44 Other Function Memory ICs 84

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S71NS128NA0BJWMP2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWMP3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWMM0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSW2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWMY0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

SM2403T-7.5

Infineon Technologies

COMMERCIAL

44

TSOP

2048

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

240 mA

2097152 words

1,2,4,8,FP

COMMON

2.5/3.3,3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

Other Memory ICs

.8 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

DUAL

R-PDSO-G44

133 MHz

Not Qualified

16777216 bit

.002 Amp

1,2,4,8

4.5 ns

S71NS128NA0BJWSM3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWMF0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSP2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWMZ3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSZ0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWMW0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWME3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSY2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWSD2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWMW3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWMY3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

SM2403T-10

Infineon Technologies

COMMERCIAL

44

TSOP

2048

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

160 mA

2097152 words

1,2,4,8,FP

COMMON

2.5/3.3,3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

Other Memory ICs

.8 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

DUAL

R-PDSO-G44

100 MHz

Not Qualified

16777216 bit

.002 Amp

1,2,4,8

5 ns

S71NS128NA0BJWMP0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSD3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWMD0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSF0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWMD2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWMZ2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

SM2402T-7.5

Infineon Technologies

COMMERCIAL

44

TSOP

2048

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

240 mA

4194304 words

1,2,4,8,FP

COMMON

2.5/3.3,3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

Other Memory ICs

.8 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

DUAL

R-PDSO-G44

133 MHz

Not Qualified

16777216 bit

.002 Amp

1,2,4,8

4.5 ns

S71NS128NA0BJWSZ2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

S71NS128NA0BJWMZ0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWMW2

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWMN3

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

6.285 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

7.7 mm

S71NS128NA0BJWSP0

Infineon Technologies

MEMORY CIRCUIT

OTHER

44

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8MX16

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B44

3

1.95 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

PSRAM IS ORGANIZED AS 1M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

e1

9.2 mm

XQR18V04VQ44N

Xilinx

CONFIGURATION MEMORY

OTHER

44

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

GULL WING

SERIAL

50 mA

2.5/3.3,3.3

FLATPACK

TQFP44,.47SQ,32

Flash Memories

10

.8 mm

100 Cel

-55 Cel

Tin/Lead (Sn85Pb15)

QUAD

S-PQFP-G44

3

2000 Write/Erase Cycles

20 MHz

Not Qualified

4194304 bit

e0

30

240

NOR TYPE

.02 Amp

UPD485506G5-25

Renesas Electronics

COMMERCIAL

44

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

140 mA

5

5

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

Other Memory ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G44

Not Qualified

e0

.14 Amp

18 ns

UPD485506G5-27

Renesas Electronics

COMMERCIAL

44

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

140 mA

5

5

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

Other Memory ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G44

Not Qualified

e0

.14 Amp

18 ns

HM530281RTT-20

Renesas Electronics

COMMERCIAL

44

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

135 mA

5

5

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

Other Memory ICs

.8 mm

70 Cel

0 Cel

DUAL

R-PDSO-G44

Not Qualified

.025 Amp

18 ns

HM530281RTT-25

Renesas Electronics

COMMERCIAL

44

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

120 mA

5

5

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

Other Memory ICs

.8 mm

70 Cel

0 Cel

DUAL

R-PDSO-G44

Not Qualified

.025 Amp

23 ns

UPD485506G5-35

Renesas Electronics

COMMERCIAL

44

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

140 mA

5

5

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

Other Memory ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G44

Not Qualified

e0

.14 Amp

25 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.