Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Interleaved Burst Length | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Everspin Technologies |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
27 mA |
131072 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
SRAMs |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.9 mm |
5 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3 |
30 |
260 |
.000115 Amp |
6 mm |
|||||||||||||||||||||||||||||||||
|
Everspin Technologies |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
27 mA |
131072 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
SRAMs |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.9 mm |
5 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3 |
30 |
260 |
.000115 Amp |
6 mm |
|||||||||||||||||||||||||||||||||
|
Everspin Technologies |
SPI BUS SERIAL EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
32768 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.9 mm |
5 mm |
262144 bit |
2.7 V |
6 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
DUAL |
S-PDSO-N12 |
5.5 V |
.6 mm |
3 mm |
4096 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
4096 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Everspin Technologies |
MEMORY CIRCUIT |
AUTOMOTIVE |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
131072 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.9 mm |
5 mm |
1048576 bit |
3 V |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
65536 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
64KX1 |
64K |
-40 Cel |
DUAL |
S-PDSO-N12 |
5.5 V |
.6 mm |
3 mm |
65536 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Everspin Technologies |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
27 mA |
131072 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
SRAMs |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
1 mm |
5 mm |
Not Qualified |
1048576 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000115 Amp |
6 mm |
||||||||||||||||||||||||||||||||||||
|
Everspin Technologies |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
46.5 mA |
524288 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
SRAMs |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.9 mm |
5 mm |
Not Qualified |
4194304 bit |
3 V |
.00075 Amp |
6 mm |
|||||||||||||||||||||||||||||||||||||
|
Everspin Technologies |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
32768 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.9 mm |
5 mm |
262144 bit |
2.7 V |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16384 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
16KX1 |
16K |
-40 Cel |
DUAL |
S-PDSO-N12 |
5.5 V |
.6 mm |
3 mm |
16384 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1048576 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
5 mm |
8388608 bit |
2.7 V |
e3 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8192 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N8 |
1 |
5.5 V |
.6 mm |
2 mm |
65536 bit |
2.7 V |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2097152 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
5 mm |
16777216 bit |
2.7 V |
e3 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1048576 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
1.27 mm |
105 Cel |
1MX8 |
1M |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
5 mm |
8388608 bit |
2.7 V |
e3 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||||||||
|
Everspin Technologies |
SPI BUS SERIAL EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
32768 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-N8 |
3 |
3.6 V |
.9 mm |
5 mm |
262144 bit |
2.7 V |
6 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTO MEMORY |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
128 words |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
EEPROMs |
.5 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
DUAL |
1 |
R-XDSO-N8 |
3.6 V |
.6 mm |
2 mm |
Not Qualified |
1024 bit |
2.7 V |
3 mm |
250 ns |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
256 words |
1.8/5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
Other Memory ICs |
.5 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-N8 |
.6 mm |
2 mm |
Not Qualified |
2048 bit |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
256 words |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-N8 |
.6 mm |
2 mm |
2048 bit |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
256 words |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-N8 |
.6 mm |
2 mm |
2048 bit |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
COMMERCIAL EXTENDED |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
524288 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
80 Cel |
512KX8 |
512K |
-25 Cel |
DUAL |
R-PDSO-N8 |
1 |
5.5 V |
.6 mm |
2 mm |
4194304 bit |
2.4 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
512 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
512 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
512X8 |
512 |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
65536 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
64KX1 |
64K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
65536 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16384 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
16KX1 |
16K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
16384 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
4KX1 |
4K |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
16384 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
256 words |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-N8 |
.6 mm |
2 mm |
2048 bit |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
COMMERCIAL EXTENDED |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
80 Cel |
4KX1 |
4K |
-25 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
COMMERCIAL EXTENDED |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
524288 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
80 Cel |
512KX8 |
512K |
-25 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
4194304 bit |
2.4 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8192 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
8KX8 |
8K |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
65536 bit |
2.7 V |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
262144 words |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
DUAL |
R-PDSO-N8 |
.6 mm |
2 mm |
2097152 bit |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
DUAL |
S-PDSO-N12 |
5.5 V |
.6 mm |
3 mm |
4096 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
256 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
2048 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
256 words |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
DUAL |
R-PDSO-N8 |
.6 mm |
2 mm |
2048 bit |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
OTHER |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
512 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
512X8 |
512 |
-25 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8192 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
8KX8 |
8K |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
65536 bit |
2.7 V |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
4096 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
COMMERCIAL EXTENDED |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
80 Cel |
4KX1 |
4K |
-25 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
COMMERCIAL EXTENDED |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
80 Cel |
4KX1 |
4K |
-25 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
2 mm |
4096 bit |
2.4 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8192 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
65536 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
16384 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16384 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
16KX1 |
16K |
-40 Cel |
DUAL |
S-PDSO-N12 |
5.5 V |
.6 mm |
3 mm |
16384 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
COMMERCIAL EXTENDED |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
80 Cel |
4KX1 |
4K |
-25 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
4096 bit |
2.4 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
65536 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
64KX1 |
64K |
-40 Cel |
DUAL |
S-PDSO-N12 |
5.5 V |
.6 mm |
3 mm |
65536 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
4KX1 |
4K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4096 words |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
4KX1 |
4K |
DUAL |
R-PDSO-N8 |
5.5 V |
.8 mm |
2 mm |
4096 bit |
2.7 V |
3 mm |
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.
One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.
Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.
Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.