5 V |
e6 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
70 ns |
5 |
YES |
||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
30 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.3 mm |
6 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e1 |
10 |
260 |
NOR TYPE |
.000015 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
8/16 |
e1 |
30 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
268435456 words |
3 |
YES |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
256 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
8K,64K |
45 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Western Digital |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
15 |
.5 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
TIN SILVER COPPER NICKEL GERMANIUM |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
67108864 bit |
1.65 V |
e3 |
NOR TYPE |
.000015 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
1K |
YES |
Matte Tin (Sn) - annealed |
YES |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
BOTTOM BOOT BLOCK |
4 |
e3 |
40 |
260 |
NOR TYPE |
.00003 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
1K |
YES |
Matte Tin (Sn) - annealed |
YES |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
BOTTOM BOOT BLOCK |
4 |
e3 |
40 |
260 |
NOR TYPE |
.00003 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||
Toshiba |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
536870912 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
4294967296 bit |
2.7 V |
SLC NAND TYPE |
18.4 mm |
3.3 |
|||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18 mA |
16777216 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
85 MHz |
5.24 mm |
SPI |
16777216 bit |
2.3 V |
.00005 Amp |
5.29 mm |
1.8 |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18 mA |
16777216 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
85 MHz |
3.9 mm |
SPI |
16777216 bit |
2.3 V |
.00005 Amp |
4.925 mm |
1.8 |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
26 mA |
16777216 words |
3 |
2.5/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
70 MHz |
5 mm |
Not Qualified |
SPI |
16777216 bit |
2.3 V |
e4 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N8 |
1 |
3.6 V |
1 mm |
85 MHz |
6 mm |
33554432 bit |
2.3 V |
e4 |
8 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
17179869184 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
17179869184 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8388608 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
166 MHz |
6 mm |
67108864 bit |
2.7 V |
e3 |
30 |
260 |
8 mm |
3 |
|||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1048576 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
105 Cel |
1MX8 |
1M |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
133 MHz |
5.28 mm |
8388608 bit |
2.3 V |
e3 |
10 |
260 |
5.28 mm |
3 |
||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
30 mA |
33554432 words |
1.8 |
8 |
SMALL OUTLINE |
SOLCC8,.3 |
20 |
1.27 mm |
105 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.85 mm |
100000 Write/Erase Cycles |
166 MHz |
6 mm |
SPI |
268435456 bit |
1.65 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00003 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
1 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
75 MHz |
7.5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e3 |
NOR TYPE |
.00001 Amp |
10.3 mm |
2.7 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.4 mm |
11 mm |
134217728 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
70 ns |
3 |
|||||||||||||||||||||||||||||||
Micron Technology |
FLASH MODULE |
INDUSTRIAL |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
137438953472 words |
8 |
95 Cel |
128GX8 |
128G |
-40 Cel |
BOTTOM |
R-XBGA-B |
1099511627776 bit |
TLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
104 MHz |
7.52 mm |
134217728 bit |
2.7 V |
ALSO HAVING 1-BIT MEMORY WIDTH |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
6 mA |
4194304 words |
1.8 |
8 |
SMALL OUTLINE |
SOP8,.3 |
2 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
80 MHz |
5.23 mm |
SPI |
33554432 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000024 Amp |
5.28 mm |
1.8 |
||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
2MX4 |
2M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
104 MHz |
3.9 mm |
8388608 bit |
1.65 V |
IT IS ALSO CONFIGURED AS 8M X 1 |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
268435456 words |
1.8 |
1.8 |
1 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
2 V |
2.5 mm |
100000 Write/Erase Cycles |
108 MHz |
7.5 mm |
Not Qualified |
SPI |
268435456 bit |
1.7 V |
SPI-COMPATIBLE SERIAL BUS INTERFACE |
30 |
260 |
NOR TYPE |
.00002 Amp |
10.3 mm |
1.8 |
||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
12 mA |
524288 words |
3.3 |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
20 |
.5 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
3 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
55 ns |
3 |
YES |
|||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
1073741824 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
100 ns |
2.7 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
8/16 |
e1 |
30 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||
|
Western Digital |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
15 |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3.3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
20 |
1.27 mm |
105 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
40 MHz |
3.9 mm |
SPI |
4194304 bit |
2.3 V |
e3 |
NOR TYPE |
.00001 Amp |
4.9 mm |
3.3 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
4K |
30 mA |
131072 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
32 |
YES |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3 |
40 |
245 |
NOR TYPE |
.000015 Amp |
13.97 mm |
70 ns |
3 |
YES |
|||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
15 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
1 |
R-PBGA-B48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e1 |
NOR TYPE |
.00005 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
45 mA |
2097152 words |
3 |
YES |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
100 |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
YES |
BOTTOM |
1 |
R-PBGA-B48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT-BLOCK |
NOR TYPE |
.00005 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2K |
30 mA |
262144 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
100 |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
128 |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
6 mm |
Not Qualified |
4194304 bit |
2.7 V |
e1 |
40 |
260 |
NOR TYPE |
.00002 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
18.4 mm |
90 ns |
5 |
||||||||||||||||||||||||||||||
|
Spansion |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
30 mA |
8388608 words |
3.3 |
YES |
3.3,3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
128 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
67108864 bit |
3 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||||
Advanced Micro Devices |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
TSSOP48,.8,20 |
8 |
Flash Memories |
20 |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
EMBEDDED ALGORITHMS; 20 YEARS DATA RETENTION; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
Spansion |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
14 mA |
4194304 words |
3 |
2.5/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
2 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
50 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.3 V |
e4 |
260 |
NOR TYPE |
.000015 Amp |
4.925 mm |
2.7 |
|||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
5 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e4 |
30 |
260 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
||||||||||||||||||||
|
Dialog Semiconductor |
FLASH |
INDUSTRIAL |
8 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
134217728 words |
3.3 |
1 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
TIN |
BOTTOM |
R-PBGA-B8 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
134217728 bit |
3 V |
e3 |
8 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16.5 mA |
2097152 words |
3.3 |
16 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
33554432 bit |
2.7 V |
ALSO OPERATES AT 108MHZ @1.65V MINIMUM SUPPLY |
e4 |
260 |
NOR TYPE |
.00005 Amp |
5 mm |
1.8 |
||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
1048576 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
1MX1 |
1M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
66 MHz |
5.24 mm |
Not Qualified |
SPI |
1048576 bit |
2.7 V |
e4 |
NOR TYPE |
.000015 Amp |
5.29 mm |
2.7 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.