INDUSTRIAL Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

SST39SF010A-55-4I-NHE

Microchip Technology

FLASH

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

4K

35 mA

131072 words

5

YES

5

8

CHIP CARRIER

LDCC32,.5X.6

Flash Memories

100

1.27 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

32

YES

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

100000 Write/Erase Cycles

11.43 mm

Not Qualified

1048576 bit

4.5 V

e3

40

245

NOR TYPE

.0001 Amp

13.97 mm

55 ns

5

YES

W25Q64JVXGIQ

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

8388608 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.16,32

1

20

.8 mm

85 Cel

3-STATE

8MX8

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-N8

3.6 V

.5 mm

100000 Write/Erase Cycles

133 MHz

4 mm

SPI

67108864 bit

3 V

IT ALSO OPERATES AT 2.7V @ 104MHZ

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00005 Amp

4 mm

3.3

AT45DB161E-SSHF2B-T

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

26 mA

16777216 words

3

2.5/3.3

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

16MX1

16M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

1.75 mm

100000 Write/Erase Cycles

70 MHz

3.9 mm

Not Qualified

SPI

16777216 bit

2.3 V

e4

NOR TYPE

.00001 Amp

4.925 mm

2.7

IS25WP064A-JLLE

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

8388608 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

105 Cel

8MX8

8M

-40 Cel

DUAL

R-PDSO-N8

1.95 V

.85 mm

133 MHz

6 mm

67108864 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

8 mm

1.8

IS37SML01G1-LLI

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

134217728 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

128MX8

128M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.85 mm

104 MHz

6 mm

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

8 mm

3.3

M25P16-VMF6PBA

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.3 mm

100000 Write/Erase Cycles

75 MHz

7.5 mm

Not Qualified

SPI

16777216 bit

2.7 V

30

260

NOR TYPE

.00001 Amp

10.3 mm

2.7

M25P40-VMN6

STMicroelectronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

524288 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

512KX8

512K

-40 Cel

TIN LEAD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

50 MHz

3.9 mm

Not Qualified

SPI

4194304 bit

2.7 V

40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST

e0

NOR TYPE

.00001 Amp

4.9 mm

2.7

MX29LV160DBTI-70G

Macronix

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e3

NOR TYPE

.000015 Amp

18.4 mm

YES

70 ns

3

YES

S25FL256SAGMFIG01

Infineon Technologies

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

2

Flash Memories

20

1.27 mm

85 Cel

32MX8

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

133 MHz

7.5 mm

Not Qualified

500 ms

SPI

BOTTOM

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 256M X 1

e3

NOR TYPE

.0001 Amp

10.3 mm

3

S70GL02GS11FHV020

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

105 Cel

128MX16

128M

-40 Cel

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

2147483648 bit

2.7 V

13 mm

110 ns

3

W25Q40EWSNIG

Winbond Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

8 mA

4194304 words

1.8

1.8

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

4MX1

4M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1.95 V

1.75 mm

100000 Write/Erase Cycles

104 MHz

3.9 mm

Not Qualified

SPI

4194304 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0000075 Amp

4.85 mm

1.8

W25Q512JVFIM

Winbond Electronics

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

67108864 words

3

8

SMALL OUTLINE

1

1.27 mm

85 Cel

64MX8

64M

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.64 mm

133 MHz

7.49 mm

536870912 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

10.31 mm

3

W25X40CLUXIG

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

4194304 words

3

2.5/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.11,20

Flash Memories

20

.5 mm

85 Cel

4MX1

4M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.6 mm

100000 Write/Erase Cycles

104 MHz

2 mm

Not Qualified

SPI

4194304 bit

2.7 V

IT ALSO OPERATES AT 2.3 V AT 80 MHZ

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000005 Amp

3 mm

2.7

AM29F002BT-55JF

Infineon Technologies

FLASH

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

40 mA

262144 words

5

YES

8

CHIP CARRIER

LDCC32,.5X.6

10

1.27 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

1,2,1,3

YES

YES

QUAD

R-PQCC-J32

5.25 V

3.556 mm

1000000 Write/Erase Cycles

11.43 mm

TOP

2097152 bit

4.75 V

NOR TYPE

.000005 Amp

13.97 mm

55 ns

5

YES

AT49BV163D-70TU

Atmel

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

25 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

8,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

16777216 bit

2.65 V

e3

260

NOR TYPE

.000025 Amp

18.4 mm

YES

70 ns

3

YES

IS25LP016D-JLLE

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

2097152 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

1

20

1.27 mm

105 Cel

3-STATE

2MX8

2M

-40 Cel

Tin (Sn)

