Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.035 mA |
1 |
1 |
CMOS |
340 kHz |
BALL |
2.3 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexers or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B6 |
COMMON OUTPUT |
1 |
5.5 V |
.5 mm |
.9 mm |
Not Qualified |
NC |
57 dB |
1.65 V |
e1 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
260 |
14 ns |
30 ohm |
7.5 ns |
.1 ohm |
1.4 mm |
||||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.0001 mA |
1 |
1 |
100 kHz |
BALL |
1.8 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B6 |
SEPARATE OUTPUT |
1 |
1.95 V |
.5 mm |
.9 mm |
Not Qualified |
64 dB |
1.65 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
260 |
75 ns |
2.5 ohm |
50 ns |
.15 ohm |
1.4 mm |
5.5 V |
||||||||||||||||
|
Onsemi |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
25 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B25 |
1 |
5.5 V |
.625 mm |
2.24 mm |
2.7 V |
e1 |
30 |
260 |
2.28 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
CROSS POINT SWITCH |
COMMERCIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.022 mA |
1 |
2 |
1200 kHz |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
1 |
5.5 V |
.625 mm |
1.198 mm |
25 dB |
2.3 V |
e1 |
30 |
260 |
250000 ns |
9 ohm |
1000 ns |
.075 ohm |
1.598 mm |
||||||||||||||||||||||||
|
Texas Instruments |
CROSS POINT SWITCH |
COMMERCIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.022 mA |
1 |
2 |
1200 kHz |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
1 |
5.5 V |
.625 mm |
1.198 mm |
25 dB |
2.3 V |
e1 |
30 |
260 |
250000 ns |
9 ohm |
1000 ns |
.075 ohm |
1.598 mm |
||||||||||||||||||||||||
|
Texas Instruments |
DIFFERENTIAL MULTIPLEXER |
COMMERCIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.1 mA |
1 |
2 |
1200 kHz |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
1.182 mm |
NO |
22 dB |
2.3 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
250000 ns |
9 ohm |
1000 ns |
.07 ohm |
1.582 mm |
5.5 V |
|||||||||||||||||||
|
Onsemi |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
5.5 V |
.637 mm |
1.41 mm |
65 dB |
2.7 V |
e1 |
30 |
260 |
2 ohm |
.2 ohm |
1.575 mm |
||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
65 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
40 |
260 |
60 ns |
1 ohm |
50 ns |
.06 ohm |
1.965 mm |
|||||||||||||||||||
|
Texas Instruments |
SPST |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.015 mA |
2 |
2 |
CMOS |
300 kHz |
BALL |
2.3 V |
3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
Multiplexers or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B8 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
.9 mm |
Not Qualified |
NO |
42 dB |
1.65 V |
0 V |
e1 |
MAKE-BEFORE-BREAK |
NOT SPECIFIED |
260 |
5.6 ns |
30 ohm |
6.9 ns |
5 ohm |
1.9 mm |
5.5 V |
||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.005 mA |
2 |
2 |
18.3 kHz |
BALL |
2.5 V |
2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
1.37 mm |
Not Qualified |
NO/NC |
68 dB |
2.3 V |
-3.2 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
120 ns |
1.3 ohm |
70 ns |
.15 ohm |
1.87 mm |
5.5 V |
|||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B4 |
1 |
5.5 V |
.539 mm |
.76 mm |
Not Qualified |
1.2 V |
e1 |
30 |
260 |
.105 ohm |
.76 mm |
|||||||||||||||||||||||||||||
|
Onsemi |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
4.5 V |
.625 mm |
85 dB |
3 V |
e1 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
24 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
.005 mA |
1 |
1 |
240 kHz |
BALL |
1.8 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,5X5,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B24 |
SEPARATE OUTPUT |
1 |
3.6 V |
1 mm |
.05 A |
3 mm |
Not Qualified |
NO |
60 dB |
1.65 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
56.7 ns |
14.4 ohm |
31.2 ns |
.3 ohm |
3 mm |
3.6 V |
||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
BALL |
3.3 V |
1.8/4 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
4.5 V |
.539 mm |
2.36 mm |
Not Qualified |
18 dB |
1.65 V |
e1 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
500 ns |
12 ohm |
90 ns |
.8 ohm |
2.36 mm |
||||||||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.12 mA |
1 |
2 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B9 |
SEPARATE OUTPUT |
1 |
3 V |
.619 mm |
1.21 mm |
NC |
75 dB |
1.5 V |
e1 |
30 |
260 |
.6 ohm |
.01 ohm |
1.38 mm |
|||||||||||||||||||||||||
|
Onsemi |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
BALL |
3.7 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
5.5 V |
.625 mm |
1.56 mm |
2.7 V |
e1 |
30 |
260 |
200 ohm |
1.56 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B4 |
1 |
5.5 V |
.539 mm |
.76 mm |
1.2 V |
e1 |
30 |
260 |
