CGA SRAM 30

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Output Enable Maximum Standby Current Length Maximum Access Time

5962F1120202VXA

Infineon Technologies

QDR SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

2097152 words

1.8

36

GRID ARRAY

1.27 mm

125 Cel

2MX36

2M

-55 Cel

TIN LEAD

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

21 mm

Qualified

75497472 bit

1.7 V

PIPELINED ARCHITECTURE

e0

25 mm

5962F1120101VXA

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1700 mA

4194304 words

COMMON

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

4MX18

4M

1.7 V

-55 Cel

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Qualified

75497472 bit

1.7 V

e0

NO

.66 Amp

25 mm

.85 ns

5962R1821402VXF

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

780 mA

8388608 words

COMMON

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

8MX18

8M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Qualified

150994944 bit

1.7 V

e0

NO

.39 Amp

25 mm

.85 ns

CYPT2643KV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

780 mA

8388608 words

COMMON

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

8MX18

8M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

150994944 bit

1.7 V

e0

NO

.39 Amp

25 mm

.85 ns

CYPT1545AV18-250GCMB

Infineon Technologies

QDR SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

2097152 words

1.8

36

GRID ARRAY

1.27 mm

125 Cel

2MX36

2M

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

21 mm

75497472 bit

1.7 V

PIPELINED ARCHITECTURE

e0

25 mm

CYWT1542AV18-250GCQB

Infineon Technologies

QDR SRAM

INDUSTRIAL

165

CGA

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

4194304 words

1.8

18

GRID ARRAY

1.27 mm

105 Cel

4MX18

4M

-40 Cel

TIN LEAD

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

21 mm

75497472 bit

1.7 V

e0

25 mm

.85 ns

CYPT1645KV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1040 mA

4194304 words

SEPARATE

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

4MX36

4M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

150994944 bit

1.7 V

PIPELINED ARCHITECTURE

e0

NO

.39 Amp

25 mm

.85 ns

CYPT1643KV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

780 mA

8388608 words

SEPARATE

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

8MX18

8M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

150994944 bit

1.7 V

PIPELINED ARCHITECTURE

e0

NO

.39 Amp

25 mm

.85 ns

CYWT1544AV18-250GCQB

Infineon Technologies

QDR SRAM

INDUSTRIAL

165

CGA

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

2097152 words

1.8

36

GRID ARRAY

1.27 mm

105 Cel

2MX36

2M

-40 Cel

TIN LEAD

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

21 mm

75497472 bit

1.7 V

e0

25 mm

.85 ns

CYRS2645KV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1040 mA

4194304 words

COMMON

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

4MX36

4M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

150994944 bit

1.7 V

e0

NO

.39 Amp

25 mm

.85 ns

5962R1821501VXF

Infineon Technologies

QDR II SRAM

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-PRF-38535 Class V

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1080 mA

4194304 words

COMMON

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

4MX36

4M

1.7 V

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Not Qualified

150994944 bit

1.7 V

e0

NO

.39 Amp

25 mm

5962R1821403VXF

Infineon Technologies

STANDARD SRAM

MILITARY

165

CGA

RECTANGULAR

100k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-PRF-38535 Class V

UNSPECIFIED

PARALLEL

SYNCHRONOUS

8388608 words

1.8

18

GRID ARRAY

1.27 mm

125 Cel

8MX18

8M

-55 Cel

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

21 mm

Qualified

150994944 bit

1.7 V

25 mm

5962R1821503VXF

Infineon Technologies

STANDARD SRAM

MILITARY

165

CGA

RECTANGULAR

100k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-PRF-38535 Class V

UNSPECIFIED

PARALLEL

SYNCHRONOUS

4194304 words

1.8

36

GRID ARRAY

1.27 mm

125 Cel

4MX36

4M

-55 Cel

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

21 mm

Qualified

150994944 bit

1.7 V

25 mm

CYRS1643KV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

780 mA

8388608 words

SEPARATE

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

8MX18

8M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

150994944 bit

1.7 V

PIPELINED ARCHITECTURE

e0

NO

.39 Amp

25 mm

.85 ns

5962R1821401VXF

Infineon Technologies

QDR II SRAM

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-PRF-38535 Class V

UNSPECIFIED

PARALLEL

SYNCHRONOUS

900 mA

8388608 words

COMMON

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

8MX18

8M

1.7 V

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Not Qualified

150994944 bit

1.7 V

e0

NO

.36 Amp

25 mm

