AUTOMOTIVE OTP ROM 1,167

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time Programming Voltage (V)

M27C512-10XN3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

5.5 V

1.25 mm

8 mm

Not Qualified

524288 bit

4.75 V

e0

.0001 Amp

11.8 mm

100 ns

M27C1001-12XN3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.8,20

OTP ROMs

.5 mm

125 Cel

3-STATE

128KX8

128K

-40 Cel

TIN

DUAL

R-PDSO-G32

5.25 V

1.2 mm

8 mm

Not Qualified

1048576 bit

4.75 V

e3

.0001 Amp

18.4 mm

120 ns

M27C1024-80XC3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.25 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.75 V

e3

.0001 Amp

16.5862 mm

80 ns

M27C512-70XB3E

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

524288 bit

4.75 V

e3

.0001 Amp

36.83 mm

70 ns

M27C256B-80XC3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.43 mm

Not Qualified

262144 bit

4.75 V

e3

.0001 Amp

13.97 mm

80 ns

12.75

M27C256B-25XK3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.455 mm

Not Qualified

262144 bit

4.75 V

e3

.0001 Amp

13.995 mm

150 ns

12.75

M27C1024-35K3

STMicroelectronics

OTP ROM

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

65536 words

5

16

CHIP CARRIER

1.27 mm

125 Cel

64KX16

64K

-40 Cel

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.5 V

16.5862 mm

35 ns

M27C512-10C3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.43 mm

Not Qualified

524288 bit

4.5 V

e0

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

13.97 mm

100 ns

M27C512-25XN3XTR

STMicroelectronics

AUTOMOTIVE

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

30 mA

65536 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G28

524288 bit

e0

.0001 Amp

250 ns

M27C512-60B3

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

36.83 mm

60 ns

M27C256B-70XN3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

5.25 V

1.2 mm

8 mm

Not Qualified

262144 bit

4.75 V

e0

.0001 Amp

11.8 mm

70 ns

12.75

M27C1024-60C3

STMicroelectronics

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

J BEND

35 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX16

64K

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J44

Not Qualified

1048576 bit

e0

.0001 Amp

60 ns

M27C256B-80K3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.455 mm

Not Qualified

262144 bit

4.5 V

e3

.0001 Amp

13.995 mm

80 ns

12.75

M27C1024-55C3

STMicroelectronics

OTP ROM

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

16.5862 mm

55 ns

M27C1024-12N3

STMicroelectronics

OTP ROM

AUTOMOTIVE

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.56,20

OTP ROMs

.5 mm

125 Cel

3-STATE

64KX16

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10 mm

Not Qualified

1048576 bit

4.5 V

e0

.0001 Amp

12.4 mm

100 ns

M27C256B-60XN3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

5.25 V

1.2 mm

8 mm

Not Qualified

262144 bit

4.75 V

e0

.0001 Amp

11.8 mm

60 ns

12.75

M27C512-20N3F

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

TIN/TIN BISMUTH

DUAL

R-PDSO-G28

5.5 V

1.25 mm

8 mm

Not Qualified

524288 bit

4.5 V

e3/e6

NOT SPECIFIED

260

.0001 Amp

11.8 mm

200 ns

M27C1001-90XC3XTR

STMicroelectronics

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

131072 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

128KX8

128K

-40 Cel

Matte Tin (Sn)

QUAD

R-PQCC-J32

1048576 bit

e3

.0001 Amp

90 ns

M27C512-60B3E

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

.0001 Amp

36.83 mm

60 ns

M27C512-12XC3X

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.455 mm

Not Qualified

524288 bit

4.75 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

13.995 mm

120 ns

M27C202-45K3

STMicroelectronics

OTP ROM

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

50 mA

131072 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

125 Cel

3-STATE

128KX16

128K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

2097152 bit

4.5 V

e3

.0001 Amp

16.5862 mm

45 ns

M27C320-80N3

STMicroelectronics

OTP ROM

AUTOMOTIVE

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

70 mA

2097152 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

OTP ROMs

.5 mm

125 Cel

3-STATE

2MX16

2M

-40 Cel

TIN LEAD

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

33554432 bit

4.5 V

e0

.0001 Amp

18.4 mm

80 ns

M27C256B-45XC3

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.43 mm

Not Qualified

262144 bit

4.75 V

e3

.0001 Amp

13.97 mm

45 ns

12.75

M27C512-70XB3

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

524288 bit

4.75 V

e3

.0001 Amp

36.83 mm

70 ns

M27C512-10N3E

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

TIN/TIN BISMUTH

DUAL

R-PDSO-G28

5.5 V

1.25 mm

8 mm

Not Qualified

524288 bit

4.5 V

e3/e6

NOT SPECIFIED

260

.0001 Amp

11.8 mm

100 ns

M27C1001-35N3XTR

STMicroelectronics

AUTOMOTIVE

32

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

30 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP32,.8,20

OTP ROMs

.5 mm

125 Cel

3-STATE

128KX8

128K

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G32

1048576 bit

e0

.0001 Amp

35 ns

M27C256B-60XC3X

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.455 mm

Not Qualified

262144 bit

4.75 V

e3

.0001 Amp

13.995 mm

60 ns

12.75

M27C202-150B3

STMicroelectronics

OTP ROM

AUTOMOTIVE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

131072 words

5

16

IN-LINE

2.54 mm

125 Cel

128KX16

128K

-40 Cel

DUAL

R-PDIP-T40

5.5 V

15.24 mm

Not Qualified

2097152 bit

4.5 V

52.18 mm

100 ns

M27C256B-12K3XTR

STMicroelectronics

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

Matte Tin (Sn)

