Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.16SQ,32 |
Multiplexer or Switches |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
4 mm |
|||||||||||||||||||||
Maxim Integrated |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
1.8 V |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
.9 mm |
.15 A |
3 mm |
Not Qualified |
56 dB |
1.6 V |
e0 |
BREAK-BEFORE-MAKE |
30 ns |
2 ohm |
25 ns |
3 mm |
||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
55 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
2.02 mm |
|||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.16SQ,32 |
Multiplexer or Switches |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
4 mm |
||||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO/NC |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
.95 ohm |
|||||||||||||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.008 mA |
2 |
3 |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B12 |
Not Qualified |
e3 |
1000 ns |
.8 ohm |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
2.02 mm |
|||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.16SQ,32 |
Multiplexer or Switches |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
SEPARATE OUTPUT |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
4 mm |
||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
2.02 mm |
||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
55 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
20 ohm |
40 ns |
.15 ohm |
2.02 mm |
||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
1 |
1 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N12 |
SEPARATE OUTPUT |
1 |
3.3 V |
1 mm |
3 mm |
Not Qualified |
75 dB |
2.7 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
30 ns |
60 ohm |
18 ns |
3 ohm |
3 mm |
|||||||||||||||||||||
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO/NC |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
.95 ohm |
||||||||||||||||||||||||||||||||
|
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.69 mm |
1.55 mm |
84 dB |
2.3 V |
e1 |
30 |
260 |
60000000 ns |
.5 ohm |
3000 ns |
.01 ohm |
2.135 mm |
|||||||||||||||||||||||||
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO/NC |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
.95 ohm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
1 |
CMOS |
NO LEAD |
1.8 V |
1.8/3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N12 |
SEPARATE OUTPUT |
1 |
3.6 V |
1 mm |
3 mm |
Not Qualified |
52 dB |
1.6 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
30 ns |
2 ohm |
25 ns |
3 mm |
||||||||||||||||||||||
Maxim Integrated |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
1 |
3.3 V |
.9 mm |
.02 A |
3 mm |
Not Qualified |
85 dB |
2.7 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
70 ns |
60 ohm |
30 ns |
1 ohm |
3 mm |
||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BALL |
3 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
64 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
50 ns |
.8 ohm |
30 ns |
.06 ohm |
2.02 mm |
||||||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
Not Qualified |
NO/NC |
e3 |
BREAK-BEFORE-MAKE |
80 ns |
.95 ohm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
1 |
3.3 V |
.9 mm |
.02 A |
3 mm |
Not Qualified |
85 dB |
2.7 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
70 ns |
60 ohm |
30 ns |
1 ohm |
3 mm |
||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
1 |
1 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N12 |
SEPARATE OUTPUT |
1 |
3.3 V |
1 mm |
3 mm |
Not Qualified |
75 dB |
2.7 V |
e0 |
BREAK-BEFORE-MAKE |
30 ns |
60 ohm |
18 ns |
3 ohm |
3 mm |
||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
1 |
CMOS |
NO LEAD |
1.8 V |
1.8/3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N12 |
SEPARATE OUTPUT |
1 |
3.6 V |
1 mm |
3 mm |
Not Qualified |
52 dB |
1.6 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
30 ns |
2 ohm |
25 ns |
3 mm |
||||||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.008 mA |
2 |
3 |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
Not Qualified |
e1 |
30 |
260 |
1000 ns |
.8 ohm |
|||||||||||||||||||||||||||||||
|
Maxim Integrated |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
1.8 V |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
.9 mm |
.15 A |
3 mm |
Not Qualified |
56 dB |
1.6 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
2 ohm |
25 ns |
3 mm |
|||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
3/5 |
CHIP CARRIER |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N12 |
1 |
Not Qualified |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
60 ns |
70 ohm |
|||||||||||||||||||||||||||||
|
Maxim Integrated |
INDUSTRIAL |
12 |
FBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
BICMOS |
BALL |
3/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
Not Qualified |
NO/NC |
e3 |
BREAK-BEFORE-MAKE |
80 ns |
.95 ohm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
55 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
2.02 mm |
|||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
1 |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
1 |
3.3 V |
.8 mm |
3 mm |
Not Qualified |
75 dB |
2.7 V |
e0 |
245 |
30 ns |
60 ohm |
18 ns |
3 ohm |
3 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BALL |
3 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
64 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
