Texas Instruments OTP ROM 1,736

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Reverse Pinout	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
BQ2022ALPR	Texas Instruments	OTP ROM	COMMERCIAL	3	TO-92	ROUND	UNSPECIFIED	NO	1	CMOS		WIRE	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	CYLINDRICAL	SIP3,.1,50	OTP ROMs	1.27 mm	70 Cel		OPEN-DRAIN	1KX1	1K	0 Cel	Matte Tin (Sn)	BOTTOM	O-XBCY-W3		5.5 V	5.34 mm	.01667 MHz	4.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e3	NOT SPECIFIED	NOT SPECIFIED		4.3 mm
BQ2022ADBZR	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236	OTP ROMs	.95 mm	70 Cel		OPEN-DRAIN	1KX1	1K	-20 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
BQ2022ADBZRG4	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236	OTP ROMs	.95 mm	70 Cel		OPEN-DRAIN	1KX1	1K	-20 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
BQ2022ALPRE3	Texas Instruments	OTP ROM	OTHER	3	TO-92	ROUND	UNSPECIFIED	NO	1	CMOS		WIRE	SERIAL	ASYNCHRONOUS	.02 mA	1024 words	COMMON	2.7	3/5	1	CYLINDRICAL	SIP3,.1,50	OTP ROMs	1.27 mm	70 Cel		OPEN-DRAIN	1KX1	1K	-20 Cel	MATTE TIN	BOTTOM	O-XBCY-W3		5.5 V		.01667 MHz		Not Qualified	1024 bit	2.65 V	ORGANIZED AS 4 PAGES OF 32 BYTES EACH	e3
BQ2026DBZR	Texas Instruments	OTP ROM	OTHER	3	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1536 words	COMMON		3/5	1	SMALL OUTLINE	TO-236	OTP ROMs	.95 mm	70 Cel		OPEN-DRAIN	1.5KX1	1.5K	-20 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1536 bit	2.65 V		e4	NOT SPECIFIED	260		2.92 mm
BQ2024DBZR	Texas Instruments	OTP ROM	OTHER	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	ASYNCHRONOUS	.02 mA	1536 words	COMMON	2.7	3/5	1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236	OTP ROMs	.95 mm	70 Cel		OPEN-DRAIN	1.5KX1	1.5K	-20 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G3	1	5.5 V	1.12 mm	.01667 MHz	1.3 mm	Not Qualified	1536 bit	2.65 V	ORGANIZED AS 6 PAGES OF 32 BYTES EACH	e4	NOT SPECIFIED	260		2.92 mm
BQ2026LPR	Texas Instruments	OTP ROM	OTHER	3	TO-92	ROUND	UNSPECIFIED	NO	1	CMOS		THROUGH-HOLE	SERIAL	ASYNCHRONOUS	.02 mA	1536 words	COMMON		3/5	1	CYLINDRICAL	SIP3,.1,50	OTP ROMs	1.27 mm	70 Cel		OPEN-DRAIN	1.5KX1	1.5K	-20 Cel	Matte Tin (Sn)	BOTTOM	O-XBCY-T3		5.5 V	5.34 mm	.01667 MHz	4.3 mm	Not Qualified	1536 bit	2.65 V		e3	NOT SPECIFIED	NOT SPECIFIED		4.3 mm
TMS27LV010A-30FML4	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	3.3	3.3/5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		QUAD	R-PQCC-J32		3.6 V	3.56 mm		11.43 mm	Not Qualified	1048576 bit	3 V					.000025 Amp	13.97 mm	300 ns
TBP34S10-20J	Texas Instruments	OTP ROM	COMMERCIAL	16	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE			160 mA	256 words		5	5	4	IN-LINE	DIP16,.3	OTP ROMs	2.54 mm	70 Cel			256X4	256	0 Cel		DUAL	R-XDIP-T16						Not Qualified	1024 bit				NOT SPECIFIED	NOT SPECIFIED
SN74S188JP4	Texas Instruments	OTP ROM	COMMERCIAL	16	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE			110 mA	32 words		5	5	8	IN-LINE	DIP16,.3	OTP ROMs	2.54 mm	70 Cel			32X8	32	0 Cel		DUAL	R-XDIP-T16															40 ns
TBP28SA86-60MJ	Texas Instruments	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE				1024 words				8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	125 Cel			1KX8	1K	-55 Cel		DUAL	R-XDIP-T24						Not Qualified	8192 bit				NOT SPECIFIED	NOT SPECIFIED			60 ns
