RECTANGULAR OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
AT27C4096-90PC	Atmel	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	262144 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	DUAL		R-PDIP-T40	1	5.5 V	5.59 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	52.2 mm	90 ns
AT27C512R-70RU	Atmel	OTP ROM	INDUSTRIAL	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE	SOP28,.5	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	2	5.5 V	2.79 mm	8.69 mm	Not Qualified	524288 bit	4.5 V		e3		250	.0001 Amp	18.25 mm	70 ns
AT27LV040A-90JU-T	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	10 mA	524288 words	COMMON	3.3		8	CHIP CARRIER	LCC32,.45X.55		1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel		QUAD	1	R-PQCC-J32		3.6 V	3.556 mm	11.43 mm		4194304 bit	3 V	ALSO OPERATES AT 5V SUPPLY				.00002 Amp	13.97 mm	90 ns	13
CY27C256-150JC	Rochester Electronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER				70 Cel		32KX8	32K	0 Cel	TIN LEAD	QUAD		R-PQCC-J32		5.5 V			Not Qualified	262144 bit	4.5 V		e0					150 ns
M27C256B-90B1	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	DUAL		R-PDIP-T28		5.5 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	36.83 mm	90 ns	12.75
M27C4001-10C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	MATTE TIN	QUAD		R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	13.97 mm	100 ns
M27C4001-12C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	MATTE TIN	QUAD		R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	13.97 mm	100 ns
M27C512-12C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	QUAD		R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		e0			.0001 Amp	13.97 mm	120 ns
M27C512-12C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD		R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		e0			.0001 Amp	13.97 mm	120 ns
M27W101-80K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD		R-PQCC-J32		3.6 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	2.7 V		e3			.000015 Amp	13.97 mm	80 ns
M27W101-80K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD		R-PQCC-J32		3.6 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	2.7 V		e3			.000015 Amp	13.97 mm	80 ns
WS57C256F-35J	STMicroelectronics	OTP ROM	COMMERCIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	50 mA	32768 words	COMMON	5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD		R-PQCC-J32		5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V		e0			.0002 Amp	13.995 mm	35 ns	12.75
5962-01-143-5793	Advanced Micro Devices	MEMORY CIRCUIT	MILITARY	20	DIP	RECTANGULAR	CERAMIC	NO		TTL	MIL-STD-883 Class B (Modified)	THROUGH-HOLE				512 words		5	5	8	IN-LINE	DIP20,.3	OTP ROMs	2.54 mm	125 Cel		512X8	512	-55 Cel		DUAL		R-XDIP-T20					Not Qualified	4096 bit								70 ns
5962-01-143-5798	Advanced Micro Devices	MEMORY CIRCUIT	MILITARY	20	DIP	RECTANGULAR	CERAMIC	NO		TTL	MIL-STD-883 Class B (Modified)	THROUGH-HOLE				512 words		5	5	8	IN-LINE	DIP20,.3	OTP ROMs	2.54 mm	125 Cel		512X8	512	-55 Cel		DUAL		R-XDIP-T20					Not Qualified	4096 bit								70 ns
AM27C256-120JC	Rochester Electronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER			1.27 mm	70 Cel		32KX8	32K	0 Cel		QUAD		R-PQCC-J32		5.5 V	3.55 mm	11.43 mm		262144 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED		13.97 mm	120 ns
AM27S29APCB	Advanced Micro Devices	OTP ROM	COMMERCIAL EXTENDED	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	160 mA	512 words		5	5	8	IN-LINE	DIP20,.3	OTP ROMs	2.54 mm	75 Cel	3-STATE	512X8	512	0 Cel	TIN LEAD	DUAL		R-PDIP-T20		5.25 V	5.08 mm	7.62 mm	Not Qualified	4096 bit	4.75 V		e0				26.035 mm	35 ns
AT27C010-45PU	Atmel	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	131072 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	DUAL		R-PDIP-T32	1	5.5 V	4.826 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V		e3		245	.00001 Amp	42.037 mm	45 ns