CYPT1542AV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1700 mA

4194304 words

COMMON

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

4MX18

4M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

75497472 bit

1.7 V

e0

NO

.66 Amp

25 mm

.85 ns

CYRS2643KV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

780 mA

8388608 words

COMMON

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

8MX18

8M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

150994944 bit

1.7 V

e0

NO

.39 Amp

25 mm

.85 ns

CYRS1544AV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1700 mA

2097152 words

COMMON

1.8

1.8

36

GRID ARRAY

CGA165,11X15,50

SRAMs

1.27 mm

125 Cel

3-STATE

2MX36

2M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Not Qualified

75497472 bit

1.7 V

e0

NO

.66 Amp

25 mm

.85 ns

5962R1821404VXF

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

780 mA

8388608 words

SEPARATE

1.8

18

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

8MX18

8M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Qualified

150994944 bit

1.7 V

PIPELINED ARCHITECTURE

e0

NO

.39 Amp

25 mm

.85 ns

CYPT1544AV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1700 mA

2097152 words

COMMON

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

2MX36

2M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

75497472 bit

1.7 V

e0

NO

.66 Amp

25 mm

.85 ns

CYRS1543AV18-250GCMB

Infineon Technologies

QDR SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1275 mA

4194304 words

SEPARATE

1.8

1.8

18

GRID ARRAY

CGA165,11X15,50

SRAMs

1.27 mm

125 Cel

3-STATE

4MX18

4M

-55 Cel

TIN LEAD

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Not Qualified

75497472 bit

1.7 V

PIPELINED ARCHITECTURE

e0

.57 Amp

25 mm

.85 ns

CYPT1543AV18-250GCMB

Infineon Technologies

QDR SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

4194304 words

1.8

18

GRID ARRAY

1.27 mm

125 Cel

4MX18

4M

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

21 mm

75497472 bit

1.7 V

PIPELINED ARCHITECTURE

e0

25 mm

5962F1120201VXA

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1700 mA

2097152 words

COMMON

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

2MX36

2M

1.7 V

-55 Cel

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Qualified

75497472 bit

1.7 V

e0

NO

.66 Amp

25 mm

.85 ns

CYRS1542AV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1700 mA

4194304 words

COMMON

1.8

1.8

18

GRID ARRAY

CGA165,11X15,50

SRAMs

1.27 mm

125 Cel

3-STATE

4MX18

4M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Not Qualified

75497472 bit

1.7 V

e0

NO

.66 Amp

25 mm

.85 ns

5962R1821502VXF

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1040 mA

4194304 words

COMMON

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

4MX36

4M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Qualified

150994944 bit

1.7 V

e0

NO

.39 Amp

25 mm

.85 ns

5962R1821504VXF

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1040 mA

4194304 words

SEPARATE

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

4MX36

4M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Qualified

150994944 bit

1.7 V

PIPELINED ARCHITECTURE

e0

NO

.39 Amp

25 mm

.85 ns

CYRS1545AV18-250GCMB

Infineon Technologies

QDR SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1275 mA

2097152 words

SEPARATE

1.8

1.8

36

GRID ARRAY

CGA165,11X15,50

SRAMs

1.27 mm

125 Cel

3-STATE

2MX36

2M

-55 Cel

TIN LEAD

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

Not Qualified

75497472 bit

1.7 V

PIPELINED ARCHITECTURE

e0

.57 Amp

25 mm

.85 ns

CYPT2645KV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1040 mA

4194304 words

COMMON

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

4MX36

4M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

150994944 bit

1.7 V

e0

NO

.39 Amp

25 mm

.85 ns

CYRS1645KV18-250GCMB

Infineon Technologies

QDR II PLUS SRAM

MILITARY

165

CGA

RECTANGULAR

200k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

1040 mA

4194304 words

SEPARATE

1.8

36

GRID ARRAY

CGA165,11X15,50

1.27 mm

125 Cel

3-STATE

4MX36

4M

1.7 V

-55 Cel

TIN LEAD

BOTTOM

2

R-CBGA-X165

1

1.9 V

5.38 mm

250 MHz

21 mm

150994944 bit

1.7 V

PIPELINED ARCHITECTURE

e0

NO

.39 Amp

25 mm

.85 ns

5962F1120102VXA

Infineon Technologies

QDR SRAM

MILITARY

165

CGA

RECTANGULAR

300k Rad(Si)

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

UNSPECIFIED

PARALLEL

SYNCHRONOUS

4194304 words

1.8

18

GRID ARRAY

1.27 mm

125 Cel

4MX18

4M

-55 Cel

BOTTOM

R-CBGA-X165

1

1.9 V

5.38 mm

21 mm

Qualified

75497472 bit

1.7 V

PIPELINED ARCHITECTURE

e0

25 mm

SRAM

SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.

One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.

One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.