SN74S473N1	Texas Instruments	OTP ROM	COMMERCIAL	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		TTL		THROUGH-HOLE				512 words				8	IN-LINE	DIP20,.3	OTP ROMs	2.54 mm	70 Cel			512X8	512	0 Cel		DUAL	R-PDIP-T20						Not Qualified	4096 bit								75 ns
JBP28SA86MJ	Texas Instruments	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO		TTL	38535Q/M;38534H;883B	THROUGH-HOLE				1024 words				8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	125 Cel			1KX8	1K	-55 Cel		DUAL	R-XDIP-T24						Not Qualified	8192 bit				NOT SPECIFIED	NOT SPECIFIED			70 ns
TBP38SA16XFK	Texas Instruments	OTP ROM	COMMERCIAL	28	QCCN	SQUARE	CERAMIC	YES		TTL		NO LEAD				2048 words				8	CHIP CARRIER	LCC28,.45SQ	OTP ROMs	1.27 mm	70 Cel			2KX8	2K	0 Cel		QUAD	S-XQCC-N28						Not Qualified	16384 bit				NOT SPECIFIED	NOT SPECIFIED
TBP38S032-25FN	Texas Instruments	OTP ROM	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		TTL		J BEND			125 mA	32 words		5	5	8	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel			32X8	32	0 Cel		QUAD	S-PQCC-J20						Not Qualified					NOT SPECIFIED	NOT SPECIFIED			25 ns
JBP34S16X-30MFK	Texas Instruments	OTP ROM	MILITARY	20	QCCN	SQUARE	CERAMIC	YES		TTL	38535Q/M;38534H;883B	NO LEAD				4096 words		5	5	4	CHIP CARRIER	LCC20,.35SQ	OTP ROMs	1.27 mm	125 Cel			4KX4	4K	-55 Cel		QUAD	S-XQCC-N20						Not Qualified	16384 bit				NOT SPECIFIED	NOT SPECIFIED
TBP28L42MJ	Texas Instruments	OTP ROM	MILITARY	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		512 words		5	5	8	IN-LINE	DIP20,.3	OTP ROMs	2.54 mm	125 Cel			512X8	512	-55 Cel		DUAL	R-GDIP-T20		5.5 V	5.08 mm		7.62 mm	Not Qualified	4096 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED		24.195 mm	110 ns
TMS27PC256-10NE4	Texas Instruments	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		DUAL	R-PDIP-T28		5.5 V	5.08 mm		15.24 mm	Not Qualified	262144 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	36.32 mm	100 ns	13
TBP34L16X-40MFK	Texas Instruments	OTP ROM	MILITARY	20	QCCN	SQUARE	CERAMIC	YES		TTL		NO LEAD			100 mA	4096 words		5	5	4	CHIP CARRIER	LCC20,.35SQ	OTP ROMs	1.27 mm	125 Cel			4KX4	4K	-55 Cel		QUAD	S-XQCC-N20						Not Qualified	16384 bit				NOT SPECIFIED	NOT SPECIFIED			40 ns
TBP38S03X-30MFK	Texas Instruments	OTP ROM	MILITARY	20	QCCN	SQUARE	CERAMIC	YES		TTL		NO LEAD			125 mA	32 words		5	5	8	CHIP CARRIER	LCC20,.35SQ	OTP ROMs	1.27 mm	125 Cel			32X8	32	-55 Cel		QUAD	S-XQCC-N20						Not Qualified					NOT SPECIFIED	NOT SPECIFIED			30 ns
TMS27PC510-250NL	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	250 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	64KX8	64K	0 Cel		DUAL	R-PDIP-T32		5.25 V	5.08 mm		15.24 mm	Not Qualified	524288 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00003 Amp	41.4 mm	250 ns
SNJ54S188W	Texas Instruments	OTP ROM	MILITARY	16	DFP	RECTANGULAR	CERAMIC	YES		TTL	38535Q/M;38534H;883B	FLAT			110 mA	32 words		5	5	8	FLATPACK	FL16,.3	OTP ROMs	1.27 mm	125 Cel			32X8	32	-55 Cel		DUAL	R-XDFP-F16						Not Qualified									50 ns
SNJ54S473J	Texas Instruments	OTP ROM	MILITARY	20	DIP	RECTANGULAR	CERAMIC	NO		TTL	38535Q/M;38534H;883B	THROUGH-HOLE				512 words				8	IN-LINE	DIP20,.3	OTP ROMs	2.54 mm	125 Cel			512X8	512	-55 Cel		DUAL	R-XDIP-T20						Not Qualified	4096 bit								85 ns
