COMMERCIAL Other Function Memory ICs 1,473

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
MT9VDDF6472PHY-26AA1	Micron Technology		COMMERCIAL	200	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2800 mA	67108864 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	64MX72	64M		DUAL	R-PDMA-N200			133 MHz		Not Qualified	4831838208 bit						.04 Amp
MT9LSDT872AY-133	Micron Technology		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1890 mA	8388608 words	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168			133 MHz		Not Qualified	603979776 bit						.018 Amp		5.4 ns
CT500MX500SSD4	Micron Technology	MEMORY CIRCUIT	COMMERCIAL				RECTANGULAR	UNSPECIFIED		1	CMOS		ASYNCHRONOUS		536870912000 words					8					70 Cel		500GX8	500G									4294967296000 bit				NOT SPECIFIED	NOT SPECIFIED
MT9VDDT1672Y-265G3	Micron Technology		COMMERCIAL	184	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2925 mA	16777216 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N184			133 MHz		Not Qualified	1207959552 bit						.027 Amp		.75 ns
NP8P128A13BSM60E	Micron Technology	MEMORY CIRCUIT	COMMERCIAL	56	TSOP1		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS		16777216 words		3			8	SMALL OUTLINE, THIN PROFILE			.5 mm	70 Cel		16MX8	16M		DUAL	R-PDSO-G56	3.6 V	1.2 mm		14 mm		134217728 bit	2.7 V						18.4 mm
NP5Q128A13ESFC0E	Micron Technology	MEMORY CIRCUIT	COMMERCIAL	16	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	50 mA	134217728 words		3		3/3.3	1	SMALL OUTLINE	SOP16,.4	SRAMs	1.27 mm	70 Cel		128MX1	128M		DUAL	R-PDSO-G16	3.6 V	2.65 mm		7.5 mm	Not Qualified	134217728 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	.0002 Amp	10.3 mm
MT72HTS1G72PZ-667H1	Micron Technology		COMMERCIAL	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		4014 mA	1073741824 words	COMMON	1.8		1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	70 Cel	3-STATE	1GX72	1G		DUAL	R-PDMA-N240			333 MHz		Not Qualified	77309411328 bit						.504 Amp		.45 ns
MT9VDDT3272Y-265	Micron Technology		COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD			33554432 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N184			133 MHz		Not Qualified	2415919104 bit						.036 Amp		.75 ns
MT9VDDT3272AY-40BK1	Micron Technology		COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2610 mA	33554432 words	COMMON	2.6		2.6	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N184			200 MHz		Not Qualified	2415919104 bit						.036 Amp		.7 ns
MT9HTF12872G-53E	Micron Technology		COMMERCIAL	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD			134217728 words	COMMON	1.8		1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	55 Cel	3-STATE	128MX72	128M		DUAL	R-PDMA-N240			267 MHz		Not Qualified	9663676416 bit								.5 ns
MT42C8257RG-7	Micron Technology	MEMORY CIRCUIT	COMMERCIAL	40	TSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		210 mA	262144 words		5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP40/44,.46,32	Other Memory ICs	.8 mm	70 Cel		256KX8	256K	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40					Not Qualified	2097152 bit			e0			.01 Amp		70 ns
MT18HVF12872PDY-53E	Micron Technology		COMMERCIAL	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2088 mA	134217728 words	COMMON	1.8		1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	70 Cel	3-STATE	128MX72	128M		DUAL	R-PDMA-N240			266 MHz		Not Qualified	9663676416 bit						.126 Amp		.5 ns
MT9VDDT6472HG-26AF2	Micron Technology		COMMERCIAL	200	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		3150 mA	67108864 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	64MX72	64M		DUAL	R-PDMA-N200			133 MHz		Not Qualified	4831838208 bit						.045 Amp		.75 ns
MT18HVF25672PDY-800	Micron Technology		COMMERCIAL	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		3078 mA	268435456 words	COMMON	1.8		1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	70 Cel	3-STATE	256MX72	256M		DUAL	R-PDMA-N240			400 MHz		Not Qualified	19327352832 bit								.4 ns
MT9VDDT1672PHG-202	Micron Technology		COMMERCIAL	200	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2925 mA	16777216 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N200			125 MHz		Not Qualified	1207959552 bit						.027 Amp		.8 ns
MT72HTS2G72PY-667A1	Micron Technology		COMMERCIAL	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		6642 mA	2147483648 words	COMMON	1.8		1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	70 Cel	3-STATE	2GX72	2G		DUAL	R-PDMA-N240			333 MHz		Not Qualified	154618822656 bit						.576 Amp		.45 ns
MT9VDDT1672PHY-202	Micron Technology		COMMERCIAL	200	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2925 mA	16777216 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N200			125 MHz		Not Qualified	1207959552 bit						.027 Amp		.8 ns
