Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
4 |
1 |
CMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
5.5 V |
.67 mm |
2.02 mm |
Not Qualified |
55 dB |
1.8 V |
e1 |
30 |
260 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
2.02 mm |
||||||||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
3 |
BICMOS |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.69 mm |
1.517 mm |
80 dB |
1.8 V |
e1 |
30 |
260 |
.75 ohm |
.1 ohm |
2 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
60 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
56 ns |
.5 ohm |
19 ns |
.02 ohm |
2 mm |
||||||||||||||||||||||
Analog Devices |
SPST |
AUTOMOTIVE |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
NO |
61 dB |
1.8 V |
BREAK-BEFORE-MAKE |
55 ns |
.6 ohm |
15 ns |
2.18 mm |
||||||||||||||||||||||||||
|
Analog Devices |
SPDT |
OTHER |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
NO/NC |
63 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
30 ns |
5.75 ohm |
6 ns |
.07 ohm |
2 mm |
|||||||||||||||||||
|
Analog Devices |
DPDT |
AUTOMOTIVE |
16 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B16 |
SEPARATE OUTPUT |
5.5 V |
.65 mm |
2 mm |
Not Qualified |
67 dB |
1.8 V |
BREAK-BEFORE-MAKE |
30 |
235 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
2 mm |
||||||||||||||||||||||
|
Analog Devices |
SPDT |
OTHER |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.7 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B10 |
1 |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
63 dB |
1.8 V |
e1 |
260 |
35 ns |
5.75 ohm |
7 ns |
.07 ohm |
2 mm |
|||||||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B6 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
71 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
60 ns |
1.4 ohm |
16 ns |
.06 ohm |
2.18 mm |
||||||||||||||||||||||||
|
Analog Devices |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
30 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
3 |
CMOS |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B30 |
1 |
3.6 V |
.65 mm |
2.5 mm |
Not Qualified |
74 dB |
1.65 V |
e1 |
260 |
32 ns |
8.8 ohm |
15 ns |
.52 ohm |
3 mm |
|||||||||||||||||||||||||
Analog Devices |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B6 |
1 |
5.5 V |
.67 mm |
1.14 mm |
Not Qualified |
71 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
60 ns |
1.4 ohm |
16 ns |
.06 ohm |
2.18 mm |
|||||||||||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B4 |
1 |
4 V |
.539 mm |
.76 mm |
1.2 V |
e1 |
30 |
260 |
.105 ohm |
.76 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
4.5 V |
1.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
Analog Waveform Generation Functions |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.625 mm |
1.31 mm |
Not Qualified |
1.2 V |
e1 |
30 |
260 |
.1 ohm |
1.615 mm |
||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
.055 mA |
1 |
4 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B36 |
4.5 V |
.54 mm |
2.34 mm |
27 dB |
1.65 V |
0 V |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
900 ns |
12 ohm |
325 ns |
.09 ohm |
2.34 mm |
4.5 V |
||||||||||||||||||||||||
|
Onsemi |
DIFFERENTIAL MULTIPLEXER |
MILITARY |
8 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-55 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B8 |
1 |
5.5 V |
.5 mm |
.888 mm |
60 dB |
1.65 V |
e1 |
30 |
260 |
10 ns |
30 ohm |
9 ns |
8 ohm |
1.888 mm |
|||||||||||||||||||||||||
|
Onsemi |
DPST |
INDUSTRIAL |
16 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B16 |
1 |
10.5 V |
.625 mm |
1.76 mm |
4 V |
e1 |
30 |
260 |
.15 ohm |
1.96 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B4 |
1 |
4 V |
.539 mm |
.76 mm |
1.2 V |
e1 |
30 |
260 |
.105 ohm |
.76 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B4 |
1 |
5.5 V |
.495 mm |
.815 mm |
97 dB |
.5 V |
e1 |
30 |
260 |
1.1 ohm |
.0011 ohm |
.815 mm |
||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
.032 mA |
1 |
10 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,14 |
.35 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
4.5 V |
.473 mm |
2.06 mm |
30 dB |
1.65 V |
0 V |
e1 |
30 |
260 |
200 ns |
12 ohm |
200 ns |
.12 ohm |
2.06 mm |
4.5 V |
|||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
65 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
40 |
260 |
60 ns |
1 ohm |
50 ns |
.06 ohm |
1.965 mm |
|||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.5 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
70 ns |
2 ohm |
70 ns |
.18 ohm |
1.965 mm |
||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
10 |
1 |
BALL |
2.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
1 |
5 V |
.637 mm |
2.43 mm |
24 dB |
1.5 V |
e1 |
30 |
260 |
1100 ns |
800 ns |
.1 ohm |
2.43 mm |
|||||||||||||||||||||||||||
Onsemi |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NC |
75 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
30 |
240 |
30 ns |
4.5 ohm |
40 ns |
.1 ohm |
1.965 mm |
|||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
2.5 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
60 ns |
1 ohm |
60 ns |
.06 ohm |
1.965 mm |
|||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
2.5 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
30 |
240 |
60 ns |
1 ohm |
60 ns |
.06 ohm |
1.965 mm |
||||||||||||||||||||
Onsemi |
SPDT |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
1.95 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.625 mm |
.91 mm |
60 dB |
1.65 V |
75 ns |
5 ohm |
50 ns |
.15 ohm |
1.91 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
