Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.005 Amp |
70 ns |
||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
70 ns |
|||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-P28 |
5.5 V |
10.668 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.01 Amp |
38.227 mm |
70 ns |
|||||||||||||||||
|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.005 Amp |
170 ns |
||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
1 |
5.5 V |
10.54 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
38.865 mm |
170 ns |
|||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
20 |
240 |
.005 Amp |
120 ns |
|||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P28 |
1 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0006 Amp |
120 ns |
||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
1 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
20 |
240 |
.005 Amp |
150 ns |
||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P28 |
1 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0006 Amp |
150 ns |
||||||||||||||||||||
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
.005 Amp |
70 ns |
|||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.005 Amp |
70 ns |
||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDIP-P28 |
5.5 V |
9.4 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0006 Amp |
38.227 mm |
70 ns |
||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-T32 |
1 |
5.25 V |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
20 |
240 |
.005 Amp |
120 ns |
|||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-T32 |
1 |
5.25 V |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
.0006 Amp |
120 ns |
||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-T32 |
1 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
85 ns |
|||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
.0006 Amp |
85 ns |
|||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
85 ns |
||||||||||||||||||||||
Microsemi |
STANDARD SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
55 ns |
||||||||||||||||||||||||||
Ramtron International |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
7 mA |
32768 words |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
Not Qualified |
262144 bit |
e0 |
240 |
.00015 Amp |
||||||||||||||||||||||||||||
|
Gsi Technology |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
QUAD |
R-PQFP-G100 |
2.7 V |
1.6 mm |
14 mm |
16777216 bit |
2.3 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
7.5 ns |
|||||||||||||||||||||||
|
Gsi Technology |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
QUAD |
R-PQFP-G100 |
2.7 V |
1.6 mm |
14 mm |
16777216 bit |
2.3 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
6.5 ns |
|||||||||||||||||||||||
|
Gsi Technology |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
QUAD |
R-PQFP-G100 |
2.7 V |
1.6 mm |
14 mm |
16777216 bit |
2.3 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
5.5 ns |
|||||||||||||||||||||||
|
Gsi Technology |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX36 |
2M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.7 V |
1.5 mm |
15 mm |
Not Qualified |
75497472 bit |
2.3 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 3.3V SUPPLY |
e1 |
260 |
17 mm |
6.5 ns |
||||||||||||||||||||
|
Gsi Technology |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX36 |
2M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2 V |
1.4 mm |
15 mm |
Not Qualified |
75497472 bit |
1.7 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY |
e1 |
260 |
17 mm |
6.5 ns |
||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
105 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.0002 Amp |
32.004 mm |
35 ns |
|||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
155 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-J32 |
3 |
5.5 V |
3.76 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
260 |
YES |
.01 Amp |
20.96 mm |
15 ns |
||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
155 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-J32 |
3 |
5.5 V |
3.683 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
30 |
260 |
YES |
.01 Amp |
20.955 mm |
15 ns |
||||||||||
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
160 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
40 |
260 |
.015 Amp |
17.9324 mm |
12 ns |
||||||||||||
|
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
160 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
40 |
260 |
.015 Amp |
17.9324 mm |
12 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
40 |
260 |
.015 Amp |
11.8 mm |
15 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
145 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
40 |
260 |
YES |
.015 Amp |
11.8 mm |
20 ns |
||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
145 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
40 |
260 |
.015 Amp |
11.8 mm |
25 ns |
||||||||||||
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
145 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
30 |
225 |
.015 Amp |
17.9324 mm |
25 ns |
|||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
150 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
3.15 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3.15 V |
e3 |
40 |
260 |
.01 Amp |
20.95 mm |
10 ns |
||||||||||||
|
Renesas Electronics |
CACHE SRAM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
90 mA |
32768 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
3 V |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
3 V |
e3 |
40 |
260 |
.002 Amp |
11.8 mm |
12 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
170 mA |
524288 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
3 V |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e3 |
30 |
260 |
.02 Amp |
18.41 mm |
12 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
170 mA |
524288 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e3 |
30 |
260 |
.02 Amp |
18.41 mm |
12 ns |
||||||||||||
|
Renesas Electronics |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
320 mA |
262144 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQFP-G100 |
3 |
3.465 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
BURST COUNTER |
e3 |
30 |
260 |
.06 Amp |
20 mm |
4.2 ns |
||||||||||
|
Renesas Electronics |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
256KX36 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e3 |
20 mm |
3.8 ns |
|||||||||||||||||||||
|
Renesas Electronics |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
256KX36 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e3 |
20 mm |
3.8 ns |
|||||||||||||||||||||
Renesas Electronics |
CACHE SRAM |
INDUSTRIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
210 mA |
262144 words |
COMMON |
3.3 |
3.3 |
36 |
GRID ARRAY, THIN PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.465 V |
1.2 mm |
87 MHz |
13 mm |
Not Qualified |
9437184 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e0 |
30 |
225 |
.07 Amp |
15 mm |
8.5 ns |
|||||||||||
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
55 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE |
SOJ44,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-J44 |
3 |
5.5 V |
3.75 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.0001 Amp |
28.575 mm |
12 ns |
|||||||||||||||
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
95 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.2 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
9 mm |
Not Qualified |
16777216 bit |
2.4 V |
e0 |
30 |
235 |
.02 Amp |
11 mm |
10 ns |
|||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
33554432 bit |
2.4 V |
NOT SPECIFIED |
NOT SPECIFIED |
18.4 mm |
10 ns |
||||||||||||||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
33554432 bit |
2.2 V |
NOT SPECIFIED |
NOT SPECIFIED |
18.4 mm |
10 ns |
||||||||||||||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
4194304 bit |
.009 Amp |
10 ns |
|||||||||||||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
45 ns |
||||||||||||||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
16777216 bit |
2.2 V |
NOT SPECIFIED |
NOT SPECIFIED |
18.4 mm |
45 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.