INDUSTRIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M27C1001-60XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.75 V		e3			.0001 Amp	13.97 mm	60 ns
M27C1001-60C6XTR	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32					1048576 bit			e3			.0001 Amp		60 ns
M27C202-100N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	50 mA	131072 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	85 Cel	3-STATE	128KX16	128K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	2097152 bit	4.5 V		e0			.0001 Amp	12.4 mm	100 ns
M27C256B-20C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	150 ns	12.75
M27C256B-80XC7	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32				Not Qualified	262144 bit			e0			.0001 Amp		80 ns	12.75
M27C1001-45XB6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	5.25 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	4.75 V		e3			.0001 Amp	41.91 mm	45 ns
M27C2001-25XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.4554 mm	Not Qualified	2097152 bit	4.75 V		e3			.0001 Amp	13.995 mm	250 ns
M27C405-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.4554 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	13.995 mm	100 ns
M27C4002-70C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.57 mm	16.586 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	16.586 mm	70 ns
M27C512-20C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		e0			.0001 Amp	13.97 mm	200 ns
M27C1001-60C6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	13.995 mm	60 ns
M27C1024-45XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.75 V		e3			.0001 Amp	16.5862 mm	45 ns
M27C800-70XK6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	524288 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX16	512K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	4.75 V		e3			.00005 Amp	16.5862 mm	70 ns
M27C512-10XB6X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDIP-T28	5.25 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	37.085 mm	100 ns
M27C1024-70K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words		5		16	CHIP CARRIER				1.27 mm	85 Cel		64KX16	64K	-40 Cel		QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V						16.5862 mm	70 ns
M27C160-90XK6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.57 mm	16.585 mm	Not Qualified	16777216 bit	4.75 V		e3			.0001 Amp	16.585 mm	90 ns
M27C800-150XK6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	524288 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX16	512K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	4.75 V		e3			.00005 Amp	16.5862 mm	120 ns
M27C800-100M6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	524288 words	COMMON	5	5	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX16	512K	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	5.5 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	4.5 V		e3			.00005 Amp	28.2 mm	100 ns
M27C256B-12XB7	STMicroelectronics		INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28				Not Qualified	262144 bit			e0			.0001 Amp		120 ns	12.75
M27C1001-12XC6XTR	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32					1048576 bit			e3			.0001 Amp		120 ns
M27C801-45K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	1048576 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	8388608 bit	4.5 V		e3			.0001 Amp	13.97 mm	45 ns
M27C1024-10XN7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.75 V		e0			.0001 Amp	12.4 mm	100 ns
M27C1024-90C6X	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	16.5862 mm	80 ns
M27C256B-12XN7X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		32768 words		5		8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH				.55 mm	105 Cel		32KX8	32K	-40 Cel		DUAL	R-PDSO-G28	5.25 V	1.25 mm	8 mm	Not Qualified	262144 bit	4.75 V						11.8 mm	120 ns
M27C1001-20C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	13.97 mm	200 ns
M27C256B-70K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.995 mm	70 ns	12.75
M27C256B-45B6X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.5 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	37.085 mm	45 ns	12.75
M27C160-90XM6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	5.25 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	4.75 V	CONFIGURABLE AS 1M X 16	e3			.0001 Amp	28.2 mm	90 ns
M27C4001-45XC6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	13.97 mm	45 ns
M27C405-70K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.4554 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	13.995 mm	70 ns
M27C256B-90K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.995 mm	90 ns	12.75
M27C4002-70XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	16.5862 mm	70 ns
M27C4002-12XN6XTR	STMicroelectronics		INDUSTRIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			70 mA	262144 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40					4194304 bit			e0			.0001 Amp		120 ns
M27C256B-20XK6XTR	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32					262144 bit			e3			.0001 Amp		200 ns	12.75
M27C1024-35B6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	5.5 V		15.24 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	52.18 mm	35 ns
M27C256B-12XB7X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32768 words		5		8	IN-LINE				2.54 mm	105 Cel		32KX8	32K	-40 Cel		DUAL	R-PDIP-T28	5.25 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.75 V						37.085 mm	120 ns
M27C64A-30C6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	8192 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	8KX8	8K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	65536 bit	4.5 V		e3			.0001 Amp	13.995 mm	300 ns	12.5
M27C2001-80C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.4554 mm	Not Qualified	2097152 bit	4.5 V		e3			.0001 Amp	13.995 mm	80 ns
M27C4002-20N6XTR	STMicroelectronics		INDUSTRIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			70 mA	262144 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40					4194304 bit			e0			.0001 Amp		200 ns
M27C1024-10K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words		5		16	CHIP CARRIER				1.27 mm	85 Cel		64KX16	64K	-40 Cel		QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V						16.5862 mm	100 ns
M27C801-200K6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		1048576 words		5		8	CHIP CARRIER				1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	8388608 bit	4.5 V		e3				13.995 mm	200 ns
M27C1024-90B7	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	5.5 V		15.24 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	52.18 mm	80 ns
M27C1024-80C7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	16.5862 mm	80 ns
M27C2001-90B6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	5.5 V	5.08 mm	15.24 mm	Not Qualified	2097152 bit	4.5 V		e3			.0001 Amp	41.91 mm	90 ns
M27C256B-70C7X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER				1.27 mm	105 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.5 V						13.995 mm	70 ns
M27C202-10N6	STMicroelectronics		INDUSTRIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			50 mA	131072 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	128KX16	128K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40				Not Qualified	2097152 bit			e0			.0001 Amp		100 ns
M27C4001-55N6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	18.4 mm	55 ns
M27C400-100B6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	IN-LINE	DIP40,.6	8	OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T40	5.5 V		15.24 mm	Not Qualified	4194304 bit	4.5 V		e0			.0001 Amp	52.18 mm	100 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.