Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
DPST |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BALL |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.5 mm |
.808 mm |
55 dB |
1.6 V |
e2 |
30 |
260 |
.4 ohm |
.003 ohm |
1.308 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
DPST |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BALL |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.5 mm |
.808 mm |
55 dB |
1.6 V |
e2 |
30 |
260 |
.4 ohm |
.003 ohm |
1.308 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
60 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
56 ns |
.5 ohm |
19 ns |
.02 ohm |
2 mm |
||||||||||||||||||||||
Analog Devices |
SPST |
AUTOMOTIVE |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
NO |
61 dB |
1.8 V |
BREAK-BEFORE-MAKE |
55 ns |
.6 ohm |
15 ns |
2.18 mm |
||||||||||||||||||||||||||
|
Analog Devices |
SPDT |
OTHER |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
NO/NC |
63 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
30 ns |
5.75 ohm |
6 ns |
.07 ohm |
2 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
AUTOMOTIVE |
16 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B16 |
SEPARATE OUTPUT |
5.5 V |
.65 mm |
2 mm |
Not Qualified |
67 dB |
1.8 V |
BREAK-BEFORE-MAKE |
30 |
235 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
2 mm |
||||||||||||||||||||||
|
Analog Devices |
SPDT |
OTHER |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.7 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B10 |
1 |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
63 dB |
1.8 V |
e1 |
260 |
35 ns |
5.75 ohm |
7 ns |
.07 ohm |
2 mm |
|||||||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B6 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
71 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
60 ns |
1.4 ohm |
16 ns |
.06 ohm |
2.18 mm |
||||||||||||||||||||||||
|
Analog Devices |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
30 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
3 |
CMOS |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B30 |
1 |
3.6 V |
.65 mm |
2.5 mm |
Not Qualified |
74 dB |
1.65 V |
e1 |
260 |
32 ns |
8.8 ohm |
15 ns |
.52 ohm |
3 mm |
|||||||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B6 |
1 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
71 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
60 ns |
1.4 ohm |
16 ns |
.06 ohm |
2.18 mm |
|||||||||||||||||||||||
|
Analog Devices |
SPST |
AUTOMOTIVE |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
NC |
61 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
55 ns |
.6 ohm |
15 ns |
2.18 mm |
|||||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.63 mm |
1.6 mm |
Not Qualified |
NC |
60 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
56 ns |
.5 ohm |
19 ns |
.02 ohm |
2 mm |
||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.63 mm |
1.6 mm |
Not Qualified |
NC |
60 dB |
1.8 V |
BREAK-BEFORE-MAKE |
30 |
260 |
56 ns |
.5 ohm |
19 ns |
.02 ohm |
2 mm |
|||||||||||||||||||||
Analog Devices |
SPST |
AUTOMOTIVE |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
NC |
61 dB |
1.8 V |
BREAK-BEFORE-MAKE |
55 ns |
.6 ohm |
15 ns |
2.18 mm |
||||||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B6 |
1 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
71 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
60 ns |
1.4 ohm |
16 ns |
.06 ohm |
2.18 mm |
|||||||||||||||||||||
|
Analog Devices |
SPDT |
OTHER |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
NO/NC |
63 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
30 ns |
5.75 ohm |
6 ns |
.07 ohm |
2 mm |
|||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B6 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
71 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
60 ns |
1.4 ohm |
16 ns |
.06 ohm |
2.18 mm |
||||||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-XBGA-B16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
2.02 mm |
Not Qualified |
120 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
140 ns |
12.5 ohm |
50 ns |
.2 ohm |
2.02 mm |
|||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BALL |
3 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.52 mm |
Not Qualified |
64 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
.8 ohm |
30 ns |
.06 ohm |
2.02 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
9 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
.06 mA |
1 |
2 |
BICMOS |
BALL |
2.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
S-PBGA-B9 |
COMMON OUTPUT |
1 |
5.5 V |
.69 mm |
1.26 mm |
NC |
60 dB |
1.6 V |
-5.5 V |
e2 |
BREAK-BEFORE-MAKE |
30 |
260 |
10000000 ns |
.38 ohm |
2250000 ns |
.005 ohm |
1.26 mm |
5.5 V |
||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
2.02 mm |
Not Qualified |
65 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
2.02 mm |
|||||||||||||||||||
|
Analog Devices |
SWITCH AND MUX |
INDUSTRIAL |
25 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
1 |
5.5 V |
.69 mm |
2.56 mm |
70 dB |
1.8 V |
e1 |
30 |
260 |
800 ns |
5.5 ohm |
800 ns |
.3 ohm |
2.56 mm |
|||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
9 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