TMS27PC512-25DUL	Texas Instruments	OTP ROM	COMMERCIAL	32	TSOP1-R	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	70 Cel	YES	3-STATE	64KX8	64K	0 Cel		DUAL	R-PDSO-G32		5.5 V	1.2 mm		8 mm	Not Qualified	524288 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	18.415 mm	250 ns
TMS27LV010A-20NL	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	3.3	3.3/5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDIP-T32		3.6 V	5.08 mm		15.24 mm	Not Qualified	1048576 bit	3 V					.000025 Amp	41.4 mm	200 ns
TMS27PC010A-10FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	1048576 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.97 mm	100 ns
TMS27PC256-15FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	262144 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns	13
TMS27PC128-2FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	16384 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	16KX8	16K	0 Cel		QUAD	R-PQCC-J32		5.25 V	3.56 mm		11.43 mm	Not Qualified	131072 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	200 ns	13
TMS27PC128-2NL4	Texas Instruments	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	16384 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	16KX8	16K	0 Cel		DUAL	R-PDIP-T28		5.25 V	5.08 mm		15.24 mm	Not Qualified	131072 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	36.32 mm	200 ns	13
TBP38R165-25MJT	Texas Instruments	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE				2048 words				8	IN-LINE	DIP24,.3	OTP ROMs	2.54 mm	125 Cel			2KX8	2K	-55 Cel		DUAL	R-XDIP-T24						Not Qualified	16384 bit				NOT SPECIFIED	NOT SPECIFIED
TBP28P85NP3	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		TTL		THROUGH-HOLE				1024 words		5	5	8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	70 Cel			1KX8	1K	0 Cel		DUAL	R-PDIP-T24							8192 bit				NOT SPECIFIED	NOT SPECIFIED
TBP28S86ANW	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1024 words		5	5	8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	70 Cel			1KX8	1K	0 Cel		DUAL	R-PDIP-T24		5.25 V	5.08 mm		15.24 mm	Not Qualified	8192 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED		31.75 mm	65 ns
TMS27PC040-80FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	50 mA	524288 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	512KX8	512K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.43 mm	Not Qualified	4194304 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.97 mm	80 ns
TBP18S46J4	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE			155 mA	512 words		5	5	8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	70 Cel			512X8	512	0 Cel		DUAL	R-XDIP-T24							4096 bit								75 ns
TBP34SA16XFK	Texas Instruments	OTP ROM	COMMERCIAL	20	QCCN	SQUARE	CERAMIC	YES		TTL		NO LEAD				4096 words				4	CHIP CARRIER	LCC20,.35SQ	OTP ROMs	1.27 mm	70 Cel			4KX4	4K	0 Cel		QUAD	S-XQCC-N20						Not Qualified	16384 bit				NOT SPECIFIED	NOT SPECIFIED
TBP28L46MJW	Texas Instruments	OTP ROM	MILITARY	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	85 mA	512 words		5	5	8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	125 Cel			512X8	512	-55 Cel		DUAL	R-GDIP-T24		5.5 V	5.7 mm		15.24 mm	Not Qualified	4096 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED		32.07 mm	110 ns