.76 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
SPST |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.001 mA |
2 |
2 |
150 kHz |
BALL |
1.8 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B8 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
.9 mm |
Not Qualified |
NO/NC |
62 dB |
1.65 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
260 |
18 ns |
4 ohm |
15.5 ns |
.04 ohm |
1.9 mm |
5.5 V |
|||||||||||||||
|
Analog Devices |
AUDIO/VIDEO SWITCH |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
BALL |
2.7 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.63 mm |
1.5 mm |
Not Qualified |
60 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
56 ns |
.5 ohm |
19 ns |
.02 ohm |
2 mm |
||||||||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.000005 mA |
2 |
2 |
CMOS |
BALL |
5 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
SEPARATE OUTPUT |
1 |
.675 mm |
1.8 mm |
Not Qualified |
NO/NC |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
.8 ohm |
2 mm |
|||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
10 |
1 |
BALL |
2.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
1 |
5 V |
.526 mm |
2.43 mm |
24 dB |
1.5 V |
e1 |
30 |
260 |
1100 ns |
800 ns |
.1 ohm |
2.43 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.05 mA |
2 |
2 |
23 kHz |
BALL |
1.8 V |
1.8/3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B10 |
SEPARATE OUTPUT |
1 |
1.95 V |
.5 mm |
.1 A |
1.37 mm |
Not Qualified |
73 dB |
1.65 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
75 ns |
.5 ohm |
35 ns |
.02 ohm |
1.87 mm |
3.6 V |
|||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.02 mA |
2 |
2 |
800 kHz |
BALL |
2.5 V |
2.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
COMMON OUTPUT |
1 |
3.6 V |
.625 mm |
1.37 mm |
Not Qualified |
40 dB |
2.3 V |
ALSO REQUIRES AN SUPPLY OF 1.65V TO 1.95V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
13 ns |
7 ohm |
5.5 ns |
.05 ohm |
1.87 mm |
4.6 V |
|||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
2 mm |
Not Qualified |
67 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
2 mm |
||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
16 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.7 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
2 mm |
Not Qualified |
67 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
.7 ohm |
22 ns |
.045 ohm |
2 mm |
|||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
1.8 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.625 mm |
.76 mm |
Not Qualified |
55 dB |
1.65 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
40 ns |
1.3 ohm |
25 ns |
.15 ohm |
1.16 mm |
||||||||||||||||||||
|
Texas Instruments |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.1 mA |
1 |
2 |
1200 kHz |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
1.182 mm |
NO |
22 dB |
2.3 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
250000 ns |
9 ohm |
1000 ns |
.07 ohm |
1.582 mm |
5.5 V |
|||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
BALL |
3.3 V |
1.8/4 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
4.5 V |
.534 mm |
2.415 mm |
Not Qualified |
18 dB |
1.65 V |
e1 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
260 |
500 ns |
12 ohm |
90 ns |
.8 ohm |
2.415 mm |
||||||||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.000005 mA |
2 |
2 |
CMOS |
BALL |
5 V |
3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
SEPARATE OUTPUT |
1 |
.675 mm |
1.8 mm |
Not Qualified |
NO/NC |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
.8 ohm |
2 mm |
|||||||||||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.0005 mA |
1 |
1 |
100 kHz |
BALL |
1.8 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B8 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
.9 mm |
Not Qualified |
64 dB |
1.65 V |
2-CHANNEL MUX/DEMUX |
0 V |
e1 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
260 |
63 ns |
3.1 ohm |
21 ns |
.16 ohm |
1.9 mm |
5.5 V |
|||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B4 |
1 |
5.5 V |
.539 mm |
.76 mm |
1.2 V |
e1 |
30 |
260 |
65 ohm |
.76 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
4PST |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
4 |
BALL |
GND/3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
SEPARATE OUTPUT |
1 |
3 V |
.625 mm |
1.16 mm |
Not Qualified |
NC |
90 dB |
1.6 V |
e1 |
30 |
260 |
120 ns |
.8 ohm |
1.56 mm |
|||||||||||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
9 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B9 |
SEPARATE OUTPUT |
1 |
3 V |
.619 mm |
1.21 mm |
NC |
82 dB |
0 V |
e1 |
30 |
260 |
.8 ohm |
.01 ohm |
1.38 mm |
||||||||||||||||||||||||||
|
Analog Devices |
SPST |
OTHER |
110 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
DIMOS |
