Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-PDMA-P28 |
5.5 V |
10.54 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
38.865 mm |
85 ns |
||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.01 Amp |
85 ns |
||||||||||||||||||||
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
.005 Amp |
200 ns |
|||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.005 Amp |
200 ns |
||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0006 Amp |
200 ns |
|||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
500 mA |
131072 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
128KX18 |
128K |
3.15 V |
0 Cel |
Matte Tin (Sn) |
QUAD |
2 |
R-PQFP-G128 |
3 |
3.45 V |
1.6 mm |
14 mm |
Not Qualified |
2359296 bit |
3.15 V |
e3 |
30 |
260 |
.015 Amp |
20 mm |
10 ns |
|||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
500 mA |
131072 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
128KX18 |
128K |
3.15 V |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
R-PQFP-G128 |
3 |
3.45 V |
1.6 mm |
14 mm |
Not Qualified |
2359296 bit |
3.15 V |
e3 |
30 |
260 |
.015 Amp |
20 mm |
10 ns |
|||||||||||
|
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
145 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
3.15 V |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-J32 |
3 |
3.6 V |
3.7592 mm |
7.62 mm |
Not Qualified |
1048576 bit |
3.15 V |
e3 |
40 |
260 |
.01 Amp |
20.955 mm |
10 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
140 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J32 |
3 |
3.6 V |
3.7592 mm |
7.62 mm |
Not Qualified |
1048576 bit |
3.15 V |
e3 |
40 |
260 |
.01 Amp |
20.955 mm |
12 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
170 mA |
524288 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
3 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e3 |
30 |
260 |
.02 Amp |
18.41 mm |
12 ns |
||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.4 V |
e1 |
10 |
260 |
.009 Amp |
8 mm |
10 ns |
||||||||||||
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
35 mA |
1048576 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
2 V |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
16777216 bit |
2.4 V |
.006 Amp |
8 mm |
10 ns |
|||||||||||||||||
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
35 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.4 V |
.006 Amp |
8 mm |
10 ns |
|||||||||||||||||
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
DUAL |
R-PDSO-G48 |
1 |
3.6 V |
1.2 mm |
12 mm |
16777216 bit |
2.4 V |
18.4 mm |
10 ns |
||||||||||||||||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.4 V |
e3 |
30 |
260 |
.006 Amp |
18.41 mm |
10 ns |
||||||||||||
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
1 |
3.63 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.97 V |
.006 Amp |
8 mm |
8 ns |
|||||||||||||||||
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.4 V |
.006 Amp |
8 mm |
8 ns |
|||||||||||||||||
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B48 |
1 |
3.63 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.97 V |
e3 |
.006 Amp |
8 mm |
8 ns |
||||||||||||||
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.4 V |
e3 |
.006 Amp |
8 mm |
8 ns |
||||||||||||||
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G44 |
1 |
3.63 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.97 V |
.006 Amp |
18.41 mm |
8 ns |
|||||||||||||||||
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G44 |
1 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.4 V |
.006 Amp |
18.41 mm |
8 ns |
|||||||||||||||||
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
1 |
3.63 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.97 V |
e3 |
.006 Amp |
18.41 mm |
8 ns |
||||||||||||||
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
1 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.4 V |
e3 |
.006 Amp |
18.41 mm |
8 ns |
||||||||||||||
Integrated Silicon Solution |
STANDARD SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T32 |
5.5 V |
4.572 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.00025 Amp |
41.91 mm |
70 ns |
||||||||||||||
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T32 |
5.5 V |
4.572 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.0004 Amp |
41.91 mm |
70 ns |
||||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
12 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.5 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
16777216 bit |
2.2 V |
e1 |
30 |
260 |
.000065 Amp |
8 mm |
45 ns |
||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
8388608 bit |
2.2 V |
NOT SPECIFIED |
NOT SPECIFIED |
18.4 mm |
45 ns |
||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
60 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
3 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.00002 Amp |
20.47 mm |
55 ns |
||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
60 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
3 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.00001 Amp |
20.47 mm |
55 ns |
||||||||||||||
|
Lyontek |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
10.16 mm |
4194304 bit |
2.7 V |
e3 |
30 |
260 |
20.95 mm |
55 ns |
|||||||||||||||||||||
Mitsubishi Electric |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