MT9VDDT6472AG-40BF1	Micron Technology		COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		4050 mA	67108864 words	COMMON	2.6		2.6	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	64MX72	64M		DUAL	R-PDMA-N184			200 MHz		Not Qualified	4831838208 bit						.045 Amp		.7 ns
MT9VDDT6472HG-265F2	Micron Technology		COMMERCIAL	200	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		3150 mA	67108864 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	64MX72	64M		DUAL	R-PDMA-N200			133 MHz		Not Qualified	4831838208 bit						.045 Amp		.75 ns
MT42C4064-10	Micron Technology	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		60 mA	65536 words		5		5	4	IN-LINE	DIP24,.4	Other Memory ICs	2.54 mm	70 Cel		64KX4	64K	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified	262144 bit			e0			.004 Amp		100 ns
MT9VDDT1672G-26A	Micron Technology		COMMERCIAL	184	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2925 mA	16777216 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N184			133 MHz		Not Qualified	1207959552 bit						.027 Amp		.75 ns
MT42C4064-12	Micron Technology	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		60 mA	65536 words		5		5	4	IN-LINE	DIP24,.4	Other Memory ICs	2.54 mm	70 Cel		64KX4	64K	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified	262144 bit			e0			.004 Amp		120 ns
MT9VDDF6472PHY-265A1	Micron Technology		COMMERCIAL	200	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2800 mA	67108864 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	64MX72	64M		DUAL	R-PDMA-N200			133 MHz		Not Qualified	4831838208 bit						.04 Amp
MT18LSDT1672AG-13E	Micron Technology		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		4140 mA	16777216 words	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N168			143 MHz		Not Qualified	1207959552 bit						.036 Amp		5.4 ns
MT9VDDF6472PHY-262A1	Micron Technology		COMMERCIAL	200	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		3200 mA	67108864 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	64MX72	64M		DUAL	R-PDMA-N200			133 MHz		Not Qualified	4831838208 bit						.04 Amp
MT9JBF12872PY-80BD1	Micron Technology		COMMERCIAL	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		3150 mA	134217728 words	COMMON	1.5		1.5	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	70 Cel	3-STATE	128MX72	128M		DUAL	R-PDMA-N240			400 MHz		Not Qualified	9663676416 bit						.09 Amp
MT9HVF12872PKY-800E1	Micron Technology		COMMERCIAL	244	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		3015 mA	134217728 words	COMMON	1.8		1.8	72	MICROELECTRONIC ASSEMBLY	DIMM244,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	128MX72	128M		DUAL	R-PDMA-N244			400 MHz		Not Qualified	9663676416 bit						.063 Amp
MT72HTS2G72Y-667A1	Micron Technology		COMMERCIAL	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		6642 mA	2147483648 words	COMMON	1.8		1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	70 Cel	3-STATE	2GX72	2G		DUAL	R-PDMA-N240			333 MHz		Not Qualified	154618822656 bit						.576 Amp		.45 ns
MT9VDDT3272G-26A	Micron Technology		COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD			33554432 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M		DUAL	R-PDMA-N184			133 MHz		Not Qualified	2415919104 bit						.036 Amp		.75 ns
MT9VDDT6472HY-40BF2	Micron Technology		COMMERCIAL	200	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		4050 mA	67108864 words	COMMON	2.6		2.6	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	64MX72	64M		DUAL	R-PDMA-N200			200 MHz		Not Qualified	4831838208 bit						.045 Amp		.7 ns
MT28C3214P2FL-11T	Micron Technology	MEMORY CIRCUIT	COMMERCIAL	66	LFBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	ASYNCHRONOUS	95 mA	2097152 words			FLASH+SRAM	1.8/2	16	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA66,8X12,32	Other Memory ICs	.8 mm	70 Cel		2MX16	2M	TIN LEAD	BOTTOM	R-PBGA-B66	2.2 V	1.4 mm		8 mm	Not Qualified	33554432 bit	1.65 V	ALSO CONTAINS 256K X 16 SRAM	e0			.000001 Amp	12 mm	110 ns
MT9VDDT1672G-262	Micron Technology		COMMERCIAL	184	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		2970 mA	16777216 words	COMMON	2.5		2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	16MX72	16M		DUAL	R-PDMA-N184			167 MHz		Not Qualified	1207959552 bit						.027 Amp		.7 ns
MT9LSDT872AG-10B	Micron Technology		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		1890 mA	8388608 words	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M		DUAL	R-PDMA-N168			125 MHz		Not Qualified	603979776 bit						.018 Amp		6 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.