Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Spansion |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
125 Cel |
512KX8 |
512K |
-55 Cel |
8 |
YES |
TIN LEAD |
DUAL |
R-PDIP-T32 |
3 |
5.5 V |
5.715 mm |
1000000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
260 |
NOR TYPE |
.000005 Amp |
42.037 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Spansion |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
IN-LINE |
20 |
2.54 mm |
125 Cel |
512KX8 |
512K |
-55 Cel |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
5.715 mm |
15.24 mm |
Not Qualified |
4194304 bit |
4.5 V |
1000K PROGRAM/ERASE CYCLES; DATA RETENTION 20 YEARS |
e0 |
NOR TYPE |
42.037 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
FLASH |
MILITARY |
14 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
160 mA |
2097152 words |
1.9 |
YES |
1.9,3.3 |
16 |
FLATPACK |
SOP14,1,40 |
Flash Memories |
0.11 |
1.02 mm |
210 Cel |
2MX16 |
2M |
-55 Cel |
GOLD |
DUAL |
HARDWARE |
R-CDFP-G14 |
3.6 V |
3.05 mm |
1000 Write/Erase Cycles |
1 MHz |
8 mm |
Not Qualified |
SPI |
33554432 bit |
3.1 V |
e4 |
NOR TYPE |
20 mm |
1.8 |
YES |
||||||||||||||||||||||
Spansion |
FLASH |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
125 Cel |
512KX8 |
512K |
-55 Cel |
8 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
260 |
NOR TYPE |
.000005 Amp |
13.97 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
Cypress Semiconductor |
FLASH |
MILITARY |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
8 |
1.27 mm |
125 Cel |
256KX16 |
256K |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G44 |
5.5 V |
2.8 mm |
13.3 mm |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
28.2 mm |
70 ns |
5 |
|||||||||||||||||||||||||||||||
Cobham Plc |
FLASH MODULE |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
524288 words |
5 |
YES |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
Flash Memories |
2.54 mm |
125 Cel |
512KX8 |
512K |
-55 Cel |
8 |
YES |
DUAL |
R-CDMA-T32 |
5.5 V |
100000 Write/Erase Cycles |
Not Qualified |
4194304 bit |
4.5 V |
100K ERASE/PROGRAM CYCLES |
NOR TYPE |
.0016 Amp |
70 ns |
5 |
YES |
|||||||||||||||||||||||||
Spansion |
FLASH |
MILITARY |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
524288 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
512KX16 |
512K |
-55 Cel |
1,2,1,15 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
3 |
5.5 V |
2.8 mm |
1000000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
BOTTOM |
8388608 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.001 Amp |
28.2 mm |
55 ns |
5 |
YES |
||||||||||||||||
Intel |
FLASH |
MILITARY |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
MIL-PRF-38535 Class N |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
135 mA |
2097152 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
16 |
Flash Memories |
.8 mm |
125 Cel |
3-STATE |
2MX8 |
2M |
-55 Cel |
32 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
3.15 V |
USER-SELECTABLE 5V OR 12V VPP |
128/256 |
e0 |
NOR TYPE |
.00005 Amp |
23.7 mm |
85 ns |
5 |
NO |
|||||||||||||||||
Spansion |
FLASH |
MILITARY |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
60 mA |
131072 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
20 |
.5 mm |
125 Cel |
128KX16 |
128K |
-55 Cel |
1,2,1,3 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
2097152 bit |
4.75 V |
MIN 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION; TOP BOOT BLOCK |
e0 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
50 ns |
5 |
YES |
|||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
COMMON |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
4 |
20 |
1 mm |
125 Cel |
3-STATE |
32MX8 |
32M |
-55 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3 |
3.6 V |
1.2 mm |
100 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
268435456 bit |
2.7 V |
e1 |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
TIN LEAD |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
e0 |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
|||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
YES |
DUAL |
R-CDIP-T32 |
5.5 V |
4.57 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
10000 PROGRAM/ ERASE CYCLE |
NOR TYPE |
.0001 Amp |
40.64 mm |
200 ns |
12 |
NO |
||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
Flash Memories |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
YES |
QUAD |
R-CQCC-N28 |
5.5 V |
2.01 mm |
10000 Write/Erase Cycles |
8.89 mm |
Not Qualified |
1048576 bit |
4.5 V |
10000 PROGRAM/ ERASE CYCLE |
NOR TYPE |
.0001 Amp |
13.97 mm |
150 ns |
12 |
NO |
||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
18 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2048 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
QUAD |
R-CQCC-N18 |
5.5 V |
1.91 mm |
7.366 mm |
Not Qualified |
16384 bit |
4.5 V |
NOR TYPE |
10.82 mm |
5 |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
YES |
DUAL |
R-CDIP-T32 |
5.5 V |
4.57 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
10000 PROGRAM/ ERASE CYCLE |
NOR TYPE |
.0001 Amp |
40.64 mm |
150 ns |
12 |
NO |
||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
Flash Memories |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
YES |
QUAD |
R-CQCC-N28 |
5.5 V |
2.01 mm |
10000 Write/Erase Cycles |
8.89 mm |
Not Qualified |
1048576 bit |
4.5 V |
10000 PROGRAM/ ERASE CYCLE |
NOR TYPE |
.0001 Amp |
13.97 mm |
120 ns |
12 |
NO |
||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
YES |
DUAL |
R-CDIP-T32 |
5.5 V |
4.57 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
10000 PROGRAM/ ERASE CYCLE |
NOR TYPE |
.0001 Amp |
40.64 mm |
120 ns |
12 |
NO |
||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
15 mA |
131072 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
Flash Memories |
1.27 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
YES |
QUAD |
R-CQCC-N28 |
5.5 V |
2.01 mm |
10000 Write/Erase Cycles |
8.89 mm |
Not Qualified |
1048576 bit |
4.5 V |
10000 PROGRAM/ ERASE CYCLE |
NOR TYPE |
.0001 Amp |
13.97 mm |
200 ns |
12 |
NO |
||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
200 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.