1 |
5.5 V |
.67 mm |
1.52 mm |
Not Qualified |
55 dB |
1.8 V |
e1 |
30 |
260 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
1.52 mm |
||||||||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
3 |
BICMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.69 mm |
1.55 mm |
80 dB |
1.8 V |
e1 |
30 |
260 |
.75 ohm |
.1 ohm |
2.035 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
1 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
5.5 V |
.67 mm |
2.02 mm |
Not Qualified |
55 dB |
1.8 V |
e1 |
30 |
260 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
2.02 mm |
||||||||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
3 |
BICMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.69 mm |
1.517 mm |
80 dB |
1.8 V |
e1 |
30 |
260 |
.75 ohm |
.1 ohm |
2 mm |
|||||||||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.63 mm |
1.6 mm |
Not Qualified |
NC |
60 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
56 ns |
.5 ohm |
19 ns |
.02 ohm |
2 mm |
||||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B6 |
1 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
71 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
60 ns |
1.4 ohm |
16 ns |
.06 ohm |
2.18 mm |
|||||||||||||||||||||||
|
Analog Devices |
DPDT |
AUTOMOTIVE |
16 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B16 |
SEPARATE OUTPUT |
5.5 V |
.65 mm |
2 mm |
Not Qualified |
67 dB |
1.8 V |
BREAK-BEFORE-MAKE |
30 |
235 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
2 mm |
||||||||||||||||||||||
|
Analog Devices |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
60 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
56 ns |
.5 ohm |
19 ns |
.02 ohm |
2 mm |
||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.63 mm |
1.6 mm |
Not Qualified |
NC |
60 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
56 ns |
.5 ohm |
19 ns |
.02 ohm |
2 mm |
||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B6 |
1 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
71 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
60 ns |
1.4 ohm |
16 ns |
.06 ohm |
2.18 mm |
|||||||||||||||||||||
|
Analog Devices |
SPST |
AUTOMOTIVE |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
NO |
61 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
55 ns |
.6 ohm |
15 ns |
2.18 mm |
|||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
25 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
1 |
5.5 V |
.69 mm |
2.56 mm |
70 dB |
1.8 V |
e1 |
30 |
260 |
800 ns |
5.5 ohm |
800 ns |
.3 ohm |
2.56 mm |
|||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
5.5 V |
.67 mm |
2.02 mm |
80 dB |
1.8 V |
e1 |
30 |
260 |
100 ns |
4.5 ohm |
50 ns |
.4 ohm |
2.02 mm |
|||||||||||||||||||||||||
Analog Devices |
SPST |
INDUSTRIAL |
9 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-XBGA-B9 |
SEPARATE OUTPUT |
1 |
11 V |
.69 mm |
1.52 mm |
Not Qualified |
NO |
72 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
150 ns |
50 ohm |
60 ns |
.8 ohm |
1.52 mm |
||||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
3 |
BICMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
5.5 V |
.69 mm |
1.55 mm |
80 dB |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.75 ohm |
.1 ohm |
2.035 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
5.5 V |
.67 mm |
2.02 mm |
80 dB |
1.8 V |
e1 |
30 |
260 |
100 ns |
4.5 ohm |
50 ns |
.4 ohm |
2.02 mm |
|||||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
BOTTOM |
S-XBGA-B16 |
SEPARATE OUTPUT |
5.5 V |
.67 mm |
2.02 mm |
Not Qualified |
65 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
2.02 mm |
||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
5.5 V |
.69 mm |
1.55 mm |
84 dB |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
60000000 ns |
.5 ohm |
3000 ns |
.01 ohm |
2.135 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
65 dB |
1.8 V |
e1 |
30 |
260 |
80 ns |
.85 ohm |
70 ns |
.05 ohm |
2.02 mm |
||||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
2.02 mm |
Not Qualified |
NC |
55 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
2.02 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
100 dB |
1.8 V |
e1 |
30 |
260 |
140 ns |
3.5 ohm |
50 ns |
.2 ohm |
3.06 mm |
||||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
2.02 mm |
Not Qualified |
65 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
2.02 mm |
|||||||||||||||||||
Analog Devices |
DPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
2 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
3.06 mm |
Not Qualified |
95 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
140 ns |
.85 ohm |
50 ns |
.1 ohm |
3.06 mm |
|||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-XBGA-B16 |
1 |
11 V |
.67 mm |
2.02 mm |
Not Qualified |
72 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
150 ns |
50 ohm |
60 ns |
.2 ohm |
2.02 mm |
||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
5.5 V |
.67 mm |
2.02 mm |
55 dB |
1.8 V |
e1 |
30 |
260 |
100 ns |
4.5 ohm |
50 ns |
.4 ohm |
2.02 mm |
|||||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.54 mm |
Not Qualified |
55 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
2.02 mm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.