CONFIGURATION MEMORY Other Function Memory ICs 5

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Technology	Screening Level	Terminal Form	Parallel or Serial	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Data Retention Time	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Endurance	Maximum Clock Frequency (fCLK)	Qualification	Memory Density	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Type	Maximum Standby Current	Programming Voltage (V)
XAF01SVOG20Q	Xilinx	CONFIGURATION MEMORY	AUTOMOTIVE	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	AEC-Q100	GULL WING	SERIAL	10 mA				1.8,1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Flash Memories	20	.635 mm	125 Cel				-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G20	3	20000 Write/Erase Cycles		Not Qualified	1048576 bit	e3	30	260	NOR TYPE	.001 Amp
XAF02SVOG20Q	Xilinx	CONFIGURATION MEMORY	AUTOMOTIVE	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	AEC-Q100	GULL WING	SERIAL	10 mA				1.8,1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Flash Memories	20	.635 mm	125 Cel				-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G20	3	20000 Write/Erase Cycles		Not Qualified	2097152 bit	e3	30	260	NOR TYPE	.001 Amp
XAF04SVOG20Q	Xilinx	CONFIGURATION MEMORY	AUTOMOTIVE	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	CMOS	AEC-Q100	GULL WING	SERIAL	10 mA				1.8,1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Flash Memories		.635 mm	125 Cel				-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G20	3		33 MHz	Not Qualified	4194304 bit	e3	30	260	NOR TYPE	.001 Amp
XC1736-PD8C	Xilinx	CONFIGURATION MEMORY	INDUSTRIAL	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS		THROUGH-HOLE		10 mA	36288 words	COMMON	5	5	1	IN-LINE	DIP8,.3	OTP ROMs		2.54 mm	85 Cel	3-STATE	36288X1	36288	-40 Cel	TIN LEAD	DUAL	R-PDIP-T8	1		2.5 MHz	Not Qualified		e0	30	225		.0005 Amp	21
XQR18V04VQ44N	Xilinx	CONFIGURATION MEMORY	OTHER	44	QFP	SQUARE	PLASTIC/EPOXY	YES	CMOS		GULL WING	SERIAL	50 mA				2.5/3.3,3.3		FLATPACK	TQFP44,.47SQ,32	Flash Memories	10	.8 mm	100 Cel				-55 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-PQFP-G44	3	2000 Write/Erase Cycles	20 MHz	Not Qualified	4194304 bit	e0	30	240	NOR TYPE	.02 Amp

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.