Infineon Technologies Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S29CD016J0PFAM112

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29GL512T10DHVV20

Infineon Technologies

FLASH

S29GL064S90TFVV10

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

105 Cel

8MX8

8M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

14 mm

67108864 bit

2.7 V

e3

18.4 mm

90 ns

3

S28HS512TGABHI0100

Infineon Technologies

FLASH

1.8

S29CD016J0PQAM130

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

2.75 V

3.35 mm

14 mm

Not Qualified

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.7

YES

S29CL032J1JFAM012

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

3.3

YES

1.8/3.3,3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

33554432 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

3.3

YES

S26HS256TGABHI000

Infineon Technologies

FLASH

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

85 Cel

OPEN-DRAIN

32MX8

32M

-40 Cel

BOTTOM

HARDWARE

R-PBGA-B24

2 V

1 mm

640000 Write/Erase Cycles

200 MHz

6 mm

SPI

268435456 bit

1.7 V

NOR TYPE

8 mm

1.8

S29GL256P11FFI023

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

110 mA

268435456 words

3

YES

3/3.3

1

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

256MX1

256M

-40 Cel

256

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

268435456 bit

2.7 V

8/16

e1

40

260

NOR TYPE

.000005 Amp

13 mm

YES

110 ns

3

YES

S29WS064J1ABFI002

Infineon Technologies

FLASH

INDUSTRIAL

80

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA80,8X10,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-40 Cel

16,126

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B80

3

Not Qualified

BOTTOM/TOP

67108864 bit

e1

40

260

NOR TYPE

.00005 Amp

YES

45 ns

YES

S29CD016J1JFFM003

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

TOP

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e1

40

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29GL128S100DHI023

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

20

1 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

.00006 ms

134217728 bit

2.7 V

32

e1

30

260

NAND TYPE

.0001 Amp

9 mm

YES

100 ns

3

YES

S29WS064J1ABAW000

Infineon Technologies

FLASH

OTHER

80

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA80,8X10,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