50 ns |
.8 ohm |
30 ns |
.06 ohm |
2.02 mm |
||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
2.02 mm |
||||||||||||||||||||
Maxim Integrated |
SPDT |
COMMERCIAL |
12 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
NO LEAD |
-18 V |
-15 V |
15 V |
+-15 |
UNCASED CHIP |
DIE OR CHIP |
Multiplexer or Switches |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N12 |
1 |
18 V |
Not Qualified |
62 dB |
5 V |
-5 V |
e0 |
BREAK-BEFORE-MAKE |
250 ns |
50 ohm |
150 ns |
|||||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
55 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
2.02 mm |
||||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.16SQ,32 |
Multiplexer or Switches |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
4 mm |
||||||||||||||||||||
|
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
2.02 mm |
||||||||||||||||||
Maxim Integrated |
SPDT |
COMMERCIAL |
12 |
DIE |
SQUARE |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
NO LEAD |
-18 V |
-15 V |
15 V |
+-15 |
UNCASED CHIP |
DIE OR CHIP |
Multiplexer or Switches |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
S-XUUC-N12 |
1 |
18 V |
Not Qualified |
62 dB |
5 V |
-5 V |
e0 |
BREAK-BEFORE-MAKE |
300 ns |
50 ohm |
250 ns |
|||||||||||||||||||||||||
|
Maxim Integrated |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
BGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BICMOS |
BALL |
3 V |
GRID ARRAY |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
65 dB |
2.7 V |
e1 |
30 |
260 |
250000 ns |
3 ohm |
6000 ns |
||||||||||||||||||||||||||||||
Maxim Integrated |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
1.8 V |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
.9 mm |
.15 A |
3 mm |
Not Qualified |
56 dB |
1.6 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
30 ns |
2 ohm |
25 ns |
3 mm |
|||||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BALL |
3 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
64 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
50 ns |
.8 ohm |
30 ns |
.06 ohm |
2.02 mm |
||||||||||||||||||||||
Maxim Integrated |
SPST |
COMMERCIAL |
12 |
DIE |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
-18 V |
-15 V |
15 V |
+-15 |
UNCASED CHIP |
DIE OR CHIP |
Multiplexer or Switches |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
S-XUUC-N12 |
SEPARATE OUTPUT |
1 |
18 V |
Not Qualified |
NO |
62 dB |
5 V |
-5 V |
e0 |
BREAK-BEFORE-MAKE |
300 ns |
50 ohm |
250 ns |
|||||||||||||||||||||||
Maxim Integrated |
INDUSTRIAL |
12 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.001 mA |
1 |
4 |
CMOS |
NO LEAD |
3/5 |
CHIP CARRIER |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N12 |
1 |
Not Qualified |
BREAK-BEFORE-MAKE |
60 ns |
70 ohm |
||||||||||||||||||||||||||||||||||
Toshiba |
AUDIO/VIDEO SWITCH |
12 |
DIP |
RECTANGULAR |
NO |
PLASTIC/EPOXY |
1 |
2 |
THROUGH-HOLE |
IN-LINE |
DUAL |
R-PDIP-T12 |
9.9 V |
Not Qualified |
8.1 V |
||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
SP4T |
INDUSTRIAL |
12 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
CMOS |
NO LEAD |
2.5 V |
2.5 |
CHIP CARRIER |
LCC12,.08SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N12 |
SEPARATE OUTPUT |
Not Qualified |
||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
SPDT |
INDUSTRIAL |
12 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
CMOS |
NO LEAD |
2.5 V |
2.5 |
CHIP CARRIER |
LCC12,.08SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N12 |
COMMON OUTPUT |
Not Qualified |
260 |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
12 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
3 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQCC-N12 |
4.6 V |
.55 mm |
1.4 mm |
32 dB |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 ohm |
.07 ohm |
2.2 mm |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
3 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N12 |
1 |
4.6 V |
.8 mm |
3 mm |
32 dB |
2.7 V |
e3 |
15 ohm |
.07 ohm |
3 mm |
|||||||||||||||||||||||||||||
|
Renesas Electronics |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
12 |
HQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
3 |
CMOS |
NO LEAD |
3 V |
3/3.3 |
CHIP CARRIER, HEAT SINK/SLUG |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
3 mm |
Not Qualified |
96 dB |
2.7 V |
e3 |
BREAK-BEFORE-MAKE |
2.8 ohm |
.04 ohm |
3 mm |
|||||||||||||||||||||||||
|
Renesas Electronics |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
3 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
PURE MATTE TIN |
QUAD |
S-PQCC-N12 |
1 |
4.6 V |
.8 mm |
3 mm |
32 dB |
2.7 V |
FAULT PROTECTED |
30 |
260 |
15 ohm |
.07 ohm |
3 mm |
|||||||||||||||||||||||||||
|
Renesas Electronics |
SPDT |
INDUSTRIAL |
12 |
VQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
NO LEAD |
3 V |
1.8/5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.05X.08,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
R-PQCC-N12 |
SEPARATE OUTPUT |
1 |
6.5 V |
.55 mm |
1.4 mm |
Not Qualified |
NO/NC |
60 dB |
1.8 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
.01 ohm |
2.2 mm |
|||||||||||||||||||||
|
Renesas Electronics |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
3 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N12 |
1 |
4.6 V |
.8 mm |
3 mm |
32 dB |
2.7 V |
e3 |
15 ohm |
.07 ohm |
3 mm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.