AT27C080-90JU	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	40 mA	1048576 words	COMMON	5		8	CHIP CARRIER	LCC32,.45X.55		1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	MATTE TIN	QUAD	1	R-PQCC-J32	3	5.5 V	3.556 mm	11.43 mm		8388608 bit	4.5 V		e3	40	245	.0001 Amp	13.97 mm	90 ns	13
AT27C1024-15PC	Atmel	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL		R-PDIP-T40	1	5.5 V	5.59 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V		e0			.0001 Amp	52.2 mm	150 ns
AT27C256R-70JC	Atmel	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	QUAD		R-PQCC-J32	2	5.5 V	3.55 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e0	30	225	.0001 Amp	13.97 mm	70 ns	13
AT27C256R-70PI	Atmel	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28	1	5.5 V	4.826 mm	15.24 mm	Not Qualified	262144 bit	4.5 V		e0	30	225	.0001 Amp	37.0205 mm	70 ns	13
AT27C4096-10PC	Atmel	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	262144 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40		5.5 V	5.59 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	52.2 mm	100 ns
AT27C4096-15PC	Atmel	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	262144 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	DUAL		R-PDIP-T40	1	5.5 V	5.59 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	52.2 mm	150 ns
AT27C4096-85PC	Atmel	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	40 mA	262144 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40		5.5 V	5.59 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	52.2 mm	85 ns
AT27LV512A-90JU	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	8 mA	65536 words	COMMON	3.3	3.3/5	8	CHIP CARRIER	LCC32,.45X.55	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	QUAD	1	R-PQCC-J32	3	3.6 V	3.556 mm	11.43 mm	Not Qualified	524288 bit	3 V	ALSO OPERATES AT 5V SUPPLY	e3	40	245	.00002 Amp	13.97 mm	90 ns	13
CY27C256A-45ZC	Rochester Electronics	OTP ROM	COMMERCIAL	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		32768 words		5		8	SMALL OUTLINE				70 Cel		32KX8	32K	0 Cel		DUAL		R-PDSO-G28		5.5 V			Not Qualified	262144 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED			45 ns
CY27C256A-70ZC	Rochester Electronics	OTP ROM	COMMERCIAL	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		32768 words		5		8	SMALL OUTLINE				70 Cel		32KX8	32K	0 Cel		DUAL		R-PDSO-G28		5.5 V			Not Qualified	262144 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED			70 ns
CY7C243-25PC	Cypress Semiconductor	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	100 mA	4096 words	COMMON	5	5	8	IN-LINE	DIP24,.3	OTP ROMs	2.54 mm	70 Cel	3-STATE	4KX8	4K	0 Cel	TIN LEAD	DUAL		R-PDIP-T24		5.5 V			Not Qualified	32768 bit	4.5 V		e0					25 ns
DS2502S-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS		GULL WING	SERIAL	SYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel		128X8	128	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				4.9 mm
HM1-7621A-8	Intersil	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC	NO		TTL	MIL-STD-883 Class B (Modified)	THROUGH-HOLE				512 words		5	5	4	IN-LINE	DIP16,.3	OTP ROMs	2.54 mm	125 Cel		512X4	512	-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T16					Not Qualified	2048 bit			e0					70 ns
M27C1001-10B1	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	MATTE TIN	DUAL		R-PDIP-T32		5.5 V	4.83 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	42.035 mm	100 ns
M27C1001-45XC1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	MATTE TIN	QUAD		R-PQCC-J32		5.25 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.75 V		e3			.0001 Amp	13.97 mm	45 ns
M27C256B-12XC1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD		R-PQCC-J32		5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0002 Amp	13.97 mm	120 ns	12.75