TMS27PC512-15DUL4	Texas Instruments	OTP ROM	COMMERCIAL	32	TSOP1-R	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	70 Cel	YES	3-STATE	64KX8	64K	0 Cel		DUAL	R-PDSO-G32		5.5 V	1.2 mm		8 mm	Not Qualified	524288 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	18.415 mm	150 ns
CBP18SA42MJ	Texas Instruments	OTP ROM	MILITARY	20	DIP	RECTANGULAR	CERAMIC	NO		TTL	MIL-STD-883 Class B (Modified)	THROUGH-HOLE				512 words				8	IN-LINE	DIP20,.3	OTP ROMs	2.54 mm	125 Cel			512X8	512	-55 Cel		DUAL	R-XDIP-T20						Not Qualified	4096 bit								85 ns
TBP28SA166JP4	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE				2048 words				8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	70 Cel			2KX8	2K	0 Cel		DUAL	R-XDIP-T24							16384 bit								80 ns
TMS27PC256FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32		5.25 V	3.56 mm		11.43 mm	Not Qualified	262144 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	250 ns	13
SN74S478NP1	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		TTL		THROUGH-HOLE				1024 words		5	5	8	IN-LINE	DIP24,.6	OTP ROMs	2.54 mm	70 Cel			1KX8	1K	0 Cel		DUAL	R-PDIP-T24						Not Qualified	8192 bit				NOT SPECIFIED	NOT SPECIFIED			70 ns
TMS27PC256-20NE4	Texas Instruments	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6	OTP ROMs	2.54 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		DUAL	R-PDIP-T28		5.5 V	5.08 mm		15.24 mm	Not Qualified	262144 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	36.32 mm	200 ns	13
TBP34S162-45FN	Texas Instruments	OTP ROM	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		TTL		J BEND			155 mA	4096 words		5	5	4	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel			4KX4	4K	0 Cel		QUAD	S-PQCC-J20						Not Qualified	16384 bit				NOT SPECIFIED	NOT SPECIFIED			45 ns
TBP28S85NP1	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		TTL		THROUGH-HOLE				1024 words		5	5	8	IN-LINE	DIP24,.3	OTP ROMs	2.54 mm	70 Cel			1KX8	1K	0 Cel		DUAL	R-PDIP-T24						Not Qualified	8192 bit				NOT SPECIFIED	NOT SPECIFIED
TBP38S22-25FN	Texas Instruments	OTP ROM	COMMERCIAL	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES		TTL		J BEND				256 words		5	5	8	CHIP CARRIER	LDCC20,.4SQ	OTP ROMs	1.27 mm	70 Cel			256X8	256	0 Cel		QUAD	S-PQCC-J20						Not Qualified	2048 bit				NOT SPECIFIED	NOT SPECIFIED			25 ns
TMS27PC128-1FML4	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		J BEND	PARALLEL	ASYNCHRONOUS	30 mA	16384 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	16KX8	16K	0 Cel		QUAD	R-PQCC-J32		5.25 V	3.56 mm		11.43 mm	Not Qualified	131072 bit	4.75 V			NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns	13
TBP24S81-55JP4	Texas Instruments	OTP ROM	COMMERCIAL	18	DIP	RECTANGULAR	CERAMIC	NO		TTL		THROUGH-HOLE			175 mA	2048 words				4	IN-LINE	DIP18,.3	OTP ROMs	2.54 mm	70 Cel			2KX4	2K	0 Cel		DUAL	R-XDIP-T18							8192 bit				NOT SPECIFIED	NOT SPECIFIED			55 ns
TBP28R165N3	Texas Instruments	OTP ROM	COMMERCIAL	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		TTL		THROUGH-HOLE				2048 words				8	IN-LINE	DIP24,.3	OTP ROMs	2.54 mm	70 Cel			2KX8	2K	0 Cel		DUAL	R-PDIP-T24							16384 bit

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.