Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
150 ns |
12 |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLASH |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
128KX8 |
128K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
120 ns |
12 |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
FLASH |
MILITARY |
150 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
160 mA |
2097152 words |
1.9 |
YES |
16 |
UNCASED CHIP |
210 Cel |
2MX16 |
2M |
-55 Cel |
UPPER |
HARDWARE |
R-XUUC-N150 |
3.6 V |
1000 Write/Erase Cycles |
1 MHz |
4.6 mm |
SPI |
33554432 bit |
3.1 V |
NOT SPECIFIED |
NOT SPECIFIED |
11.509 mm |
1.8 |
YES |
||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
8388608 words |
3 |
YES |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
20 |
1 mm |
125 Cel |
3-STATE |
8MX16 |
8M |
-55 Cel |
128 |
YES |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100 Write/Erase Cycles |
11 mm |
.00006 ms |
134217728 bit |
2.7 V |
16 |
260 |
NOR TYPE |
.0002 Amp |
13 mm |
YES |
130 ns |
3 |
YES |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
32 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
SERIAL |
SYNCHRONOUS |
70 mA |
33554432 words |
3 |
8 |
FLATPACK |
FL32,.5 |
4 |
100 |
1.27 mm |
125 Cel |
3-STATE |
32MX8 |
32M |
-55 Cel |
NICKEL GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-CDFP-F32 |
1 |
3.6 V |
2.95 mm |
1000 Write/Erase Cycles |
133 MHz |
12.95 mm |
SPI |
268435456 bit |
2.7 V |
ALSO ORGANISED AS 128MbX2 AND 256Mbx1 |
e4 |
NOR TYPE |
.0002 Amp |
23.37 mm |
3 |
||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
64 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
33554432 words |
3 |
YES |
16 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
20 |
1 mm |
125 Cel |
3-STATE |
32MX16 |
32M |
-55 Cel |
512 |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
100 Write/Erase Cycles |
9 mm |
.00006 ms |
536870912 bit |
2.7 V |
16 |
260 |
NOR TYPE |
.0002 Amp |
9 mm |
YES |
120 ns |
3 |
YES |
||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
10 |
1.27 mm |
125 Cel |
3-STATE |
256KX8 |
256K |
-55 Cel |
1,2,1,3 |
YES |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
BOTTOM |
2097152 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
10 |
1.27 mm |
125 Cel |
3-STATE |
256KX8 |
256K |
-55 Cel |
1,2,1,3 |
YES |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
BOTTOM |
2097152 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
8K,64K |
45 mA |
4194304 words |
YES |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
125 Cel |
4MX16 |
4M |
-55 Cel |
16,126 |
YES |
TIN LEAD |
YES |
BOTTOM |
S-PBGA-B64 |
3 |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
e0 |
260 |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
e1 |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
80 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
45 mA |
262144 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
10 |
.5 mm |
125 Cel |
256KX16 |
256K |
-55 Cel |
2,4,2,6 |
YES |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
4194304 bit |
2.7 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
YES |
||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
32 |
TSOP1 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
10 |
.5 mm |
125 Cel |
3-STATE |
256KX8 |
256K |
-55 Cel |
1,2,1,3 |
YES |
YES |
DUAL |
R-XDSO-G32 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
BOTTOM |
2097152 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
10 |
1.27 mm |
125 Cel |
3-STATE |
256KX8 |
256K |
-55 Cel |
1,2,1,3 |
YES |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
TOP |
2097152 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
30 mA |
1048576 words |
3.3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
125 Cel |
3-STATE |
1MX8 |
1M |
-55 Cel |
16 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
8388608 bit |
2.7 V |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
120 ns |
3 |
YES |
|||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
DUAL |
R-PDSO-G44 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
90 ns |
YES |
||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
8K,64K |
45 mA |
4194304 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
4MX16 |
4M |
-55 Cel |
16,126 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
e0 |
260 |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
45 mA |
262144 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
256KX16 |
256K |
-55 Cel |
2,4,2,6 |
YES |
YES |
DUAL |
R-PDSO-G44 |
Not Qualified |
BOTTOM |
4194304 bit |
NOR TYPE |
.000005 Amp |
90 ns |
YES |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
DUAL |
R-PDSO-G44 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
80 ns |
YES |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
90 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
80 ns |
YES |
|||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
10 |
1.27 mm |
125 Cel |
3-STATE |
256KX8 |
256K |
-55 Cel |
1,2,1,3 |
YES |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
BOTTOM |
2097152 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
90 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
DUAL |
R-PDSO-G44 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
|||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
30 mA |
1048576 words |
3.3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
125 Cel |
3-STATE |
1MX8 |
1M |
-55 Cel |
16 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
8388608 bit |
2.7 V |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
150 ns |
3 |
YES |
|||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
45 mA |
262144 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
256KX16 |
256K |
-55 Cel |
2,4,2,6 |
YES |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
TOP |
4194304 bit |
NOR TYPE |
.000005 Amp |
120 ns |
YES |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
1048576 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.8,20 |
10 |
.5 mm |
125 Cel |
3-STATE |
1MX8 |
1M |
-55 Cel |
16 |
YES |
YES |
DUAL |
R-XDSO-G40 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
10 mm |
8388608 bit |
4.5 V |
DATA RETENTION TIME @ 150 DEGREE CENTIGRADE |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
YES |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
90 ns |
YES |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
DUAL |
R-PDSO-G44 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
||||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
80 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
32 |
TSOP1 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
10 |
.5 mm |
125 Cel |
3-STATE |
256KX8 |
256K |
-55 Cel |
1,2,1,3 |
YES |
YES |
DUAL |
R-XDSO-G32 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
BOTTOM |
2097152 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
80 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
80 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
63 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
8K,64K |
45 mA |
4194304 words |
YES |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA63,8X12,32 |
8 |
Flash Memories |
.8 mm |
125 Cel |
4MX16 |
4M |
-55 Cel |
16,126 |
YES |
TIN LEAD |
YES |
BOTTOM |
R-PBGA-B63 |
3 |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
e0 |
260 |
NOR TYPE |
.000005 Amp |
YES |
120 ns |
YES |
||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
80 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||||||||
Infineon Technologies |
FLASH |
MILITARY |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-55 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
536870912 bit |
2.7 V |
NOR TYPE |
.0003 Amp |
8 mm |
3 |
||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
40 mA |
262144 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
10 |
1.27 mm |
125 Cel |
3-STATE |
256KX8 |
256K |
-55 Cel |
1,2,1,3 |
YES |
MATTE TIN |
YES |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
13.97 mm |
90 ns |
5 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
MILITARY |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
16K,8K,32K,64K |
30 mA |
1048576 words |
YES |
3/3.3 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
1,2,1,31 |
YES |
DUAL |
R-PDSO-G44 |
Not Qualified |
BOTTOM |
16777216 bit |
NOR TYPE |
.000005 Amp |
YES |
80 ns |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.