Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
425 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.005 Amp |
4.5 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
16 |
FLATPACK |
1 mm |
70 Cel |
16KX16 |
16K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
3.63 V |
2.45 mm |
14 mm |
Not Qualified |
262144 bit |
3 V |
BYTE WRITE |
e0 |
YES |
14 mm |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
200 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
14 ns |
|||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
INTERLEAVED BURST |
e0 |
YES |
19.1262 mm |
11 ns |
||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
.02 Amp |
19.1262 mm |
25 ns |
|||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
9 |
FLATPACK |
18 |
.65 mm |
70 Cel |
3-STATE |
16KX9 |
16K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.25 V |
2.44 mm |
10 mm |
Not Qualified |
147456 bit |
4.75 V |
e0 |
YES |
10 mm |
28 ns |
||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.75 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
147456 bit |
e0 |
.02 Amp |
45 ns |
||||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
3.3 |
3.3 |
16 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
3 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.63 V |
4.57 mm |
19.1262 mm |
Not Qualified |
262144 bit |
3 V |
BYTE WRITE; ADDRESS/DATA INPUT LATCH |
e0 |
YES |
.01 Amp |
19.1262 mm |
20 ns |
|||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
8KX16 |
8K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
131072 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
19.1262 mm |
20 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
16 |
FLATPACK |
1 mm |
70 Cel |
16KX16 |
16K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
14 mm |
Not Qualified |
262144 bit |
4.5 V |
BYTE READ/WRITE; ADDRESS/DATA INPUT LATCH |
e0 |
YES |
14 mm |
25 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
280 mA |
16384 words |
COMMON |
5 |
5 |
16 |
FLATPACK |
QFP52,.68SQ,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
14 mm |
Not Qualified |
262144 bit |
4.5 V |
BYTE WRITE; ADDRESS/DATA INPUT LATCH |
e0 |
YES |
.015 Amp |
14 mm |
15 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
175 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.125 mm |
Not Qualified |
1179648 bit |
3.135 V |
BURST COUNTER; BYTE WRITE CONTROL; SELF TIMED REGISTER |
e0 |
YES |
.002 Amp |
19.125 mm |
17 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
LINEAR BURST |
e0 |
YES |
19.1262 mm |
11 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.125 mm |
Not Qualified |
1179648 bit |
3.135 V |
BURST COUNTER; BYTE WRITE CONTROL; SELF TIMED REGISTER |
e0 |
YES |
.005 Amp |
19.125 mm |
9 ns |
|||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
18 |
FLATPACK |
.65 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.25 V |
2.44 mm |
10 mm |
Not Qualified |
147456 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
10 mm |
24 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
16 |
CHIP CARRIER |
1.27 mm |
70 Cel |
16KX16 |
16K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.63 V |
4.57 mm |
19.1262 mm |
Not Qualified |
262144 bit |
3 V |
BYTE WRITE |
e0 |
YES |
19.1262 mm |
||||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
.02 Amp |
19.1262 mm |
20 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
225 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
LINEAR BURST |
e0 |
YES |
19.1262 mm |
11 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
19.1262 mm |
6 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
210 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
19.1262 mm |
8 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
280 mA |
16384 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
262144 bit |
4.5 V |
BYTE READ/WRITE; ADDRESS/DATA INPUT LATCH |
e0 |
YES |
.015 Amp |
19.1262 mm |
15 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
18 |
FLATPACK |
1 mm |
70 Cel |
3-STATE |
16KX18 |
16K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
14 mm |
Not Qualified |
294912 bit |
4.5 V |
BYTE WRITE; ADDRESS/DATA INPUT LATCH |
e0 |
YES |
14 mm |
15 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
310 mA |
16384 words |
COMMON |
5 |
5 |
16 |
FLATPACK |
QFP52,.68SQ,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
14 mm |
Not Qualified |
262144 bit |
4.5 V |
BYTE WRITE; ADDRESS/DATA INPUT LATCH |
e0 |
YES |
.015 Amp |
14 mm |
12 ns |
|||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX16 |
8K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
131072 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
.02 Amp |
19.1262 mm |
25 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
225 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
11 ns |
|||||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.25 V |
2.44 mm |
10 mm |
Not Qualified |
147456 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
.02 Amp |
10 mm |
25 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.6 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
e0 |
YES |
19.1262 mm |
6 ns |
||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
3.3 |
3.3 |
16 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX16 |
16K |
3 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.63 V |
4.57 mm |
19.1262 mm |
Not Qualified |
262144 bit |
3 V |
BYTE READ/WRITE; ADDRESS/DATA INPUT LATCH |
e0 |
YES |
.01 Amp |
19.1262 mm |
20 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
19.1262 mm |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
230 mA |
16384 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX18 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
294912 bit |
4.5 V |
BYTE WRITE |
e0 |
YES |
.015 Amp |
19.1262 mm |
25 ns |
|||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
.02 Amp |
19.1262 mm |
35 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
200 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
LINEAR BURST |
e0 |
YES |
19.1262 mm |
14 ns |
||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
.02 Amp |
19.1262 mm |
24 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
16384 words |
COMMON |
5 |
5 |
18 |
FLATPACK |
QFP52,.8SQ,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
16KX18 |
16K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
14 mm |
Not Qualified |
294912 bit |
4.5 V |
e0 |
YES |
.015 Amp |
14 mm |
17 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.6 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
e0 |
YES |
19.1262 mm |
5 ns |
||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
8KX16 |
8K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
131072 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
19.1262 mm |
35 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
300 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
.002 Amp |
19.1262 mm |
6 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
16384 words |
COMMON |
5 |
5 |
18 |
FLATPACK |
QFP52,.68SQ,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
16KX18 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.5 V |
2.45 mm |
14 mm |
Not Qualified |
294912 bit |
4.5 V |
BYTE WRITE |
e0 |
YES |
.015 Amp |
14 mm |
20 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
335 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
19.1262 mm |
5 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
300 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
19.1262 mm |
6 ns |
||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
220 mA |
16384 words |
COMMON |
5 |
5 |
9 |
FLATPACK |
QFP52,.52SQ |
18 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
16KX9 |
16K |
4.75 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1 |
S-PQFP-G52 |
5.25 V |
2.44 mm |
10 mm |
Not Qualified |
147456 bit |
4.75 V |
e0 |
YES |
.02 Amp |
10 mm |
28 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
19.1262 mm |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16384 words |
3.3 |
18 |
FLATPACK |
1 mm |
70 Cel |
16KX18 |
16K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
3.63 V |
2.45 mm |
14 mm |
Not Qualified |
294912 bit |
3 V |
BYTE WRITE |
e0 |
YES |
14 mm |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
335 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
19.1262 mm |
5 ns |
||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK |
QFP52,.68SQ,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
16KX18 |
16K |
3 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
3.63 V |
2.45 mm |
14 mm |
Not Qualified |
294912 bit |
3 V |
BYTE WRITE; ADDRESS/DATA INPUT LATCH |
e0 |
YES |
.01 Amp |
14 mm |
20 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.6 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
e0 |
YES |
19.1262 mm |
6 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
425 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
4.5 ns |
|||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
LINEAR BURST |
e0 |
YES |
.002 Amp |
19.1262 mm |
9 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.