BOTTOM

R-PBGA-B80

Not Qualified

BOTTOM/TOP

67108864 bit

NOR TYPE

.00005 Amp

YES

45 ns

YES

S29GL512T11TFBV30

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

67108864 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1

.5 mm

105 Cel

64MX8

64M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

536870912 bit

2.7 V

18.4 mm

110 ns

2.7

S29CD032J0MFAM03

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

2.6

32

GRID ARRAY

1 mm

125 Cel

512KX32

512K

-40 Cel

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

56 MHz

11 mm

Not Qualified

.000065 ms

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

13 mm

54 ns

2.7

S29CL016J1JFAI01

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

GRID ARRAY

1 mm

85 Cel

512KX32

512K

-40 Cel

BOTTOM

R-PBGA-B80

3.6 V

1.4 mm

40 MHz

11 mm

Not Qualified

.000065 ms

BOTTOM

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

13 mm

54 ns

3.3

S29CD032J0PBFI010

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

1MX32

1M

-40 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

9 mm

Not Qualified

BOTTOM

33554432 bit

2.5 V

NOR TYPE

.00006 Amp

11 mm

YES

54 ns

2.7

YES

S29CD016J0JFAI022

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

TOP

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29CL016J1JFAM003

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

3.3

YES

1.8/3.3,3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

3.6 V

1.4 mm

11 mm

Not Qualified

TOP

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

3.3

YES

S29CD032J0PFAM030

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B80

3

2.75 V

1.4 mm

11 mm

Not Qualified

BOTTOM

33554432 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29CL032J0MQAI100

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

3.3

32

FLATPACK

.8 mm

85 Cel

1MX32

1M

-40 Cel

TIN LEAD

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

TOP

33554432 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

NOR TYPE

20 mm

54 ns

3.3

S29CL016J0PQFI122

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

FLATPACK

.8 mm

85 Cel

512KX32

512K

-40 Cel

MATTE TIN

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

TOP

16777216 bit

3 V

e3

NOR TYPE

20 mm

54 ns

3.3

S29GL01GS110TFIV23

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

20

.5 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

.00006 ms

1073741824 bit

2.7 V

32

NAND TYPE

.0001 Amp

18.4 mm

YES

110 ns

3

YES

S29GL032N90TFA023

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

2MX16

2M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

BOTTOM/TOP

33554432 bit

2.7 V

NOR TYPE

18.4 mm

90 ns

3

S28HS256TGABHM0100

Infineon Technologies

FLASH

1.8

S29CD032J0MBFM030

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

9 mm

Not Qualified

BOTTOM

33554432 bit

2.5 V

NOR TYPE

.00006 Amp

11 mm

YES

54 ns

2.7

YES

S29CD016J0JQAM11

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

YES

QUAD

R-PQFP-G80

2.75 V

3.35 mm

40 MHz

14 mm

Not Qualified

.000065 ms

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.7

YES

S29CD016J0MFFM00

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

YES

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

56 MHz

11 mm

Not Qualified

.000065 ms

TOP

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S28HL01GTGABHA0100

Infineon Technologies

FLASH

3

S29CD032J1JFAI03

Infineon Technologies

FLASH

INDUSTRIAL

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY

BGA80,8X10,40

Flash Memories

1 mm

85 Cel

512KX32

512K

-40 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

40 MHz

11 mm

Not Qualified

.000065 ms

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

.00006 Amp

13 mm

YES

54 ns

2.7

YES

S29GL032N90FFIV23

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

60 mA

2097152 words

3

YES

1.8/3.3,3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

2MX16

2M

-40 Cel

64

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

33554432 bit

2.7 V

8/16

e1

30

260

NOR TYPE

.000005 Amp

13 mm

YES

90 ns

3

YES

S29CL032J0MQAI003

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

3.3

YES

1.8/3.3,3.3

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

85 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

TOP

33554432 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

3.3

YES

S29CD016J1JQFI13

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

85 Cel

512KX32

512K

-40 Cel

16,30

YES

YES

QUAD

R-PQFP-G80

2.75 V

3.35 mm

40 MHz

14 mm

Not Qualified

.000065 ms

BOTTOM

16777216 bit

2.5 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.7

YES

S29CD016J1JQAM012

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

2.6

YES

1.8/2.6,2.6

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

2.75 V

3.35 mm

14 mm

Not Qualified

BOTTOM

16777216 bit

2.5 V

BOTTOM BOOT BLOCK

e0

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

2.7

YES

S29CL032J1JQAI003

Infineon Technologies

FLASH

INDUSTRIAL

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

1048576 words

3.3

YES

1.8/3.3,3.3

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

85 Cel

1MX32

1M

-40 Cel

16,62

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

TOP

33554432 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

3.3

YES

S29GL512T13DHI043

Infineon Technologies

FLASH

S26HS512TFPBHV010

Infineon Technologies

FLASH

24

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY, VERY THIN PROFILE

BGA24,5X5,40

25

1 mm

105 Cel

OPEN-DRAIN

64MX8

64M

-40 Cel

BOTTOM

HARDWARE

R-PBGA-B24

2 V

1 mm

1280000 Write/Erase Cycles

166 MHz

6 mm

SPI

536870912 bit

1.7 V

NOR TYPE

8 mm

1.8

S29GL512T13FHVV33

Infineon Technologies

FLASH

S29CL016J1JQAM033

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K,16K

90 mA

524288 words

3.3

YES

1.8/3.3,3.3

32

FLATPACK

QFP80,.7X.9,32

Flash Memories

.8 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

TIN LEAD

YES

QUAD

R-PQFP-G80

3

3.6 V

3.35 mm

14 mm

Not Qualified

BOTTOM

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

e0

260

NOR TYPE

.00006 Amp

20 mm

YES

54 ns

3.3

YES

S27KS0643GABHI033

Infineon Technologies

FLASH

3

S29CL016J0JBFM022

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

524288 words

3.3

YES

1.8/3.3,3.3

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

512KX32

512K

-40 Cel

16,30

YES

YES

BOTTOM

R-PBGA-B80

3.6 V

1.4 mm

9 mm

Not Qualified

TOP

16777216 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00006 Amp

11 mm

YES

54 ns

2.7

YES

S29GL256P90TFIV23

Infineon Technologies

FLASH

INDUSTRIAL

56

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

268435456 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

256MX1

256M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

268435456 bit

2.7 V

NOR TYPE

18.4 mm

90 ns

3

S27KS0643GABHI030

Infineon Technologies

FLASH

3

S28HL512TGABHA0130

Infineon Technologies

FLASH

3

S29CD032J0RBAM013

Infineon Technologies

FLASH

AUTOMOTIVE

80

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2K,16K

90 mA

1048576 words

2.6

YES

1.8/2.6,2.6

32

GRID ARRAY, LOW PROFILE

BGA80,8X10,40

Flash Memories

1 mm

125 Cel

1MX32

1M

-40 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B80

2.75 V

1.4 mm

9 mm

Not Qualified

BOTTOM

33554432 bit

2.5 V

NOR TYPE

.00006 Amp

11 mm

YES

48 ns

2.7

YES

S29GL512T13DHNV33

Infineon Technologies

FLASH

AUTOMOTIVE

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

32MX16

32M

-40 Cel

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

9 mm

BOTTOM/TOP

536870912 bit

2.7 V

NOR TYPE

9 mm

130 ns

2.7

S29GL512T13FHAV40

Infineon Technologies

FLASH

S29GL032N11TFIV12

Infineon Technologies

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

64K

50 mA

2097152 words

3

YES

1.8/3.3,3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

64

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM/TOP

33554432 bit

2.7 V

8/16

NOR TYPE

.000005 Amp

18.4 mm

YES

110 ns

3

YES

S29CL032J0JQAM02

Infineon Technologies

FLASH

AUTOMOTIVE

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

32

FLATPACK

.8 mm

125 Cel

512KX32

512K

-40 Cel

QUAD

R-PQFP-G80

3.6 V

3.35 mm

40 MHz

14 mm

Not Qualified

.000065 ms

TOP

16777216 bit

3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

20 mm

54 ns

3.3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.