Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
536870912 bit |
2.7 V |
30 |
260 |
NOR TYPE |
18.4 mm |
95 ns |
3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
17179869184 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
137438953472 bit |
2.7 V |
e3 |
MLC NAND TYPE |
18.4 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
4294967296 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
34359738368 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA100,10X17,40 |
1 mm |
85 Cel |
OPEN-DRAIN |
4GX8 |
4G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
52 MHz |
14 mm |
34359738368 bit |
2.7 V |
30 |
260 |
MLC NAND TYPE |
18 mm |
3.3 |
||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
120 MHz |
7.52 mm |
SPI |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
.00002 Amp |
10.3 mm |
3 |
|||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
12 mA |
524288 words |
3.3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
20 |
.5 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
TOP BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
55 ns |
3 |
YES |
|||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
33554432 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
536870912 bit |
2.7 V |
e3 |
18.4 mm |
100 ns |
2.7 |
||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
80 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA80,8X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
16,254 |
YES |
YES |
BOTTOM |
R-PBGA-B80 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
11 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
166 MHz |
6 mm |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
8 mm |
3 |
||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
20 mA |
134217728 words |
3 |
3/3.3 |
1 |
IN-LINE |
DIP8,.3 |
Flash Memories |
20 |
2.54 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
3.6 V |
5.33 mm |
100000 Write/Erase Cycles |
104 MHz |
7.62 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
NOR TYPE |
.00002 Amp |
9.27 mm |
3 |
|||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
25 mA |
33554432 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
268435456 bit |
3 V |
ALSO OPERATES AT 104MHZ AT 2.7-3.0V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
8 mm |
3.3 |
||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
12 mA |
33554432 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
32MX8 |
32M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
1.95 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
268435456 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
8 mm |
1.8 |
||||||||||||||||||||||||||
|
Spansion |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
50 mA |
1048576 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
90 ms |
BOTTOM |
16777216 bit |
4.5 V |
MIN 1000K WRITE CYCLE; CAN ALSO BE CONFG AS 2M X 8; BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
5 |
YES |
|||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2097152 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N |
1 |
3.6 V |
.6 mm |
104 MHz |
2 mm |
2097152 bit |
1.65 V |
IT ALSO OPERATES AT 2.3V MIN |
e4 |
NOR TYPE |
3 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18 mA |
65536 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
524288 bit |
2.3 V |
e4 |
NOR TYPE |
.000015 Amp |
4.925 mm |
3 |
||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
1.8 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.24 mm |
SPI |
16777216 bit |
1.65 V |
e4 |
NOR TYPE |
.00005 Amp |
5.29 mm |
1.8 |
|||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
66 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
ORGANIZED AS 2048 PAGES OF 264 BYTES EACH |
e3 |
40 |
260 |
NOR TYPE |
.00001 Amp |
4.925 mm |
2.7 |
|||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
166 MHz |
6 mm |
SPI |
134217728 bit |
2.3 V |
ALSO OPERATES WITH 133MHZ @ 2.3VMIN SUPPLY |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00007 Amp |
8 mm |
3 |
|||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.8 mm |
166 MHz |
6 mm |
268435456 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
2097152 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
32 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
2.7 V |
4/8 |
e3 |
30 |
260 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
20 mA |
2097152 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN/TIN BISMUTH |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
e3/e6 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
536870912 words |
1.8 |
1 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
512MX1 |
512M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
536870912 bit |
1.7 V |
e1 |
30 |
260 |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
8388608 words |
3.3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
86 MHz |
7.52 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
10.3 mm |
3.3 |
||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
16777216 bit |
2.7 V |
TOP BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000015 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4194304 words |
3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
8 |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.3 mm |
6 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
BOTTOM BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
134217728 words |
3.3 |
YES |
3.3 |
1 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
134217728 bit |
3 V |
8/16 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256K |
30 mA |
1073741824 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
8589934592 bit |
2.7 V |
2K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
3 |
NO |
|||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
128 |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
12.4 mm |
70 ns |
5 |
YES |
|||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
40 mA |
67108864 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
85 MHz |
5 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
e4 |
NOR TYPE |
.00002 Amp |
6 mm |
2.7 |
||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17.5 mA |
2097152 words |
3.3 |
4 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX4 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.24 mm |
SPI |
8388608 bit |
2.7 V |
NOR TYPE |
.00005 Amp |
5.29 mm |
3.3 |
||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
8 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.49 mm |
268435456 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.31 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8388608 words |
1.8 |
8 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.95 V |
2.65 mm |
133 MHz |
7.49 mm |
67108864 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.31 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.8 mm |
166 MHz |
6 mm |
268435456 bit |
1.65 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
20 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
4/8 |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
20 |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
BOTTOM |
16777216 bit |
2.7 V |
e3 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
134217728 words |
3 |
YES |
3/3.3 |
1 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
134217728 bit |
2.7 V |
8/16 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
8388608 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
4/8 |
e0 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
|||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.95 V |
.8 mm |
133 MHz |
5 mm |
33554432 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
1.8 |
|||||||||||||||||||||||||||||||||
Spansion |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
524288 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
8388608 bit |
2.7 V |
CAN BE OPERATED FROM 3 TO 3.6 VOLTS REGULATED; TOP BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
3 |
YES |
||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.24 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
5.29 mm |
3 |
||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
8388608 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
66 MHz |
3.9 mm |
Not Qualified |
SPI |
8388608 bit |
2.7 V |
ORGANIZED AS 4096 PAGES OF 256 BYTES EACH |
e3 |
NOR TYPE |
.00001 Amp |
4.925 mm |
2.7 |
||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
1.8/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
Not Qualified |
SPI |
8388608 bit |
2.3 V |
IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE |
e4 |
NOR TYPE |
.00004 Amp |
6 mm |
3 |
||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
17179869184 bit |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Greenliant Systems |
FLASH |
INDUSTRIAL |
145 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
ASYNCHRONOUS |
68719476736 words |
3.3 |
8 |
GRID ARRAY |
1 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
BOTTOM |
R-PBGA-B145 |
1.95 mm |
14 mm |
549755813888 bit |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
24 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
1M |
50 mA |
17179869184 words |
NO |
1.8,3/3.3 |
8 |
GRID ARRAY |
BGA100,10X17,40 |
Flash Memories |
1 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
16K |
YES |
YES |
BOTTOM |
R-PBGA-B100 |
Not Qualified |
137438953472 bit |
8K |
SLC NAND TYPE |
.00001 Amp |
20 ns |
NO |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
64GX8 |
64G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
549755813888 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
268435456 words |
3 |
4 |
GRID ARRAY, THIN PROFILE |
2 |
1 mm |
85 Cel |
256MX4 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
104 MHz |
6 mm |
1073741824 bit |
2.7 V |
ALSO IT CAN BE CONFIGURED AS 1G X 1 BIT |
e1 |
8 mm |
2.7 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.