FBGA MASK ROM 11

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Technology	Terminal Form	Maximum Supply Current	No. of Words	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Qualification	Memory Density	JESD-609 Code	Maximum Standby Current	Maximum Access Time
UPD23C16340F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	40 mA	1048576 words	3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32	8	MASK ROMs	.8 mm	70 Cel	1MX16	1M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	16777216 bit		.00003 Amp	90 ns
UPD23C16343F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	40 mA	1048576 words	1.8,3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32		MASK ROMs	.8 mm	70 Cel	1MX16	1M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	16777216 bit		.00003 Amp	90 ns
UPD23C32383F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	MOS	BALL		2097152 words	1.8,3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32		MASK ROMs	.8 mm	70 Cel	2MX16	2M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	33554432 bit		.00003 Amp	100 ns
UPD23C16300F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	30 mA	1048576 words	3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32	8	MASK ROMs	.8 mm	70 Cel	1MX16	1M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	16777216 bit		.00003 Amp	90 ns
UPD23C32303F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	30 mA	2097152 words	1.8,3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32		MASK ROMs	.8 mm	70 Cel	2MX16	2M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	33554432 bit		.00003 Amp	100 ns
UPD23C16380F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	55 mA	1048576 words	3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32	8	MASK ROMs	.8 mm	70 Cel	1MX16	1M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	16777216 bit		.00003 Amp	90 ns
UPD23C16303F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	30 mA	1048576 words	1.8,3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32		MASK ROMs	.8 mm	70 Cel	1MX16	1M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	16777216 bit		.00003 Amp	90 ns
UPD23C16300F9-XXX-BC3-A	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	30 mA	1048576 words	3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32	8	MASK ROMs	.8 mm	70 Cel	1MX16	1M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	16777216 bit		.00003 Amp	90 ns
UPD23C16383F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	55 mA	1048576 words	1.8,3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32		MASK ROMs	.8 mm	70 Cel	1MX16	1M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	16777216 bit		.00003 Amp	90 ns
UPD23C32343F9-XXX-BC3	Renesas Electronics	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	MOS	BALL		2097152 words	1.8,3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,32		MASK ROMs	.8 mm	70 Cel	2MX16	2M	-10 Cel		BOTTOM	R-PBGA-B48	Not Qualified	33554432 bit		.00003 Amp	100 ns
KM23V64005BF	Samsung	MASK ROM	COMMERCIAL	48	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	BALL	60 mA	4194304 words	3/3.3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,30	8	MASK ROMs	.75 mm	70 Cel	4MX16	4M	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	R-PBGA-B48	Not Qualified	67108864 bit	e0	.00005 Amp	120 ns

MASK ROM

Mask ROM, or Read-Only Memory, is a type of non-volatile computer memory that is programmed during the manufacturing process. Mask ROM is designed to permanently store data and cannot be reprogrammed after it has been manufactured.

Mask ROM is created by a process known as photolithography. This process involves using a mask, or template, to expose specific areas of a silicon wafer to ultraviolet light. The areas that are exposed to the light are then etched away, leaving behind the patterns that make up the memory cells. Once the memory cells have been created, they are permanently programmed with the data that they will store.

Mask ROM is commonly used in devices that require permanent storage of data, such as game consoles, calculators, and other electronic devices. Because the data is permanently programmed during manufacturing, mask ROM provides a reliable and secure way to store critical data, such as system settings, firmware, and other important information.

One of the advantages of using mask ROM is that it is a cost-effective way to produce large quantities of memory. Because the data is programmed during the manufacturing process, the cost per unit is relatively low compared to other types of non-volatile memory, such as EEPROM or flash memory.