Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
National Semiconductor |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.84 mm |
7.62 mm |
Not Qualified |
262144 bit |
e0 |
45 ns |
|||||||||||||||||||||||||||
Defense Logistics Agency |
OTHER SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
27.555 mm |
35 ns |
|||||||||||||||||||||||
Defense Logistics Agency |
OTHER SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Qualified |
65536 bit |
4.5 V |
e0 |
32.004 mm |
35 ns |
|||||||||||||||||||||||
Defense Logistics Agency |
OTHER SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Qualified |
65536 bit |
4.5 V |
e0 |
32.004 mm |
70 ns |
|||||||||||||||||||||||
Defense Logistics Agency |
OTHER SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Qualified |
65536 bit |
4.5 V |
e0 |
32.004 mm |
45 ns |
|||||||||||||||||||||||
Defense Logistics Agency |
OTHER SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Qualified |
65536 bit |
4.5 V |
e0 |
32.004 mm |
35 ns |
|||||||||||||||||||||||
STMicroelectronics |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
45 ns |
||||||||||||||||||||||||
Defense Logistics Agency |
OTHER SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
27.555 mm |
35 ns |
|||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T28 |
1 |
5.5 V |
5.08 mm |
15.24 mm |
Qualified |
262144 bit |
4.5 V |
e0 |
240 |
YES |
.0008 Amp |
37.211 mm |
70 ns |
|||||||||||
Defense Logistics Agency |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
Qualified |
262144 bit |
4.5 V |
e0 |
25 ns |
|||||||||||||||||||||||||||
Defense Logistics Agency |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
QUAD |
R-CQCC-N32 |
5.5 V |
3.048 mm |
11.43 mm |
Qualified |
262144 bit |
4.5 V |
e0 |
13.97 mm |
55 ns |
|||||||||||||||||||||||
Defense Logistics Agency |
STANDARD SRAM |
MILITARY |
22 |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
IN-LINE |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T22 |
Qualified |
65536 bit |
e0 |
55 ns |
|||||||||||||||||||||||||||||||
Defense Logistics Agency |
SRAM MODULE |
MILITARY |
QFP |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
32 |
FLATPACK |
1.27 mm |
125 Cel |
512KX32 |
512K |
-55 Cel |
TIN LEAD |
QUAD |
5.5 V |
5.08 mm |
22.352 mm |
Qualified |
16777216 bit |
4.5 V |
e0 |
22.352 mm |
17 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
125 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T28 |
1 |
5.5 V |
5.08 mm |
15.24 mm |
Qualified |
262144 bit |
4.5 V |
e0 |
240 |
YES |
.0008 Amp |
37.211 mm |
55 ns |
|||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T28 |
1 |
5.5 V |
5.08 mm |
15.24 mm |
Qualified |
262144 bit |
4.5 V |
e0 |
240 |
YES |
.0008 Amp |
37.211 mm |
100 ns |
|||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
135 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T28 |
1 |
5.5 V |
5.08 mm |
15.24 mm |
Qualified |
262144 bit |
4.5 V |
e0 |
240 |
YES |
.0008 Amp |
37.211 mm |
45 ns |
|||||||||||
|
Infineon Technologies |
CACHE SRAM |
MILITARY |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
125 Cel |
1MX36 |
1M |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
37748736 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e4 |
260 |
20 mm |
6.5 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
1048576 words |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
125 Cel |
1MX16 |
1M |
2.2 V |
-55 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
e0 |
220 |
8 mm |
10 ns |
|||||||||||||||||||||||
Intersil |
STANDARD SRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
7.2 mA |
256 words |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
256X4 |
256 |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
1024 bit |
4.5 V |
e0 |
.00001 Amp |
220 ns |
||||||||||||||||||
Renesas Electronics |
DUAL-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
140 mA |
1024 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
2 |
R-CDIP-T48 |
1 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
NOT SPECIFIED |
240 |
.004 Amp |
60.96 mm |
100 ns |
|||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
140 mA |
1024 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
2 |
R-CDIP-T48 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
20 |
240 |
.004 Amp |
60.96 mm |
100 ns |
||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
315 mA |
2048 words |
COMMON |
5 |
5 |
16 |
GRID ARRAY |
PGA68,11X11 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX16 |
2K |
4.5 V |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
2 |
S-CPGA-P68 |
1 |
5.5 V |
5.207 mm |
29.464 mm |
Qualified |
32768 bit |
4.5 V |
e0 |
240 |
YES |
.03 Amp |
29.464 mm |
55 ns |
|||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.0002 Amp |
32.004 mm |
120 ns |
|||||||||||||
Xicor |
NON-VOLATILE SRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
1024 bit |
e0 |
300 ns |
||||||||||||||||||||||||||||
Xicor |
NON-VOLATILE SRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
1024 bit |
e0 |
300 ns |
||||||||||||||||||||||||||||
Xicor |
NON-VOLATILE SRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
1024 bit |
e0 |
300 ns |
||||||||||||||||||||||||||||
