OTHER OTP ROM 57

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time Programming Voltage (V)

M27V402-120N5TR

STMicroelectronics

OTP ROM

OTHER

40

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

20 mA

262144 words

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP40,.8,20

Other Memory ICs

.5 mm

85 Cel

3-STATE

256KX16

256K

-20 Cel

TIN LEAD

DUAL

R-PDSO-G40

3.63 V

1.2 mm

10 mm

Not Qualified

4194304 bit

2.97 V

e0

.00002 Amp

18.4 mm

120 ns

M27V402-200K4TR

STMicroelectronics

OTP ROM

OTHER

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

262144 words

COMMON

3.3

3.3

16

CHIP CARRIER

LDCC44,.7SQ

Other Memory ICs

1.27 mm

70 Cel

3-STATE

256KX16

256K

-20 Cel

TIN LEAD

QUAD

S-PQCC-J44

3.63 V

4.7 mm

16.585 mm

Not Qualified

4194304 bit

2.97 V

e0

.00002 Amp

16.585 mm

200 ns

M27V405-120N5TR

STMicroelectronics

OTP ROM

OTHER

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

15 mA

524288 words

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.8,20

Other Memory ICs

.5 mm

85 Cel

3-STATE

512KX8

512K

-20 Cel

TIN LEAD

DUAL

R-PDSO-G32

3.63 V

1.2 mm

8 mm

Not Qualified

4194304 bit

2.97 V

e0

.00002 Amp

18.4 mm

120 ns

M27V402-120B4

STMicroelectronics

OTP ROM

OTHER

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

262144 words

COMMON

3.3

3.3

16

IN-LINE

DIP40,.6

OTP ROMs

2.54 mm

70 Cel

3-STATE

256KX16

256K

-20 Cel

TIN LEAD

DUAL

R-PDIP-T40

3.63 V

15.24 mm

Not Qualified

4194304 bit

2.97 V

e0

.00002 Amp

52.18 mm

120 ns

M27V402120N5

STMicroelectronics

OTP ROM

OTHER

40

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

20 mA

262144 words

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP40,.8,20

OTP ROMs

.5 mm

85 Cel

3-STATE

256KX16

256K

-20 Cel

TIN LEAD

DUAL

R-PDSO-G40

3.63 V

1.2 mm

10 mm

Not Qualified

4194304 bit

2.97 V

e0

.00002 Amp

18.4 mm

120 ns

M27V405-120K5

STMicroelectronics

OTP ROM

OTHER

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

COMMON

3.3

3.3

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-20 Cel

TIN LEAD

QUAD

R-PQCC-J32

3.63 V

3.56 mm

11.455 mm

Not Qualified

4194304 bit

2.97 V

e0

.0001 Amp

13.995 mm

120 ns

M27V402-150B5

STMicroelectronics

OTP ROM

OTHER

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

262144 words

COMMON

3.3

3.3

16

IN-LINE

DIP40,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

256KX16

256K

-20 Cel

TIN LEAD

DUAL

R-PDIP-T40

3.63 V

15.24 mm

Not Qualified

4194304 bit

2.97 V

e0

.00002 Amp

52.18 mm

150 ns

10149F

NXP Semiconductors

OTP ROM

OTHER

16

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

ECL

-5.2 V

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

160 mA

256 words

-5.2

4

IN-LINE

DIP16,.3

OTP ROMs

2.54 mm

85 Cel

OPEN-EMITTER

256X4

256

-30 Cel

TIN LEAD

DUAL

R-GDIP-T16

Not Qualified

1024 bit

e0

20 ns

10139F

NXP Semiconductors

OTP ROM

OTHER

16

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

ECL

-5.2 V

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

32 words

8

IN-LINE

DIP16,.3

OTP ROMs

2.54 mm

85 Cel

OPEN-EMITTER

32X8

32

-30 Cel

TIN LEAD

DUAL

R-GDIP-T16

Not Qualified

256 bit

e0

20 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.