Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
DPDT |
INDUSTRIAL |
12 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N12 |
SEPARATE OUTPUT |
1 |
5 V |
.55 mm |
1.7 mm |
Not Qualified |
81 dB |
2.7 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
7.5 ohm |
.03 ohm |
2 mm |
||||||||||||||||||||||
|
Onsemi |
SPST |
MILITARY |
12 |
VSON |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
2.3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-XDSO-N12 |
5.5 V |
.9 mm |
1 mm |
Not Qualified |
57 dB |
1.65 V |
e3 |
13 ns |
7 ns |
.5 ohm |
3 mm |
||||||||||||||||||||||||||||
|
Onsemi |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
3.6 V |
.54 mm |
1.2 mm |
64 dB |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0042 ohm |
1.6 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
12 |
VSON |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
2.3 V |
1.8/5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC12,.04,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-XDSO-N12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.9 mm |
1 mm |
Not Qualified |
55 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
23 ns |
24 ohm |
12.5 ns |
.5 ohm |
3 mm |
|||||||||||||||||||
Onsemi |
DPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
BALL |
1.95 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
5.5 V |
.625 mm |
1.41 mm |
60 dB |
1.65 V |
75 ns |
5 ohm |
50 ns |
.15 ohm |
1.91 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
2 |
CMOS |
NO LEAD |
1.8 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N12 |
1 |
5.5 V |
.6 mm |
1.8 mm |
115 dB |
1.65 V |
e4 |
30 |
260 |
500000 ns |
1 ohm |
20000000 ns |
.03 ohm |
1.8 mm |
|||||||||||||||||||||||||
|
Onsemi |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
3 |
NO LEAD |
3.8 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N12 |
1 |
4.4 V |
.55 mm |
1.8 mm |
Not Qualified |
2.7 V |
e4 |
30 |
260 |
3 ohm |
1.8 mm |
|||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.3 V |
1.8/4 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
4.5 V |
.625 mm |
.8 mm |
Not Qualified |
70 dB |
1.65 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
180 ns |
.8 ohm |
120 ns |
.4 ohm |
1.2 mm |
|||||||||||||||||||
|
Onsemi |
4PST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
4 |
BALL |
GND/3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
3 V |
.625 mm |
1.16 mm |
Not Qualified |
NC |
90 dB |
1.6 V |
e1 |
30 |
260 |
120 ns |
.8 ohm |
1.56 mm |
|||||||||||||||||||||||
STMicroelectronics |
SPDT |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
CMOS |
BALL |
1.8/4 |
GRID ARRAY |
BGA12,3X4,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
Not Qualified |
BREAK-BEFORE-MAKE |
265 ns |
7 ohm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
1.8 V |
1.8/4 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
4.8 V |
.625 mm |
1.4 mm |
Not Qualified |
50 dB |
1.65 V |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
160 ns |
2.5 ohm |
62 ns |
40 ohm |
1.9 mm |
||||||||||||||||||||||
|
STMicroelectronics |
SPDT |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
CMOS |
BALL |
1.8/4 |
GRID ARRAY |
BGA12,3X4,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
Not Qualified |
NO/NC |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
265 ns |
7 ohm |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
DIFFERENTIAL MULTIPLEXER |
MILITARY |
12 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
3 |
CMOS |
NO LEAD |
2.7 V |
1.4/4.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.05X.08,16 |
Multiplexer or Switches |
.4 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM |
QUAD |
R-XQCC-N12 |
SEPARATE OUTPUT |
1 |
4.3 V |
.6 mm |
1.4 mm |
Not Qualified |
82 dB |
1.4 V |
2 SP3T |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
1.8 ohm |
25 ns |
.01 ohm |
2.2 mm |
||||||||||||||||||
|
STMicroelectronics |
SP3T |
INDUSTRIAL |
12 |
QCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
NO LEAD |
1.4/4.3 |
CHIP CARRIER |
LCC12,.05X.08,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQCC-N12 |
SEPARATE OUTPUT |
Not Qualified |
BREAK-BEFORE-MAKE |
50 ns |
4.8 ohm |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SPST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.55 mm |
1.36 mm |
NO |
1.66 mm |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SPST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.55 mm |
1.36 mm |
NO |