45 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
5.5 V |
5.5 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
YES |
.00001 Amp |
36.7 mm |
70 ns |
||||||||||||||
|
Microchip Technology |
STANDARD SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
8192 words |
SEPARATE |
1.8 |
1.8 |
8 |
SMALL OUTLINE |
SOP8,.23 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
1.5 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
3 |
1.95 V |
1.75 mm |
16 MHz |
3.9 mm |
Not Qualified |
65536 bit |
1.5 V |
e3 |
40 |
260 |
NO |
.000001 Amp |
4.9 mm |
|||||||||
|
Microchip Technology |
STANDARD SRAM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
10 mA |
8192 words |
SEPARATE |
1.8 |
1.8 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
1.5 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
1.95 V |
1.2 mm |
16 MHz |
3 mm |
Not Qualified |
65536 bit |
1.5 V |
e3 |
40 |
260 |
NO |
.000001 Amp |
4.4 mm |
|||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
135 mA |
32768 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
1.27 mm |
85 Cel |
32KX8 |
32K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
262144 bit |
4.5 V |
e3 |
260 |
YES |
.0006 Amp |
17.9324 mm |
20 ns |
||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
115 mA |
32768 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
1.27 mm |
85 Cel |
32KX8 |
32K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
262144 bit |
4.5 V |
e3 |
260 |
YES |
.0006 Amp |
17.9324 mm |
35 ns |
||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
170 mA |
8192 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
40 |
260 |
.015 Amp |
17.9324 mm |
19 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
170 mA |
8192 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
40 |
260 |
.015 Amp |
17.9324 mm |
25 ns |
||||||||||||
|
Renesas Electronics |
ZBT SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
195 mA |
524288 words |
COMMON |
2.5 |
2.5 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B119 |
3 |
2.625 V |
2.36 mm |
100 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.06 Amp |
22 mm |
5 ns |
||||||||||
|
Renesas Electronics |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
215 mA |
524288 words |
COMMON |
2.5 |
2.5 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQFP-G100 |
3 |
2.625 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e3 |
30 |
260 |
.06 Amp |
20 mm |
4.2 ns |
||||||||||
|
Renesas Electronics |
ZBT SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
235 mA |
524288 words |
COMMON |
2.5 |
2.5 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B119 |
3 |
2.625 V |
2.36 mm |
150 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.06 Amp |
22 mm |
3.8 ns |
||||||||||
|
Renesas Electronics |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
235 mA |
524288 words |
COMMON |
2.5 |
2.5 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQFP-G100 |
3 |
2.625 V |
1.6 mm |
150 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e3 |
30 |
260 |
.06 Amp |
20 mm |
3.8 ns |
||||||||||
|
Renesas Electronics |
ZBT SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
265 mA |
524288 words |
COMMON |
2.5 |
2.5 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B119 |
3 |
2.625 V |
2.36 mm |
166 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.06 Amp |
22 mm |
3.5 ns |
||||||||||
|
Renesas Electronics |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
265 mA |
524288 words |
COMMON |
2.5 |
2.5 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQFP-G100 |
3 |
2.625 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e3 |
30 |
260 |
.06 Amp |
20 mm |
3.5 ns |
||||||||||
|
Renesas Electronics |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
215 mA |
1048576 words |
COMMON |
2.5 |
2.5 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
2.38 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQFP-G100 |
3 |
2.625 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e3 |
30 |
260 |
.06 Amp |
20 mm |
4.2 ns |
||||||||||
|
Renesas Electronics |
STANDARD SRAM |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
150 mA |
65536 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
.8 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
3.15 V |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
1048576 bit |
3.15 V |
e3 |
30 |
260 |
YES |
.01 Amp |
18.41 mm |
12 ns |
||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
65536 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
.8 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
3.15 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
1048576 bit |
3.15 V |
e3 |
30 |
260 |
YES |
.01 Amp |
18.41 mm |
12 ns |
||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
16384 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
.8 mm |
85 Cel |
64KX16 |
16K |
3 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
262144 bit |
3 V |
e3 |
30 |
260 |
YES |
.01 Amp |
18.41 mm |
12 ns |
|||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
100 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
3 V |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
e3 |
40 |
260 |
.01 Amp |
20.95 mm |
15 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.