Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Interleaved Burst Length | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
4410 mA |
134217728 words |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N240 |
667 MHz |
Not Qualified |
9663676416 bit |
.09 Amp |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
33554432 words |
COMMON |
2.6 |
2.6 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
R-PDMA-N184 |
200 MHz |
Not Qualified |
2415919104 bit |
.036 Amp |
.7 ns |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
5940 mA |
268435456 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
55 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
R-PDMA-N240 |
200 MHz |
Not Qualified |
19327352832 bit |
260 |
.6 ns |
|||||||||||||||||||||||||||||||||||||||||
Micron Technology |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3690 mA |
67108864 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
R-PDMA-N200 |
125 MHz |
Not Qualified |
4831838208 bit |
.072 Amp |
.8 ns |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
67108864 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
R-PDMA-N184 |
167 MHz |
Not Qualified |
4831838208 bit |
.072 Amp |
.7 ns |
||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
66 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
95 mA |
2097152 words |
FLASH+SRAM |
1.8/2 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA66,8X12,32 |
Other Memory ICs |
.8 mm |
70 Cel |
2MX16 |
2M |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B66 |
2.2 V |
1.4 mm |
8 mm |
Not Qualified |
33554432 bit |
1.65 V |
ALSO CONTAINS 256K X 16 SRAM |
e0 |
.000001 Amp |
12 mm |
95 ns |
|||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
60 mA |
65536 words |
5 |
5 |
4 |
SMALL OUTLINE |
SOP24,.4 |
Other Memory ICs |
1.27 mm |
70 Cel |
64KX4 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
262144 bit |
e0 |
.004 Amp |
120 ns |
|||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
3.3 |
16 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX16 |
64M |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
1073741824 bit |
3 V |
FLASH MEMORY IS ORGANISED AS 4M X 64 |
|||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3285 mA |
33554432 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
R-PDMA-N184 |
133 MHz |
Not Qualified |
2415919104 bit |
.036 Amp |
.75 ns |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
6102 mA |
1073741824 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
1GX72 |
1G |
0 Cel |
DUAL |
R-PDMA-N240 |
333 MHz |
Not Qualified |
77309411328 bit |
.594 Amp |
.45 ns |
|||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3870 mA |
268435456 words |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
R-PDMA-N240 |
533 MHz |
Not Qualified |
19327352832 bit |
.09 Amp |
||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
134217728 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
55 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N240 |
200 MHz |
Not Qualified |
9663676416 bit |
.6 ns |
||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2043 mA |
134217728 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N240 |
200 MHz |
Not Qualified |
9663676416 bit |
.126 Amp |
.6 ns |
|||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2070 mA |
33554432 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
R-PDMA-N240 |
200 MHz |
Not Qualified |
2415919104 bit |
.045 Amp |
.6 ns |
|||||||||||||||||||||||||||||||||||||||||
Micron Technology |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1350 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
25.654 mm |
Not Qualified |
603979776 bit |
.018 Amp |
70 ns |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
5400 mA |
134217728 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N240 |
400 MHz |
Not Qualified |
9663676416 bit |
.126 Amp |
.4 ns |
|||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
33554432 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
R-PDMA-N184 |
133 MHz |
Not Qualified |
2415919104 bit |
.036 Amp |
.75 ns |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3510 mA |
134217728 words |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N240 |
533 MHz |
Not Qualified |
9663676416 bit |
.09 Amp |
||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
3.3 |
16 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX16 |
64M |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
1073741824 bit |
3 V |
FLASH MEMORY IS ORGANISED AS 4M X 64 |
|||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3150 mA |
33554432 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
2415919104 bit |
.036 Amp |
|||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
VIDEO DRAM |
COMMERCIAL |
40 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
185 mA |
262144 words |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
Other Memory ICs |
.8 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
2097152 bit |
e0 |
.01 Amp |
70 ns |
|||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3600 mA |
268435456 words |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
R-PDMA-N240 |
400 MHz |
Not Qualified |
19327352832 bit |
.09 Amp |
||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
40 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
120 mA |
131072 words |
5 |
5 |
8 |
IN-LINE |
ZIP40,.1 |
Other Memory ICs |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T40 |
Not Qualified |
1048576 bit |
e0 |
.01 Amp |
100 ns |
|||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
144 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
3.3 |
16 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
268435456 bit |
3 V |
FLASH MEMORY IS ORGANISED AS 4M X 64 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
244 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1775 mA |
67108864 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM244,24 |
Other Memory ICs |
.6 mm |
55 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
R-PDMA-N244 |
200 MHz |
Not Qualified |
4831838208 bit |
.025 Amp |
.6 ns |
|||||||||||||||||||||||||||||||||||||||||
Micron Technology |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
5220 mA |
134217728 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N184 |
166 MHz |
Not Qualified |
9663676416 bit |
.09 Amp |
.7 ns |
||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1890 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
125 MHz |
Not Qualified |
603979776 bit |
.018 Amp |
6 ns |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1073741824 words |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
1GX72 |
1G |
0 Cel |
DUAL |
R-PDMA-N240 |
800 MHz |
Not Qualified |
77309411328 bit |
||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
VIDEO DRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
160 mA |
131072 words |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
Other Memory ICs |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
120 ns |
|||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
40 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
110 mA |
131072 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ40,.44 |
Other Memory ICs |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J40 |
Not Qualified |
1048576 bit |
e0 |
.01 Amp |
120 ns |
|||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2205 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
R-PDMA-N168 |
125 MHz |
Not Qualified |
1207959552 bit |
.036 Amp |
6 ns |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3078 mA |
268435456 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
R-PDMA-N240 |
400 MHz |
Not Qualified |
19327352832 bit |
.4 ns |
||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
40 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
220 mA |
262144 words |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
Other Memory ICs |
.8 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
2097152 bit |
e0 |
.01 Amp |
60 ns |
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.
One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.
Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.
Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.