Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
32 |
YES |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
245 |
NOR TYPE |
.0001 Amp |
13.97 mm |
55 ns |
5 |
YES |
|||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.16,32 |
1 |
20 |
.8 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-N8 |
3.6 V |
.5 mm |
100000 Write/Erase Cycles |
133 MHz |
4 mm |
SPI |
67108864 bit |
3 V |
IT ALSO OPERATES AT 2.7V @ 104MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00005 Amp |
4 mm |
3.3 |
|||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
26 mA |
16777216 words |
3 |
2.5/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
70 MHz |
3.9 mm |
Not Qualified |
SPI |
16777216 bit |
2.3 V |
e4 |
NOR TYPE |
.00001 Amp |
4.925 mm |
2.7 |
||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8388608 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.85 mm |
133 MHz |
6 mm |
67108864 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
134217728 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.85 mm |
104 MHz |
6 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
8 mm |
3.3 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.3 mm |
100000 Write/Erase Cycles |
75 MHz |
7.5 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.00001 Amp |
10.3 mm |
2.7 |
|||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
524288 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
50 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST |
e0 |
NOR TYPE |
.00001 Amp |
4.9 mm |
2.7 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
.000015 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX8 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
268435456 bit |
2.7 V |
ALSO CONFIGURABLE AS 256M X 1 |
e3 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
105 Cel |
128MX16 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
2147483648 bit |
2.7 V |
13 mm |
110 ns |
3 |
||||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8 mA |
4194304 words |
1.8 |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1.95 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0000075 Amp |
4.85 mm |
1.8 |
|||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.64 mm |
133 MHz |
7.49 mm |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.31 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
4194304 words |
3 |
2.5/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
Flash Memories |
20 |
.5 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
104 MHz |
2 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
IT ALSO OPERATES AT 2.3 V AT 80 MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
3 mm |
2.7 |
||||||||||||||||||||||
Infineon Technologies |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
10 |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
YES |
QUAD |
R-PQCC-J32 |
5.25 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
TOP |
2097152 bit |
4.75 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
55 ns |
5 |
YES |
|||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
25 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.65 V |
e3 |
260 |
NOR TYPE |
.000025 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
16777216 bit |
2.3 V |
e3 |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
24 |
TBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
29 mA |
8388608 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
1 |
20 |
1 mm |
105 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
S-PBGA-B24 |
1.95 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
67108864 bit |
1.65 V |
e1 |
10 |
260 |
NOR TYPE |
.000035 Amp |
5 mm |
1.8 |
||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
524288 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3/e6 |
NOT SPECIFIED |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
137438953472 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3.6 V |
2.16 mm |
120 MHz |
5.23 mm |
134217728 bit |
2.7 V |
CAN BE ORGANISED AS 128 M X 1 |
e3 |
5.28 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
2 |
.8 mm |
85 Cel |
16MX4 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
3 |
3.6 V |
.6 mm |
108 MHz |
4 mm |
67108864 bit |
2.7 V |
IT ALSO HAVE X1 MEMORY WIDTH |
e3 |
4 mm |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
50 mA |
33554432 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
268435456 bit |
2.7 V |
NOR TYPE |
.00006 Amp |
8 mm |
3 |
||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
2 |
Flash Memories |
20 |
1 mm |
105 Cel |
64MX4 |
64M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
268435456 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
e1 |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
4 |
20 |
1 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
80 MHz |
6 mm |
SPI |
512753664 bit |
2.7 V |
e1 |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
|||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
2 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
2 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
134217728 bit |
1.7 V |
e3 |
NOR TYPE |
.0003 Amp |
6 mm |
1.8 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||
|
Swissbit Ag |
FLASH CARD |
INDUSTRIAL |
50 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1073741824 words |
3.3 |
8 |
UNCASED CHIP |
85 Cel |
1GX8 |
1G |
-40 Cel |
UPPER |
R-XUUC-N50 |
3.63 V |
4.1 mm |
36.4 mm |
8589934592 bit |
2.97 V |
ALSO OPERATES AT 5V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
42.8 mm |
300 ns |
3.3 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
100 |
1.27 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
8388608 bit |
1.65 V |
e3 |
NOR TYPE |
.000005 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4194304 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
33554432 bit |
3 V |
2.7V NOMINAL AVAILABLE WITH 104MHZ |
e1 |
260 |
8 mm |
3 |
|||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
8388608 words |
1.8 |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1.95 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
Not Qualified |
SPI |
8388608 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0000075 Amp |
4.85 mm |
1.8 |
|||||||||||||||||||||||
|
Spansion |
FLASH |
INDUSTRIAL |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
4194304 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
64 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G40 |
3 |
5.5 V |
1.2 mm |
10 mm |
Not Qualified |
33554432 bit |
4.5 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
5 |
YES |
||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
SPI |
33554432 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.000025 Amp |
4.925 mm |
3 |
|||||||||||||||||||||||
|
Gigadevice Semiconductor |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
20 |
.5 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
3.6 V |
.5 mm |
100000 Write/Erase Cycles |
120 MHz |
2 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.000005 Amp |
3 mm |
3.3 |
|||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
105 Cel |
64MX1 |
64M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
133 MHz |
6 mm |
67108864 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
50 MHz |
7.5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION |
e4 |
NOR TYPE |
.0001 Amp |
10.3 mm |
2.7 |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
1M |
50 mA |
17179869184 words |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
16K |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
137438953472 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
536870912 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
Not Qualified |
4294967296 bit |
1.7 V |
2K |
e1 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
108 MHz |
7.5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
4194304 words |
3 |
YES |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
20 |
1 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
128 |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
11 mm |
67108864 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.0001 Amp |
13 mm |
70 ns |
3 |
YES |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
16777216 words |
3 |
YES |
3/3.3 |
8 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
9 mm |
Not Qualified |
134217728 bit |
2.7 V |
16 |
e1 |
30 |
260 |
NOR TYPE |
.0001 Amp |
9 mm |
YES |
100 ns |
2.7 |
YES |
||||||||||||||||
|
Western Digital |
FLASH |
INDUSTRIAL |
RECTANGULAR |
UNSPECIFIED |
1 |
CMOS |
AEC-Q100 |
UNSPECIFIED |
ASYNCHRONOUS |
17179869184 words |
8 |
85 Cel |
16GX8 |
16G |
-40 Cel |
3.6 V |
137438953472 bit |
2.7 V |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
DUAL |
1 |
SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
50 MHz |
5 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.00002 Amp |
6 mm |
||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
100 |
1.27 mm |
105 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
104 MHz |
7.5 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000045 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
35 mA |
1073741824 words |
3 |
3/3.3 |
1 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
Flash Memories |
10 |
1 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.00005 Amp |
8 mm |
3 |
|||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
2 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
66 MHz |
5.24 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
ORGANIZED AS 2048 PAGES OF 264 BYTES EACH |
e3 |
40 |
260 |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
|||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
16MX8 |
16M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
166 MHz |
6 mm |
134217728 bit |
2.3 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
50 MHz |
5 mm |
Not Qualified |
15 ms |
SPI |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
1073741824 words |
3 |
1 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
1GX1 |
1G |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.