INDUSTRIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M27C4001-80XN6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	4194304 bit	4.75 V	e3			.0001 Amp	18.4 mm	80 ns
M27C256B-80B6X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.5 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	37.085 mm	80 ns	12.75
M27C4001-10B6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	5.5 V	4.83 mm	15.24 mm	Not Qualified	4194304 bit	4.5 V	e3			.0001 Amp	42.035 mm	100 ns
M27C1024-35K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words		5		16	CHIP CARRIER				1.27 mm	85 Cel		64KX16	64K	-40 Cel		QUAD	S-PQCC-J44	5.5 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.5 V					16.5862 mm	35 ns
M27C2001-70N6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	TIN	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	2097152 bit	4.5 V	e3			.0001 Amp	18.4 mm	70 ns
M27C1024-10XB7	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	5.25 V		15.24 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	52.18 mm	100 ns
M27C1024-70N7	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.5 V	e0			.0001 Amp	12.4 mm	70 ns
M27C256B-12XC7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER				1.27 mm	105 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V					13.995 mm	120 ns
M27C1024-25XN7	STMicroelectronics		INDUSTRIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.56,20		OTP ROMs	.5 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40				Not Qualified	1048576 bit		e0			.0001 Amp		200 ns
M27C256B-70XC7X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER				1.27 mm	105 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V					13.995 mm	70 ns
M27C1024-35XK6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words		5		16	CHIP CARRIER				1.27 mm	85 Cel		64KX16	64K	-40 Cel		QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.75 V					16.5862 mm	35 ns
WS57C51C-45JI	STMicroelectronics	OTP ROM	INDUSTRIAL	32	WQCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	149 mA	16384 words		5	5	8	CHIP CARRIER, WINDOW	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	16KX8	16K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	131072 bit	4.5 V	e0				13.995 mm	45 ns
M27C256B-20XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V	e3			.0001 Amp	13.97 mm	150 ns	12.75
M27C4002-60C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.5 V	4.57 mm	16.586 mm	Not Qualified	4194304 bit	4.5 V	e3			.0001 Amp	16.586 mm	60 ns
M27C1024-80XC6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	16.5862 mm	80 ns
M27C256B-25N7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		32768 words		5		8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH				.55 mm	105 Cel		32KX8	32K	-40 Cel		DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	262144 bit	4.5 V					11.8 mm	150 ns
M27C4001-80XK6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		524288 words		5		8	CHIP CARRIER				1.27 mm	85 Cel		512KX8	512K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	4.75 V					13.995 mm	80 ns
M27C4002-80XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	4.75 V	e3			.0001 Amp	16.5862 mm	80 ns
M27C160-50XS6	STMicroelectronics	OTP ROM	INDUSTRIAL	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	IN-LINE, SHRINK PITCH	SDIP42,.6	8	OTP ROMs	1.778 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	TIN LEAD	DUAL	R-PDIP-T42	5.25 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	4.75 V	e0			.0001 Amp	36.83 mm	50 ns
M27C512-90C6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.995 mm	90 ns
M27C1001-10C6XTR	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32					1048576 bit		e3			.0001 Amp		100 ns
M27C512-60N6F	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN/TIN BISMUTH	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.5 V	e3/e6	NOT SPECIFIED	260	.0001 Amp	11.8 mm	60 ns
M27C2001-15XB6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	5.25 V	5.08 mm	15.24 mm	Not Qualified	2097152 bit	4.75 V	e3			.0001 Amp	41.91 mm	150 ns
M27C405-100N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	4194304 bit	4.5 V	e0			.0001 Amp	18.4 mm	100 ns
M27C1001-70XN6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	18.4 mm	70 ns
M27C1001-12XN6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	TIN	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.75 V	e3			.0001 Amp	18.4 mm	120 ns
M27C256B-12B6X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	5.5 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.5 V	e3			.0001 Amp	37.085 mm	120 ns	12.75
M27C512-12XC6XTR	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32					524288 bit		e3			.0001 Amp		120 ns
M27C1024-55N7	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.5 V	e0			.0001 Amp	12.4 mm	55 ns
M27C512-80N6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.5 V	e0			.0001 Amp	11.8 mm	80 ns
M27C512-70XC6F	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V	e3			.0001 Amp	13.97 mm	70 ns
M27C2001-90C6XTR	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	262144 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32					2097152 bit		e3			.0001 Amp		90 ns
M27C64A-30K6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	8192 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	8KX8	8K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	65536 bit	4.5 V	e3			.0001 Amp	13.97 mm	300 ns	12.5
M27C1024-12XK7X	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words		5		16	CHIP CARRIER				1.27 mm	105 Cel		64KX16	64K	-40 Cel		QUAD	S-PQCC-J44	5.25 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	4.75 V					16.5862 mm	100 ns
M27C4002-90N6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	70 mA	262144 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	4194304 bit	4.5 V	e3			.0001 Amp	18.4 mm	90 ns
M27C512-15N6X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDSO-G28	5.5 V	1.2 mm	8 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	11.8 mm	150 ns
M27C1024-45N7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	105 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.5 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.5 V	e0			.0001 Amp	12.4 mm	45 ns
M27C256B-45XN7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		32768 words		5		8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH				.55 mm	105 Cel		32KX8	32K	-40 Cel		DUAL	R-PDSO-G28	5.25 V	1.25 mm	8 mm	Not Qualified	262144 bit	4.75 V					11.8 mm	45 ns
M27C800-120B6	STMicroelectronics	OTP ROM	INDUSTRIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	70 mA	524288 words	COMMON	5	5	16	IN-LINE	DIP42,.6	8	OTP ROMs	2.54 mm	85 Cel	3-STATE	512KX16	512K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T42	5.5 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	4.5 V	e3			.00005 Amp	52.455 mm	120 ns
M27C512-45XN6X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDSO-G28	5.25 V	1.2 mm	8 mm	Not Qualified	524288 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	11.8 mm	45 ns
M27C512-25B7	STMicroelectronics		INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	105 Cel	3-STATE	64KX8	64K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				Not Qualified	524288 bit		e0			.0002 Amp		250 ns
M27C2001-25XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	2097152 bit	4.75 V	e3			.0001 Amp	13.97 mm	150 ns
M27C512-90N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	5.5 V	1.25 mm	8 mm	Not Qualified	524288 bit	4.5 V	e0			.0001 Amp	11.8 mm	90 ns
M27C256B-90C7	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32				Not Qualified	262144 bit		e0			.0001 Amp		90 ns	12.75
M27C1024-12XN6X	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	35 mA	65536 words	COMMON	5	5	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	5.25 V	1.2 mm	10 mm	Not Qualified	1048576 bit	4.75 V	e0			.0001 Amp	12.4 mm	100 ns
M27C256B-12B7X	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32768 words		5		8	IN-LINE				2.54 mm	105 Cel		32KX8	32K	-40 Cel		DUAL	R-PDIP-T28	5.5 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	4.5 V					37.085 mm	120 ns
M27C2001-12XN6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	5.25 V	1.2 mm	8 mm	Not Qualified	2097152 bit	4.75 V	e0			.0001 Amp	18.4 mm	120 ns
M27C160-90XK6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	70 mA	1048576 words	COMMON	5	5	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	5.25 V	4.57 mm	16.585 mm	Not Qualified	16777216 bit	4.75 V	e3			.0001 Amp	16.585 mm	90 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.