BALL |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B110 |
1 |
5.5 V |
.69 mm |
5.438 mm |
75 dB |
1.7 V |
e2 |
30 |
260 |
4000 ns |
13 ohm |
4000 ns |
.21 ohm |
5.498 mm |
|||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NC |
75 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
40 |
260 |
30 ns |
4.5 ohm |
40 ns |
.1 ohm |
1.965 mm |
||||||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.005 mA |
2 |
2 |
18.3 kHz |
BALL |
2.5 V |
2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
1.37 mm |
Not Qualified |
NO/NC |
70 dB |
2.3 V |
-3.2 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
120 ns |
1.3 ohm |
70 ns |
.3 ohm |
1.87 mm |
5.5 V |
|||||||||||||||
|
NXP Semiconductors |
SPST |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
1 |
3.6 V |
.54 mm |
.76 mm |
1.1 V |
30 |
260 |
.76 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
SPST |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.001 mA |
2 |
2 |
150 kHz |
BALL |
1.8 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B8 |
SEPARATE OUTPUT |
1 |
5.5 V |
.625 mm |
.9 mm |
Not Qualified |
NO/NC |
62 dB |
1.65 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
260 |
18 ns |
4 ohm |
15.5 ns |
.04 ohm |
1.9 mm |
5.5 V |
|||||||||||||||
|
Texas Instruments |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
.06 mA |
1 |
10 |
1500 kHz |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
2.6 mm |
NO |
20 dB |
1.65 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
300000 ns |
6.5 ohm |
1000 ns |
.1 ohm |
2.6 mm |
3.6 V |
|||||||||||||||||||
|
Texas Instruments |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
UNSPECIFIED |
.06 mA |
1 |
1 |
3000 kHz |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B36 |
SEPARATE OUTPUT |
1 |
5.5 V |
.5 mm |
2.6 mm |
NO |
20 dB |
1.65 V |
0 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
300000 ns |
9 ohm |
1000 ns |
.1 ohm |
2.6 mm |
3.6 V |
||||||||||||||||||||
|
Texas Instruments |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.01 mA |
1 |
1 |
CMOS |
300 kHz |
BALL |
2.3 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
Multiplexers or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B8 |
COMMON OUTPUT |
1 |
5.5 V |
.5 mm |
.1 A |
.9 mm |
Not Qualified |
50 dB |
1.65 V |
e1 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
260 |
7.2 ns |
30 ohm |
7.9 ns |
5 ohm |
1.9 mm |
||||||||||||||||
|
Onsemi |
SPST |
INDUSTRIAL |
6 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
BALL |
4.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.625 mm |
.96 mm |
1.5 V |
e1 |
30 |
260 |
.11 ohm |
1.46 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
9 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
.06 mA |
1 |
2 |
BICMOS |
BALL |
2.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
S-PBGA-B9 |
COMMON OUTPUT |
1 |
5.5 V |
.69 mm |
1.26 mm |
NC |
60 dB |
1.6 V |
-5.5 V |
e2 |
BREAK-BEFORE-MAKE |
30 |
260 |
10000000 ns |
.38 ohm |
2250000 ns |
.005 ohm |
1.26 mm |
5.5 V |
||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
9 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B9 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.52 mm |
Not Qualified |
NO |
70 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
100 ns |
1 ohm |
100 ns |
.01 ohm |
1.52 mm |
||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
9 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BICMOS |
BALL |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
SEPARATE OUTPUT |
1 |
5.5 V |
.67 mm |
1.52 mm |
Not Qualified |
NO |
70 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
30 |
260 |
100 ns |
1 ohm |
100 ns |
.01 ohm |
1.52 mm |
||||||||||||||||||
|
Microchip Technology |
SPST |
64 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
8 mA |
24 |
1 |
HVCMOS |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X10,25 |
.65 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
SEPARATE OUTPUT |
5.5 V |
1 mm |
2 A |
7 mm |
NO |
33 dB |
3 V |
-30 V |
e1 |
5000 ns |
26 ohm |
5000 ns |
1.3 ohm |
7 mm |
30 V |
||||||||||||||||||||||
|
Texas Instruments |
CROSS POINT SWITCH |
COMMERCIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.022 mA |
1 |
2 |
1200 kHz |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
1 |
5.5 V |
.625 mm |
1.198 mm |
25 dB |
2.3 V |
e1 |
30 |
260 |
250000 ns |
9 ohm |
1000 ns |
.075 ohm |
1.598 mm |
||||||||||||||||||||||||
|
Texas Instruments |
CROSS POINT SWITCH |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
YES |
UNSPECIFIED |
.022 mA |
1 |
2 |
1200 kHz |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B12 |
1 |
5.5 V |
.625 mm |
1.198 mm |
25 dB |
2.3 V |
e1 |
30 |
260 |
250000 ns |
9 ohm |
1000 ns |
.075 ohm |
1.598 mm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.