Defense Logistics Agency |
OTHER SRAM |
MILITARY |
28 |
QCCN |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
CHIP CARRIER |
1.27 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
QUAD |
X-CQCC-N28 |
5.5 V |
2.54 mm |
11.4554 mm |
Qualified |
65536 bit |
4.5 V |
e0 |
11.4554 mm |
55 ns |
|||||||||||||||||||||||
Microsemi |
STANDARD SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
55 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
105 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.0002 Amp |
32.004 mm |
35 ns |
|||||||||||||
Defense Logistics Agency |
OTHER SRAM |
MILITARY |
28 |
QCCN |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
CHIP CARRIER |
1.27 mm |
125 Cel |
16KX4 |
16K |
-55 Cel |
TIN LEAD |
QUAD |
X-CQCC-N28 |
5.5 V |
2.54 mm |
11.4554 mm |
Qualified |
65536 bit |
4.5 V |
e0 |
11.4554 mm |
55 ns |
|||||||||||||||||||||||
Defense Logistics Agency |
STANDARD SRAM |
MILITARY |
18 |
CERAMIC, GLASS-SEALED |
1 |
CMOS |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
1 |
IN-LINE |
125 Cel |
4KX1 |
4K |
-55 Cel |
DUAL |
5.5 V |
Not Qualified |
4096 bit |
4.5 V |
120 ns |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
95 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.0002 Amp |
32.004 mm |
45 ns |
|||||||||||||
Cypress Semiconductor |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
DUAL |
R-CDIP-T28 |
1 |
5.5 V |
4.14 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES |
.004 Amp |
35.56 mm |
35 ns |
||||||||||||||||||
Intersil |
STANDARD SRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
14 mA |
1024 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
1KX4 |
1K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
4096 bit |
e0 |
.000025 Amp |
320 ns |
|||||||||||||||||||||
Infineon Technologies |
CACHE SRAM |
MILITARY |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
125 Cel |
1MX36 |
1M |
-55 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
15 mm |
37748736 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e0 |
20 |
260 |
17 mm |
6.5 ns |
|||||||||||||||||||||
Cypress Semiconductor |
NON-VOLATILE SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC28(UNSPEC) |
SRAMs |
1.27 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
QUAD |
R-CQCC-N28 |
1 |
5.5 V |
2.29 mm |
8.89 mm |
Not Qualified |
65536 bit |
4.5 V |
RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES |
.004 Amp |
13.97 mm |
35 ns |
||||||||||||||||||
Defense Logistics Agency |
STANDARD SRAM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDFP-F28 |
5.5 V |
2.921 mm |
12.446 mm |
Qualified |
262144 bit |
4.5 V |
e0 |
18.288 mm |
55 ns |
||||||||||||||||||||||||
Motorola |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
150 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-CDIP-T28 |
5.5 V |
5.84 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.02 Amp |
37.145 mm |
100 ns |
||||||||||||
National Semiconductor |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
90 mA |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
256X4 |
256 |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
1024 bit |
e0 |
75 ns |
||||||||||||||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
125 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.02 Amp |
31.877 mm |
20 ns |
||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.02 Amp |
31.877 mm |
55 ns |
||||||||||||
Honeywell |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
225 Cel |
3-STATE |
32KX8 |
32K |
2.5 V |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
5.5 V |
4.445 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.00033 Amp |
35.56 mm |
50 ns |
||||||||||||||||
Simtek |
NON-VOLATILE SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-CDIP-T28 |
5.5 V |
4.14 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES |
e0 |
240 |
YES |
.004 Amp |
35.56 mm |
45 ns |
|||||||||||||
Cypress Semiconductor |
NON-VOLATILE SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC28(UNSPEC) |
SRAMs |
1.27 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
QUAD |
R-CQCC-N28 |
1 |
5.5 V |
2.29 mm |
8.89 mm |
Not Qualified |
65536 bit |
4.5 V |
RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES |
.004 Amp |
13.97 mm |
35 ns |
||||||||||||||||||
Cypress Semiconductor |
NON-VOLATILE SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T32 |
1 |
5.5 V |
4.11 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
EEPROM HARDWARE/SOFTWARE STORE; RETENTION/STORE CYCLE = 10 YEARS/100000 |
e0 |
.003 Amp |
40.64 mm |
45 ns |
||||||||||||||||
Texas Instruments |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
STANDARD SRAM |
MILITARY |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64 words |
4 |
IN-LINE |
DIP20,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
64X4 |
64 |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||
Texas Instruments |
MULTI-PORT SRAM |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
16X4 |
16 |
-55 Cel |
QUAD |
S-CQCC-N28 |
5.5 V |
2.03 mm |
11.43 mm |
Not Qualified |
64 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
11.43 mm |
16 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.