INDUSTRIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M27C2001-20XB6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	5.25 V	5.08 mm	15.24 mm	Not Qualified	2097152 bit	4.75 V		e3			.0001 Amp	41.91 mm	150 ns
M27C2001-10XK6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		262144 words		5		8	CHIP CARRIER				1.27 mm	85 Cel		256KX8	256K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	2097152 bit	4.75 V						13.995 mm	100 ns
M27C256B-10XK6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	100 ns	12.75
M27C256B-25C7	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32				Not Qualified	262144 bit			e0			.0001 Amp		250 ns	12.75
M27C512-70XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	524288 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.995 mm	70 ns
M27C4002-60N6X	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	18.4 mm	60 ns
M27C1024-15C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	16.5862 mm	100 ns
M27C1024-55XN6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.75 V		e0			.0001 Amp	12.4 mm	55 ns
M27C512-12XN6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	11.8 mm	120 ns
M27C1024-20XN7X	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.75 V		e0			.0001 Amp	12.4 mm	100 ns
M27C256B-80XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	80 ns	12.75
M27C4001-12XN6XTR	STMicroelectronics		INDUSTRIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32					4194304 bit			e0			.0001 Amp		100 ns
M27C202-120N6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		131072 words		5		16	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		128KX16	128K	-40 Cel		DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	2097152 bit	4.5 V						12.4 mm	100 ns
M27C256B-80XB6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.25 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	36.83 mm	80 ns	12.75
M27C512-20XN6XTR	STMicroelectronics		INDUSTRIAL	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28					524288 bit			e0			.0001 Amp		200 ns
M27C2001-90B6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	5.5 V	5.08 mm	15.24 mm	Not Qualified	2097152 bit	4.5 V		e3			.0001 Amp	41.91 mm	90 ns
M27C160-70K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.57 mm	16.585 mm	Not Qualified	16777216 bit	4.5 V		e3			.0001 Amp	16.585 mm	70 ns
M27C512-60C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		e0			.0001 Amp	13.97 mm	60 ns
M27C160-90M6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	5.5 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	4.5 V	USER CONFIGURABLE AS 1M X 16	e3			.0001 Amp	28.2 mm	90 ns
M27C160-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.57 mm	16.585 mm	Not Qualified	16777216 bit	4.5 V		e3			.0001 Amp	16.585 mm	100 ns
M27C1024-90B7X	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	5.5 V		15.24 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	52.18 mm	80 ns
M27C4002-15C6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.57 mm	16.586 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	16.586 mm	150 ns
M27C256B-10XN6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.25 V	1.2 mm	8 mm	Not Qualified	262144 bit	4.75 V		e0			.0001 Amp	11.8 mm	100 ns	12.75
M27C512-60C6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	524288 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.995 mm	60 ns
M27C512-12XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V					.0001 Amp	13.97 mm	120 ns
M27C4001-10XN6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	18.4 mm	100 ns
M27C1024-60XC6	STMicroelectronics		INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS	J BEND			35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44				Not Qualified	1048576 bit			e0			.0001 Amp		60 ns
M27C256B-90C6XTR	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32					262144 bit			e3			.0001 Amp		90 ns	12.75
M27C1024-55C7X	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	16.5862 mm	55 ns
M27C1024-20K7X	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words		5		16	CHIP CARRIER				1.27 mm	105 Cel		64KX16	64K	-40 Cel		QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V						16.5862 mm	100 ns
M27C4001-70N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	4194304 bit	4.5 V		e3			.0001 Amp	18.4 mm	70 ns
M27C1001-70XC6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.75 V		e3			.0001 Amp	13.97 mm	70 ns
M27C4001-80XN6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	4194304 bit	4.75 V		e0			.0001 Amp	18.4 mm	80 ns
M27C1024-20B6X	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	5.5 V		15.24 mm	Not Qualified	1048576 bit	4.5 V		e3			.0001 Amp	52.18 mm	100 ns
M27C256B-20N7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		32768 words		5		8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH				.55 mm	105 Cel		32KX8	32K	-40 Cel		DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	262144 bit	4.5 V						11.8 mm	150 ns
M27C2001-25XK6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		262144 words		5		8	CHIP CARRIER				1.27 mm	85 Cel		256KX8	256K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	2097152 bit	4.75 V						13.995 mm	150 ns
M27C256B-15N7	STMicroelectronics		INDUSTRIAL	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	32768 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28				Not Qualified	262144 bit			e0			.0001 Amp		150 ns	12.75
M27C512-12XN6XTR	STMicroelectronics		INDUSTRIAL	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28					524288 bit			e0			.0001 Amp		120 ns
M27C160-120M6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	DUAL	R-PDSO-G44	5.5 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	4.5 V	USER CONFIGURABLE AS 1M X 16	e3			.0001 Amp	28.2 mm	120 ns
M27C2001-25C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.4554 mm	Not Qualified	2097152 bit	4.5 V		e3			.0001 Amp	13.995 mm	250 ns
M27C4002-90XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.57 mm	16.586 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	16.586 mm	90 ns
M27C1024-90XN6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.75 V		e0			.0001 Amp	12.4 mm	80 ns
M27C1024-10XC6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.75 V		e3			.0001 Amp	16.5862 mm	100 ns
M27C256B-15XN6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28/32,.8,20		OTP ROMs	.55 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.25 V	1.2 mm	8 mm	Not Qualified	262144 bit	4.75 V		e0			.0001 Amp	11.8 mm	150 ns	12.75
M27C4001-15XB6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	5.25 V	5.08 mm	15.24 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	41.91 mm	100 ns
M27C256B-90XB6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.25 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	36.83 mm	90 ns	12.75
M27C4002-45XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	4.75 V		e3			.0001 Amp	16.5862 mm	45 ns
M27C512-15C6E	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		e3			.0001 Amp	13.97 mm	150 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.