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

16777216 bit

2.3 V

e3

NOR TYPE

.00002 Amp

8 mm

3

IS25WP064A-RHLE

Integrated Silicon Solution

FLASH

INDUSTRIAL

24

TBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

29 mA

8388608 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

20

1 mm

105 Cel

3-STATE

8MX8

8M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

S-PBGA-B24

1.95 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

5 mm

SPI

67108864 bit

1.65 V

e1

10

260

NOR TYPE

.000035 Amp

5 mm

1.8

M29W800DB70N6E

STMicroelectronics

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

524288 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

TIN/TIN BISMUTH

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

8388608 bit

2.7 V

BOTTOM BOOT BLOCK

e3/e6

NOT SPECIFIED

260

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

MTFC16GAPALNA-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

14 mm

137438953472 bit

2.7 V

e1

30

260

18 mm

2.7

MX25L12845GM2I-08G

Macronix

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

33554432 words

3

4

SMALL OUTLINE

2

1.27 mm

85 Cel

32MX4

32M

-40 Cel

TIN

DUAL

R-PDSO-G8

3.6 V

2.16 mm

120 MHz

5.23 mm

134217728 bit

2.7 V

CAN BE ORGANISED AS 128 M X 1

e3

5.28 mm

3

S25FL064LABNFI011

Infineon Technologies

FLASH

INDUSTRIAL

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

.8 mm

85 Cel

16MX4

16M

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

3

3.6 V

.6 mm

108 MHz

4 mm

67108864 bit

2.7 V

IT ALSO HAVE X1 MEMORY WIDTH

e3

4 mm

3

S25FL256LAGBHI023

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

50 mA

33554432 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

268435456 bit

2.7 V

NOR TYPE

.00006 Amp

8 mm

3

S25FL256SAGBHV200

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

67108864 words

3

3/3.3

4

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

Flash Memories

20

1 mm

105 Cel

64MX4

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

500 ms

SPI

268435456 bit

2.7 V

ALSO CONFIGURABLE AS 128M X 1

e1

NOR TYPE

.0003 Amp

8 mm

3

S25FL512SDSBHI210

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

20

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

80 MHz

6 mm

SPI

512753664 bit

2.7 V

e1

NOR TYPE

.0003 Amp

8 mm

3

S25FS128SAGNFI100

Infineon Technologies

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

2

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

2 V

.8 mm

100000 Write/Erase Cycles

133 MHz

5 mm

SPI

134217728 bit

1.7 V

e3

NOR TYPE

.0003 Amp

6 mm

1.8

S34ML04G200TFI000

Cypress Semiconductor

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

30 mA

536870912 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

4294967296 bit

2.7 V

2K

e3

260

SLC NAND TYPE

.00005 Amp

18.4 mm

25 ns

3

NO

SFCF1024H1BK2MT-I-MO-553-SMA

Swissbit Ag

FLASH CARD

INDUSTRIAL

50

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

PARALLEL

SYNCHRONOUS

1073741824 words

3.3

8

UNCASED CHIP

85 Cel

1GX8

1G

-40 Cel

UPPER

R-XUUC-N50

3.63 V

4.1 mm

36.4 mm

8589934592 bit

2.97 V

ALSO OPERATES AT 5V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

42.8 mm

300 ns

3.3

SST26WF080B-104I/MF

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

8388608 words

1.8

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

100

1.27 mm

85 Cel

3-STATE

8MX1

8M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

1.95 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

SPI

8388608 bit

1.65 V

e3

NOR TYPE

.000005 Amp

6 mm

1.8

W25Q32JVTBIQ

Winbond Electronics

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

4194304 words

3.3

8

GRID ARRAY, THIN PROFILE

1

1 mm

85 Cel

4MX8

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

33554432 bit

3 V

2.7V NOMINAL AVAILABLE WITH 104MHZ

e1

260

8 mm

3

W25Q80EWSNIG

Winbond Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

8388608 words

1.8

1.8

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

8MX1

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1.95 V

1.75 mm

100000 Write/Erase Cycles

104 MHz

3.9 mm

Not Qualified

SPI

8388608 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0000075 Amp

4.85 mm

1.8

AM29F032B-90EF

Spansion

FLASH

INDUSTRIAL

40

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

64K

60 mA

4194304 words

5

YES

5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP40,.8,20

Flash Memories

.5 mm

85 Cel

4MX8

4M

-40 Cel

64

YES

MATTE TIN

YES

DUAL

R-PDSO-G40

3

5.5 V

1.2 mm

10 mm

Not Qualified

33554432 bit

4.5 V

e3

40

260

NOR TYPE

.000005 Amp

18.4 mm

90 ns

5

YES

AT25SF321B-SSHB-B

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17 mA