3.6 V |
.54 mm |
1.2 mm |
64 dB |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0042 ohm |
1.6 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
9 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B9 |
3.7 V |
.52 mm |
1.19 mm |
1.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
400 ns |
2 ohm |
140 ns |
1.19 mm |
|||||||||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B10 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
65 dB |
1.8 V |
e0 |
70 ns |
2 ohm |
55 ns |
.18 ohm |
1.965 mm |
||||||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
30 |
240 |
60 ns |
1 ohm |
50 ns |
.06 ohm |
1.965 mm |
||||||||||||||||||||
Onsemi |
DPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
BALL |
1.95 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
5.5 V |
.625 mm |
1.41 mm |
60 dB |
1.65 V |
75 ns |
5 ohm |
50 ns |
.15 ohm |
1.91 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NC |
75 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
4.5 ohm |
40 ns |
.1 ohm |
1.965 mm |
||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.3 V |
1.8/4 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
4.5 V |
.625 mm |
.8 mm |
Not Qualified |
70 dB |
1.65 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
180 ns |
.8 ohm |
120 ns |
.4 ohm |
1.2 mm |
|||||||||||||||||||
|
Onsemi |
4PST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
4 |
BALL |
GND/3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
3 V |
.625 mm |
1.16 mm |
Not Qualified |
NC |
90 dB |
1.6 V |
e1 |
30 |
260 |
120 ns |
.8 ohm |
1.56 mm |
|||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
2.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B10 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
55 dB |
1.8 V |
e0 |
70 ns |
2 ohm |
70 ns |
.18 ohm |
1.965 mm |
||||||||||||||||||||||||||||
|
STMicroelectronics |
SPDT |
INDUSTRIAL |
7 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
1.8 V |
1.8/4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B7 |
4.8 V |
.715 mm |
1.068 mm |
Not Qualified |
69 dB |
1.65 V |
2-CHANNEL MUX/DEMUX |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
123 ns |
.65 ohm |
15 ns |
.005 ohm |
2.068 mm |
||||||||||||||||||||||
STMicroelectronics |
SPDT |
INDUSTRIAL |
11 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B11 |
4.8 V |
.715 mm |
1.55 mm |
Not Qualified |
71 dB |
1.65 V |
2-CHANNEL MUX/DEMUX |
123 ns |
.65 ohm |
15 ns |
.005 ohm |
2.068 mm |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
1.8 V |
1.8/4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
4.5 V |
.655 mm |
.828 mm |
Not Qualified |
76 dB |
1.65 V |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
160 ns |
3 ohm |
20 ns |
.04 ohm |
1.228 mm |
|||||||||||||||||||||||
|
STMicroelectronics |
SPDT |
INDUSTRIAL |
11 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
1.8 V |
1.6/4 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
FLIP CHIP |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B11 |
SEPARATE OUTPUT |
4.8 V |
.715 mm |
1.55 mm |
Not Qualified |
71 dB |
1.65 V |
2-CHANNEL MUX/DEMUX |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
123 ns |
.65 ohm |
15 ns |
.005 ohm |
2.068 mm |
|||||||||||||||||||||
|
STMicroelectronics |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
1.8 V |
1.8/4 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
4.8 V |
.625 mm |
1.4 mm |
Not Qualified |
50 dB |
1.65 V |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
160 ns |
2.5 ohm |
62 ns |
40 ohm |
1.9 mm |
||||||||||||||||||||||
|
STMicroelectronics |
SPDT |
INDUSTRIAL |
7 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
BALL |
1.8 V |
1.8/4.5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B7 |
4.8 V |
.715 mm |
1.068 mm |
Not Qualified |
69 dB |
1.65 V |
2-CHANNEL MUX/DEMUX |
BREAK-BEFORE-MAKE |
40 |
260 |
123 ns |
.65 ohm |
15 ns |
.005 ohm |
2.068 mm |
||||||||||||||||||||||
|
STMicroelectronics |
SPDT |
MILITARY |
9 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
1.4/4.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B9 |
SEPARATE OUTPUT |
4.3 V |
.8 mm |
1.47 mm |
Not Qualified |
64 dB |
1.4 V |
2-CHANNEL MUX/DEMUX |
e1 |
BREAK-BEFORE-MAKE |
50 ns |
.5 ohm |
30 ns |
1.64 mm |
||||||||||||||||||||||
NXP Semiconductors |
SPST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.55 mm |
1.36 mm |
NO |
1.66 mm |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SPST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.55 mm |
1.36 mm |
NO |
1.66 mm |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SPST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
5.5 V |
.55 mm |
1.36 mm |
NO |
3 V |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
630000 ns |
.1 ohm |
34500000 ns |
1.66 mm |
5.5 V |
|||||||||||||||||||||||||||
NXP Semiconductors |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
3.6 V |
.54 mm |
.76 mm |
Not Qualified |
1.1 V |
.76 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
3.6 V |
.54 mm |
.76 mm |
1.1 V |
.76 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CROSS POINT SWITCH |
OTHER |
28 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.005 mA |
2 |
4 |
BALL |
3.3 V |
3/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA28,4X8,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B28 |
3.5 V |
.5 mm |
5 mm |
Not Qualified |
2.7 V |
15 ohm |
4 mm |
||||||||||||||||||||||||||||||
NXP Semiconductors |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
3.6 V |
.54 mm |
.76 mm |
1.1 V |
.76 mm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.