1.66 mm |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SPST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
5.5 V |
.55 mm |
1.36 mm |
NO |
3 V |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
630000 ns |
.1 ohm |
34500000 ns |
1.66 mm |
5.5 V |
|||||||||||||||||||||||||||
|
Diodes Incorporated |
VIDEO MULTIPLEXER |
INDUSTRIAL |
12 |
VSON |
RECTANGULAR |
YES |
UNSPECIFIED |
.8 mA |
1 |
2 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC12,.12,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDSO-N12 |
3.6 V |
.8 mm |
.12 A |
3 mm |
Not Qualified |
32 dB |
3 V |
e3 |
15 ns |
8 ohm |
9 ns |
.9 ohm |
3.5 mm |
||||||||||||||||||||||
|
Diodes Incorporated |
SPDT |
INDUSTRIAL |
12 |
VSON |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
NO LEAD |
1.8 V |
1.8/5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC12,.04,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N12 |
SEPARATE OUTPUT |
5.5 V |
.8 mm |
1 mm |
Not Qualified |
63 dB |
1.65 V |
e3 |
BREAK-BEFORE-MAKE |
30 ohm |
.5 ohm |
3 mm |
||||||||||||||||||||||||
|
Diodes Incorporated |
SPDT |
INDUSTRIAL |
12 |
VSON |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
NO LEAD |
3 V |
1.8/5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC12,.04,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N12 |
SEPARATE OUTPUT |
5.5 V |
.8 mm |
1 mm |
Not Qualified |
70 dB |
1.65 V |
e3 |
BREAK-BEFORE-MAKE |
25 ns |
2.6 ohm |
35 ns |
.03 ohm |
3 mm |
||||||||||||||||||||||
Diodes Incorporated |
DIFFERENTIAL MULTIPLEXER |
12 |
HVSON |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
NO LEAD |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC12,.12,20 |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G12 |
SEPARATE OUTPUT |
3.6 V |
.8 mm |
.12 A |
3 mm |
NO |
32 dB |
3 V |
8 ohm |
.9 ohm |
3.5 mm |
|||||||||||||||||||||||||||||||
|
Diodes Incorporated |
SPDT |
INDUSTRIAL |
12 |
VSON |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
NO LEAD |
3 V |
1.8/5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC12,.04,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N12 |
SEPARATE OUTPUT |
5.5 V |
.8 mm |
1 mm |
Not Qualified |
70 dB |
1.65 V |
e3 |
BREAK-BEFORE-MAKE |
25 ns |
2.6 ohm |
35 ns |
.03 ohm |
3 mm |
||||||||||||||||||||||
|
Diodes Incorporated |
SPDT |
INDUSTRIAL |
12 |
VSON |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
2.3 V |
1.8/5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC12,.04,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-XDSO-N12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
1 mm |
Not Qualified |
57 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
13 ns |
24 ohm |
7 ns |
.3 ohm |
3 mm |
|||||||||||||||||||||
Maxim Integrated |
SPST |
COMMERCIAL |
12 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
-18 V |
-15 V |
15 V |
+-15 |
UNCASED CHIP |
DIE OR CHIP |
Multiplexer or Switches |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N12 |
SEPARATE OUTPUT |
1 |
18 V |
Not Qualified |
NC |
62 dB |
5 V |
-5 V |
e0 |
BREAK-BEFORE-MAKE |
300 ns |
50 ohm |
250 ns |
|||||||||||||||||||||||
Maxim Integrated |
SPDT |
COMMERCIAL |
12 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
NO LEAD |
-18 V |
-15 V |
15 V |
+-15 |
UNCASED CHIP |
DIE OR CHIP |
Multiplexer or Switches |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N12 |
1 |
18 V |
Not Qualified |
62 dB |
5 V |
-5 V |
e0 |
BREAK-BEFORE-MAKE |
300 ns |
50 ohm |
250 ns |
|||||||||||||||||||||||||
Maxim Integrated |
SPST |
COMMERCIAL |
12 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
-20 V |
-15 V |
15 V |
UNCASED CHIP |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N12 |
1 |
20 V |
Not Qualified |
72 dB |
4.5 V |
-4.5 V |
e0 |
250 ns |
45 ohm |
200 ns |
3 ohm |
||||||||||||||||||||||||||||
Maxim Integrated |
SPST |
COMMERCIAL |
12 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
-20 V |
UNCASED CHIP |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N12 |
20 V |
Not Qualified |
5 V |
-5 V |
e0 |
35 ohm |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
BGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BICMOS |
BALL |
3 V |
GRID ARRAY |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
65 dB |
2.7 V |
e1 |
30 |
260 |
250000 ns |
3 ohm |
6000 ns |
||||||||||||||||||||||||||||||
Maxim Integrated |
INDUSTRIAL |
12 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
3/5 |
CHIP CARRIER |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-N12 |
1 |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
245 |
60 ns |
70 ohm |