4194304 words

3

8

SMALL OUTLINE

SOP8,.25

20

1.27 mm

85 Cel

3-STATE

4MX8

4M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

1.75 mm

100000 Write/Erase Cycles

108 MHz

3.9 mm

SPI

33554432 bit

2.7 V

e4

260

NOR TYPE

.000025 Amp

4.925 mm

3

GD25Q16CEIGR

Gigadevice Semiconductor

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

2097152 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.11,20

20

.5 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-XDSO-N8

3.6 V

.5 mm

100000 Write/Erase Cycles

120 MHz

2 mm

SPI

16777216 bit

2.7 V

NOR TYPE

.000005 Amp

3 mm

3.3

IS25LP064A-JLLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

67108864 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

105 Cel

64MX1

64M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

133 MHz

6 mm

67108864 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

M25P128-VMF6TP

STMicroelectronics

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

10000 Write/Erase Cycles

50 MHz

7.5 mm

Not Qualified

SPI

134217728 bit

2.7 V

MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION

e4

NOR TYPE

.0001 Amp

10.3 mm

2.7

MT29F128G08AJAAAWP-IT:A

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

1M

50 mA

17179869184 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

16GX8

16G

-40 Cel

16K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F4G08ABBDAHC-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

536870912 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

10.5 mm

Not Qualified

4294967296 bit

1.7 V

2K

e1

30

260

SLC NAND TYPE

.00005 Amp

13 mm

25 ns

1.8

NO

N25Q128A13ESF40F

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

10.3 mm

3

S29GL064S70FHI010

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

80 mA

4194304 words

3

YES

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

20

1 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

128

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

67108864 bit

2.7 V

8/16

e1

NOR TYPE

.0001 Amp

13 mm

70 ns

3

YES

S29GL128S10DHI010

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

80 mA

16777216 words

3

YES

3/3.3

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

9 mm

Not Qualified

134217728 bit

2.7 V

16

e1

30

260

NOR TYPE

.0001 Amp

9 mm

YES

100 ns

2.7

YES

SDIN8DE2-16G-XA

Western Digital

FLASH

INDUSTRIAL

RECTANGULAR

UNSPECIFIED

1

CMOS

AEC-Q100

UNSPECIFIED

ASYNCHRONOUS

17179869184 words

8

85 Cel

16GX8

16G

-40 Cel

3.6 V

137438953472 bit

2.7 V

2.7

SST25VF016B-50-4C-QAF-T

Microchip Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

NO LEAD

SERIAL

SYNCHRONOUS

30 mA

16777216 words

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

100

1.27 mm

85 Cel

3-STATE

16MX1

16M

-40 Cel

DUAL

1

SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

50 MHz

5 mm

Not Qualified

SPI

16777216 bit

2.7 V

NOR TYPE

.00002 Amp

6 mm

SST26VF064B-104V/SO

Microchip Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

25 mA

67108864 words

3

1

SMALL OUTLINE

SOP16,.4

100

1.27 mm

105 Cel

3-STATE

64MX1

64M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

104 MHz

7.5 mm

SPI

67108864 bit

2.7 V

e3

40

260

NOR TYPE

.000045 Amp

10.3 mm

3

W25N01GVTBIT

Winbond Electronics

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

35 mA

1073741824 words

3

3/3.3

1

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

10

1 mm

85 Cel

1GX1

1G

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

104 MHz

6 mm

Not Qualified

SPI

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

.00005 Amp

8 mm

3

AT45DB041D-SU

Atmel

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17 mA

4194304 words

3

3/3.3

1

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

4MX1

4M

-40 Cel

Matte Tin (Sn)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

2

3.6 V

2.16 mm

100000 Write/Erase Cycles

66 MHz

5.24 mm

Not Qualified

SPI

4194304 bit

2.7 V

ORGANIZED AS 2048 PAGES OF 264 BYTES EACH

e3

40

260

NOR TYPE

.00001 Amp

5.29 mm

2.7

IS25LP128F-JLLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1

1.27 mm

105 Cel

16MX8

16M

-40 Cel

Tin (Sn)

DUAL

R-PDSO-N8

3.6 V

.8 mm

166 MHz

6 mm

134217728 bit

2.3 V

e3

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

M25P16-VMP6G

STMicroelectronics

FLASH

INDUSTRIAL

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

50 MHz

5 mm

Not Qualified

15 ms

SPI

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00001 Amp

6 mm

2.7

MT25QL01GBBB8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

1073741824 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

1GX1

1G

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.