M27C4001-10B1	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	MATTE TIN	DUAL		R-PDIP-T32		5.5 V	4.83 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	42.035 mm	100 ns
AT27C1024-45VI	Atmel	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20	OTP ROMs	.5 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL		R-PDSO-G40	3	5.5 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.5 V		e0			.0001 Amp	12.4 mm	45 ns
AT27C256R-45PI	Atmel	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	20 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL		R-PDIP-T28	1	5.5 V	4.826 mm	15.24 mm	Not Qualified	262144 bit	4.5 V		e0			.0001 Amp	37.0205 mm	45 ns	13
AT27C512R-45JC	Atmel	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	20 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	QUAD		R-PQCC-J32	2	5.5 V	3.55 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		e0		225	.0001 Amp	13.97 mm	45 ns
AT27C512R-45JI	Atmel	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	20 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD		R-PQCC-J32	2	5.5 V	3.556 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		e0		225	.0001 Amp	13.97 mm	45 ns
AT27LV512A-90JU-T	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	8 mA	65536 words	COMMON	3.3		8	CHIP CARRIER	LCC32,.45X.55		1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		QUAD	1	R-PQCC-J32		3.6 V	3.556 mm	11.43 mm		524288 bit	3 V	ALSO OPERATES AT 5V SUPPLY				.00002 Amp	13.97 mm	90 ns	13
AT27BV256-70JU	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	8 mA	32768 words	COMMON	3	3/5	8	CHIP CARRIER	LCC32,.45X.55	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	1	R-PQCC-J32	3	3.6 V	3.556 mm	11.43 mm	Not Qualified	262144 bit	2.7 V	ALSO OPERATES AT 5V SUPPLY	e3	40	245	.00002 Amp	13.97 mm	70 ns	13
AT27BV256-70JU-T	Microchip Technology	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	8 mA	32768 words	COMMON	3		8	CHIP CARRIER	LCC32,.45X.55		1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel		QUAD	1	R-PQCC-J32		3.6 V	3.556 mm	11.43 mm		262144 bit	2.7 V	ALSO OPERATES AT 5V SUPPLY				.00002 Amp	13.97 mm	70 ns	13
M27C801-100K1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	35 mA	1048576 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	MATTE TIN	QUAD		R-PQCC-J32		5.5 V	3.56 mm	11.43 mm	Not Qualified	8388608 bit	4.5 V		e3			.0001 Amp	13.97 mm	100 ns
AT27LV040A-90JI	Atmel	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3/5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD		R-PQCC-J32	2	3.6 V	3.556 mm	11.43 mm	Not Qualified	4194304 bit	3 V	ALSO OPERATES AT 5V SUPPLY	e0		225	.00002 Amp	13.97 mm	90 ns
82S123/BEA	NXP Semiconductors	OTP ROM	MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32 words		5		8	IN-LINE			2.54 mm	125 Cel	3-STATE	32X8	32	-55 Cel		DUAL		R-GDIP-T16		5.5 V	5.08 mm	7.62 mm	Not Qualified	256 bit	4.5 V						19.535 mm	50 ns
82S123BEA	Qp Semiconductor	OTP ROM	MILITARY	16		RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32 words		5		8	IN-LINE				125 Cel		32X8	32	-55 Cel		DUAL		R-CDIP-T16		5.5 V			Not Qualified	256 bit	4.5 V							50 ns
AT27C040-90PI	Atmel	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL		R-PDIP-T32	1	5.5 V	4.826 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	42.037 mm	90 ns
AT27C512R-70TU	Atmel	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28,.53,22	OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		DUAL		R-PDSO-G28		5.5 V	1.2 mm	8 mm	Not Qualified	524288 bit	4.5 V					.0001 Amp	11.8 mm	70 ns
AT27C010-15PI	Atmel	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	131072 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	TIN LEAD	DUAL		R-PDIP-T32	1	5.5 V	5.59 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V		e0			.00001 Amp	42.05 mm	150 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.