|||||||||||||||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.008 mA |
2 |
3 |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
Not Qualified |
e1 |
30 |
260 |
1000 ns |
.8 ohm |
|||||||||||||||||||||||||||||||
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO/NC |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
.95 ohm |
||||||||||||||||||||||||||||||||
|
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BICMOS |
BALL |
3 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
3.3 V |
.67 mm |
1.54 mm |
Not Qualified |
64 dB |
2.7 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
60 ns |
.8 ohm |
40 ns |
.06 ohm |
2.02 mm |
|||||||||||||||||||
|
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BALL |
3 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.52 mm |
Not Qualified |
64 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
.8 ohm |
30 ns |
.06 ohm |
2.02 mm |
||||||||||||||||||||
|
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
65 dB |
1.8 V |
e3 |
30 |
260 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
4 mm |
||||||||||||||||||||||||
|
Maxim Integrated |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
BGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BICMOS |
BALL |
3 V |
GRID ARRAY |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
65 dB |
2.7 V |
e1 |
30 |
260 |
250000 ns |
3 ohm |
6000 ns |
||||||||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
2.02 mm |
||||||||||||||||||||
Maxim Integrated |
SPST |
COMMERCIAL |
12 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
-18 V |
-15 V |
15 V |
+-15 |
UNCASED CHIP |
DIE OR CHIP |
Multiplexer or Switches |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N12 |
SEPARATE OUTPUT |
1 |
18 V |
Not Qualified |
NO |
62 dB |
5 V |
-5 V |
e0 |
BREAK-BEFORE-MAKE |
250 ns |
50 ohm |
150 ns |
|||||||||||||||||||||||
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO/NC |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
.95 ohm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
3 V |
1.8/3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
SEPARATE OUTPUT |
1 |
3.6 V |
.9 mm |
3 mm |
Not Qualified |
52 dB |
1.6 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
25 ns |
.8 ohm |
20 ns |
.1 ohm |
3 mm |
|||||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
3/5 |
CHIP CARRIER |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N12 |
1 |
Not Qualified |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
60 ns |
70 ohm |
|||||||||||||||||||||||||||||
Maxim Integrated |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N12 |
1 |
5.5 V |
1 mm |
.05 A |
4 mm |
Not Qualified |
80 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
22 ns |
7 ohm |
14 ns |
.1 ohm |
4 mm |
|||||||||||||||||||||
Maxim Integrated |
DIFFERENTIAL MULTIPLEXER |
COMMERCIAL |
12 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
CMOS |
NO LEAD |
-8 V |
-5 V |
5 V |
UNCASED CHIP |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N12 |
1 |
8 V |
Not Qualified |
75 dB |
2.7 V |
-2.7 V |
e0 |
150 ns |
100 ohm |
150 ns |
4 ohm |
||||||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
1 |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
1 |
3.3 V |
.8 mm |
3 mm |
Not Qualified |
75 dB |
2.7 V |
e0 |
245 |
30 ns |
60 ohm |
18 ns |
3 ohm |
3 mm |
|||||||||||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.008 mA |
2 |
3 |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B12 |
Not Qualified |
e3 |
1000 ns |
.8 ohm |
||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
1.8 V |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
.9 mm |
.15 A |
3 mm |
Not Qualified |
56 dB |
1.6 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
2 ohm |
25 ns |
3 mm |
|||||||||||||||||||
|
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
65 dB |
1.8 V |
e3 |
30 |
260 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
4 mm |
||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BALL |
3 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
64 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
50 ns |
.8 ohm |
30 ns |
.06 ohm |
2.02 mm |
||||||||||||||||||||||
Maxim Integrated |
SPST |
COMMERCIAL |
12 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
NO LEAD |
-6 V |
-5 V |
5 V |
UNCASED CHIP |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N12 |
1 |
6 V |
Not Qualified |
65 dB |
2 V |
-2 V |
e0 |
100 ns |
100 ohm |
50 ns |
4 ohm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.