QUAD

R-PQCC-J32

Not Qualified

262144 bit

e3

.0001 Amp

120 ns

12.75

M27C202-70N3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

50 mA

131072 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.56,20

OTP ROMs

.5 mm

125 Cel

3-STATE

128KX16

128K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10 mm

Not Qualified

2097152 bit

4.5 V

e0

.0001 Amp

12.4 mm

70 ns

M27C1024-55K3X

STMicroelectronics

OTP ROM

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

65536 words

5

16

CHIP CARRIER

1.27 mm

125 Cel

64KX16

64K

-40 Cel

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.5 V

16.5862 mm

55 ns

M27C1024-80XN3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.56,20

OTP ROMs

.5 mm

125 Cel

3-STATE

64KX16

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G40

5.25 V

1.2 mm

10 mm

Not Qualified

1048576 bit

4.75 V

e0

.0001 Amp

12.4 mm

80 ns

M27C1001-60XB3

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

IN-LINE

DIP32,.6

OTP ROMs

2.54 mm

125 Cel

3-STATE

128KX8

128K

-40 Cel

MATTE TIN

DUAL

R-PDIP-T32

5.25 V

4.83 mm

15.24 mm

Not Qualified

1048576 bit

4.75 V

e3

.0001 Amp

42.035 mm

60 ns

M27C256B-80XM3

STMicroelectronics

AUTOMOTIVE

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

30 mA

32768 words

COMMON

5

5

8

SMALL OUTLINE

SOP28,.4

OTP ROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

Not Qualified

262144 bit

e0

.0001 Amp

80 ns

12.75

M27C512-70N3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

5.5 V

1.25 mm

8 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

11.8 mm

70 ns

M27C256B-60XC3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.43 mm

Not Qualified

262144 bit

4.75 V

e3

.0001 Amp

13.97 mm

60 ns

12.75

M27C1001-90C3

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

128KX8

128K

-40 Cel

MATTE TIN

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.43 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

13.97 mm

90 ns

M27C512-12XN3F

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

TIN/TIN BISMUTH

DUAL

R-PDSO-G28

5.5 V

1.25 mm

8 mm

Not Qualified

524288 bit

4.75 V

e3/e6

NOT SPECIFIED

260

.0001 Amp

11.8 mm

120 ns

M27C202-70K3

STMicroelectronics

OTP ROM

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

50 mA

131072 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

125 Cel

3-STATE

128KX16

128K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

2097152 bit

4.5 V

e3

.0001 Amp

16.5862 mm

70 ns

M27C1001-60XN3

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.8,20

OTP ROMs

.5 mm

125 Cel

3-STATE

128KX8

128K

-40 Cel

TIN

DUAL

R-PDSO-G32

5.25 V

1.2 mm

8 mm

Not Qualified

1048576 bit

4.75 V

e3

.0001 Amp

18.4 mm

60 ns

M27C322-80S3

STMicroelectronics

OTP ROM

AUTOMOTIVE

42

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

70 mA

2097152 words

COMMON

5

5

16

IN-LINE, SHRINK PITCH

DIP42,.6

OTP ROMs

1.778 mm

125 Cel

3-STATE

2MX16

2M

-40 Cel

MATTE TIN

DUAL

R-PDIP-T42

5.5 V

5.08 mm

15.24 mm

Not Qualified

33554432 bit

4.5 V

e3

.0001 Amp

36.83 mm

80 ns

M27C1001-25XN3

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.8,20

OTP ROMs

.5 mm

125 Cel

3-STATE

128KX8

128K

-40 Cel

TIN

DUAL

R-PDSO-G32

5.25 V

1.2 mm

8 mm

Not Qualified

1048576 bit

4.75 V

e3

.0001 Amp

18.4 mm

250 ns

M27C512-60C3

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.43 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

13.97 mm

60 ns

M27C512-25XN3X

STMicroelectronics

OTP ROM

AUTOMOTIVE

28

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSSOP28,.53,22

OTP ROMs

.55 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

DUAL

R-PDSO-G28

5.25 V

1.2 mm

8 mm

Not Qualified

524288 bit

4.75 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

11.8 mm

150 ns

M27C512-20XC3X

STMicroelectronics

OTP ROM

AUTOMOTIVE

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

QUAD

R-PQCC-J32

5.25 V

3.56 mm

11.455 mm

Not Qualified

524288 bit

4.75 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

13.995 mm

150 ns

M27C1024-35C3

STMicroelectronics

OTP ROM

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

16.5862 mm

35 ns

M27C1001-25XN3XTR

STMicroelectronics

AUTOMOTIVE

32

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

30 mA

131072 words

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP32,.8,20

OTP ROMs

.5 mm

125 Cel

3-STATE

128KX8

128K

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G32

1048576 bit

e0

.0001 Amp

120 ns

M27C1024-55C3TR

STMicroelectronics

OTP ROM

AUTOMOTIVE

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

35 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

125 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

5.5 V

4.7 mm

16.5862 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

16.5862 mm

55 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.