AUTOMOTIVE OTP ROM 1,167

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M27C256B-12C3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.97 mm	120 ns	12.75
M27C1001-10N3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	TIN	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.5 V	e3			.0001 Amp	18.4 mm	100 ns
M27C512-80XC3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	524288 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.995 mm	80 ns
M27C512-20XN3F	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22	OTP ROMs	.55 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	TIN/TIN BISMUTH	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.75 V	e3/e6	NOT SPECIFIED	260	.0001 Amp	11.8 mm	200 ns
M27C1001-45C3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	1048576 bit	4.5 V	e3			.0001 Amp	13.995 mm	45 ns
M27C1001-80XN3XTR	STMicroelectronics		AUTOMOTIVE	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20	OTP ROMs	.5 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32					1048576 bit		e0			.0001 Amp		80 ns
M27C256B-25XN3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28,.53,22	OTP ROMs	.55 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.25 V	1.2 mm	8 mm	Not Qualified	262144 bit	4.75 V	e0			.0001 Amp	11.8 mm	150 ns	12.75
M27C512-10XC3E	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V	e3			.0001 Amp	13.97 mm	100 ns
M27C1024-70N3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20	OTP ROMs	.5 mm	125 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.5 V	e0			.0001 Amp	12.4 mm	70 ns
M27C256B-25K3XTR	STMicroelectronics		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32				Not Qualified	262144 bit		e3			.0001 Amp		250 ns	12.75
M27C256B-10XN3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28,.53,22	OTP ROMs	.55 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.25 V	1.2 mm	8 mm	Not Qualified	262144 bit	4.75 V	e0			.0001 Amp	11.8 mm	100 ns	12.75
M27C256B-15C3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.97 mm	150 ns	12.75
M27C1024-12C3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	OTP ROMs	1.27 mm	125 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V	e3			.0001 Amp	16.5862 mm	100 ns
M27C1001-15XC3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	13.97 mm	150 ns
M27C256B-20XC3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.97 mm	150 ns	12.75
M27C512-25XN3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22	OTP ROMs	.55 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.75 V	e0			.0001 Amp	11.8 mm	250 ns
M27C256B-80B3	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.5 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	36.83 mm	80 ns	12.75
M27C1024-90XN3	STMicroelectronics	OTP ROM	AUTOMOTIVE	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20	OTP ROMs	.5 mm	125 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.75 V	e0			.0001 Amp	12.4 mm	80 ns
M27C1024-12B3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	5.5 V		15.24 mm	Not Qualified	1048576 bit	4.5 V	e3			.0001 Amp	52.18 mm	100 ns
M27C256B-45XN3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28,.53,22	OTP ROMs	.55 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.25 V	1.2 mm	8 mm	Not Qualified	262144 bit	4.75 V	e0			.0001 Amp	11.8 mm	45 ns	12.75
M27C256B-70C3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.97 mm	70 ns	12.75
M27C1001-20XN3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	TIN	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	18.4 mm	200 ns
M27C1001-10XC3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	13.97 mm	100 ns
M27C256B-90XC3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.995 mm	90 ns	12.75
M27C256B-15XC3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.97 mm	150 ns	12.75
M27C1001-80XC3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	13.97 mm	80 ns
M27C256B-10XK3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.995 mm	100 ns	12.75
M27C256B-90K3XTR	STMicroelectronics		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32				Not Qualified	262144 bit		e3			.0001 Amp		90 ns	12.75
M27C512-45B3	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.5 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	4.5 V	e3			.0001 Amp	36.83 mm	45 ns
M27C1024-80XB3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	5.25 V		15.24 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	52.18 mm	80 ns
M27C512-70XC3F	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V	e3			.0001 Amp	13.97 mm	70 ns
M27C1001-90XN3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	TIN	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	18.4 mm	90 ns
M27C1024-10N3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20	OTP ROMs	.5 mm	125 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.5 V	e0			.0001 Amp	12.4 mm	100 ns
M27C512-80N3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22	OTP ROMs	.55 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.5 V	e0			.0001 Amp	11.8 mm	80 ns
M27C512-20C3XTR	STMicroelectronics		AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32					524288 bit		e3			.0001 Amp		200 ns
M27C202-90N3	STMicroelectronics	OTP ROM	AUTOMOTIVE	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	50 mA	131072 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.8,20	OTP ROMs	.5 mm	125 Cel	3-STATE	128KX16	128K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	2097152 bit	4.5 V	e0			.0001 Amp	12.4 mm	90 ns
M27C256B-90K3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.995 mm	90 ns	12.75
M27C256B-10XB3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.25 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	37.085 mm	100 ns	12.75
M27C512-10XB3E	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.5 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	4.75 V	e3			.0001 Amp	36.83 mm	100 ns
M27C1001-70XB3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	5.25 V	4.83 mm	15.24 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	42.035 mm	70 ns
M27C256B-25C3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.995 mm	150 ns	12.75
M27C256B-70B3	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.5 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	36.83 mm	70 ns	12.75
M27C512-25N3	STMicroelectronics	OTP ROM	AUTOMOTIVE	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22	OTP ROMs	.55 mm	125 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.5 V	e0			.0001 Amp	11.8 mm	250 ns
M27C256B-15M3	STMicroelectronics		AUTOMOTIVE	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	32768 words	COMMON	5	5	8	SMALL OUTLINE	SOP28,.4	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28				Not Qualified	262144 bit		e0			.0001 Amp		150 ns	12.75
M27C1024-20XK3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words		5		16	CHIP CARRIER			1.27 mm	125 Cel		64KX16	64K	-40 Cel		QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.75 V					16.5862 mm	100 ns
M27C256B-10C3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	13.97 mm	100 ns	12.75
M27C1024-55N3TR	STMicroelectronics	OTP ROM	AUTOMOTIVE	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20	OTP ROMs	.5 mm	125 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.5 V	e0			.0001 Amp	12.4 mm	55 ns
M27C1024-12XB3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6	OTP ROMs	2.54 mm	125 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	5.25 V		15.24 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	52.18 mm	100 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.