Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
32X8 |
32 |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
19.535 mm |
50 ns |
|||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-M-38510 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
IN-LINE |
125 Cel |
512X4 |
512 |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.5 V |
Not Qualified |
2048 bit |
4.5 V |
85 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
8192 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
SMALL OUTLINE |
70 Cel |
64KX8 |
64K |
0 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
524288 bit |
4.5 V |
200 ns |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
512X4 |
512 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
2048 bit |
4.5 V |
35 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
2KX4 |
2K |
-55 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-GDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
8192 bit |
4.5 V |
e3/e4 |
90 ns |
||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
CHIP CARRIER |
70 Cel |
64KX8 |
64K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
524288 bit |
4.5 V |
170 ns |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
IN-LINE |
75 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-PDIP-T24 |
5.25 V |
Not Qualified |
4096 bit |
4.75 V |
60 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
30 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
-55 Cel |
QUAD |
S-CQCC-N28 |
5.5 V |
1.905 mm |
11.43 mm |
Not Qualified |
65536 bit |
4.5 V |
11.43 mm |
55 ns |
|||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
32X8 |
32 |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
19.535 mm |
35 ns |
|||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
75 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-PDIP-T24 |
5.25 V |
Not Qualified |
8192 bit |
4.75 V |
55 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
75 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-PDIP-T24 |
5.25 V |
Not Qualified |
8192 bit |
4.75 V |
70 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
512X8 |
512 |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
4096 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
IN-LINE |
75 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-PDIP-T20 |
5.25 V |
Not Qualified |
4096 bit |
4.75 V |
45 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
IN-LINE |
4KX8 |
4K |
DUAL |
R-PDIP-T24 |
5.25 V |
Not Qualified |
32768 bit |
4.75 V |
30 ns |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
512X4 |
512 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
2048 bit |
4.5 V |
35 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
4KX8 |
4K |
-55 Cel |
QUAD |
S-CQCC-N28 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
28 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
CHIP CARRIER |
75 Cel |
2KX8 |
2K |
0 Cel |
QUAD |
S-PQCC-N28 |
5.25 V |
Not Qualified |
16384 bit |
4.75 V |
35 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
8KX8 |
8K |
-55 Cel |
QUAD |
S-CQCC-N28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
55 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
512X4 |
512 |
-55 Cel |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
2048 bit |
4.5 V |
19.535 mm |
60 ns |
|||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
OTHER |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
ECL |
-5.2 V |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
160 mA |
256 words |
-5.2 |
4 |
IN-LINE |
DIP16,.3 |
OTP ROMs |
2.54 mm |
85 Cel |
OPEN-EMITTER |
256X4 |
256 |
-30 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
Not Qualified |
1024 bit |
e0 |
20 ns |
||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
20 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
CHIP CARRIER |
75 Cel |
512X8 |
512 |
0 Cel |
QUAD |
S-PQCC-N20 |
5.25 V |
Not Qualified |
4096 bit |
4.75 V |
45 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
20 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
CHIP CARRIER |
75 Cel |
32X8 |
32 |
0 Cel |
QUAD |
S-PQCC-N20 |
5.25 V |
Not Qualified |
256 bit |
4.75 V |
50 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
50 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
IN-LINE |
75 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-PDIP-T20 |
5.25 V |
Not Qualified |
4096 bit |
4.75 V |
60 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
1KX4 |
1K |
-55 Cel |
DUAL |
R-GDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4096 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE |
85 Cel |
64KX8 |
64K |
-40 Cel |
DUAL |
R-CDIP-T28 |
5.5 V |
524288 bit |
4.5 V |
120 ns |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
-55 Cel |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
8KX8 |
8K |
-55 Cel |
QUAD |
S-CQCC-N28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
45 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
4 |
IN-LINE |
75 Cel |
2KX4 |
2K |
0 Cel |
DUAL |
R-PDIP-T18 |
5.25 V |
Not Qualified |
8192 bit |
4.75 V |
100 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
IN-LINE |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDIP-T24 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
95 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
4KX8 |
4K |
-55 Cel |
QUAD |
S-CQCC-N28 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
95 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
IN-LINE |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDIP-T24 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
70 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE |
125 Cel |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDIP-T28 |
5.5 V |
524288 bit |
4.5 V |
150 ns |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
DUAL |
R-CDFP-F24 |
5.5 V |
2.286 mm |
9.144 mm |
Not Qualified |
8192 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
1KX4 |
1K |
-55 Cel |
DUAL |
R-GDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4096 bit |
4.5 V |
70 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
OPEN-COLLECTOR |
1KX4 |
1K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T18 |
5.5 V |
Not Qualified |
4096 bit |
4.5 V |
e0 |
80 ns |
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NXP Semiconductors |
OTP ROM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
4KX8 |
4K |
-55 Cel |
QUAD |
S-CQCC-N28 |
5.5 V |
32768 bit |
4.5 V |
95 ns |
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NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
28 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
CHIP CARRIER |
75 Cel |
1KX8 |
1K |
0 Cel |
QUAD |
S-PQCC-N28 |
5.25 V |
Not Qualified |
8192 bit |
4.75 V |
70 ns |
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NXP Semiconductors |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
CHIP CARRIER |
85 Cel |
64KX8 |
64K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
524288 bit |
4.5 V |
120 ns |
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NXP Semiconductors |
OTP ROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
SMALL OUTLINE |
85 Cel |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
524288 bit |
4.5 V |
120 ns |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
3-STATE |
32X8 |
32 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
2.159 mm |
6.731 mm |
Not Qualified |
256 bit |
4.5 V |
50 ns |
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NXP Semiconductors |
OTP ROM |
AUTOMOTIVE |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
SMALL OUTLINE |
125 Cel |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
524288 bit |
4.5 V |
200 ns |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
IN-LINE |
125 Cel |
4KX8 |
4K |
-55 Cel |
DUAL |
R-GDIP-T24 |
5.5 V |
Not Qualified |
32768 bit |
4.5 V |
45 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
COMMERCIAL EXTENDED |
28 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
CHIP CARRIER |
75 Cel |
1KX8 |
1K |
0 Cel |
QUAD |
S-PQCC-N28 |
5.25 V |
Not Qualified |
8192 bit |
4.75 V |
70 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
8 |
IN-LINE |
4KX8 |
4K |
DUAL |
R-CDIP-T24 |
5.25 V |
Not Qualified |
32768 bit |
4.75 V |
30 ns |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
512X8 |
512 |
-55 Cel |
QUAD |
S-CQCC-N28 |
5.5 V |
Not Qualified |
4096 bit |
4.5 V |
90 ns |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.