VFBGA Power Management ICs 2,400+

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Switcher Config	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MAX16072RS26D1+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1	BICMOS	BALL	3.6 V			GRID ARRAY			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4		5.5 V	.69 mm	1.1 mm	Not Qualified	1.2 V	RESET THRESHOLD VOLTAGE IS 2.63 V		30	260	+2.63V	1.1 mm	NO
MAX17049X+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	OTHER	8	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.04 mA	1	1		BALL		2.5/4.5		GRID ARRAY, FINE PITCH	BGA8,2X4,16	Power Management Circuits	.4 mm	70 Cel	-20 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	4.5 V	.69 mm	.835 mm	Not Qualified	2.5 V	RESET THRESHOLD VOLTAGE IS 3 VOLT	e2	30	260	+3V	1.625 mm	YES
MAX17049X+T10	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	OTHER	8	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.04 mA	1	1		BALL		2.5/4.5		GRID ARRAY, FINE PITCH	BGA8,2X4,16	Power Management Circuits	.4 mm	70 Cel	-20 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	4.5 V	.69 mm	.835 mm	Not Qualified	2.5 V	RESET THRESHOLD VOLTAGE IS 3 VOLT	e2	30	260	+3V	1.625 mm	YES
STBC03JR	STMicroelectronics	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	5		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B30		5.4 V	.6 mm	2.25 mm		4.55 V						2.59 mm	YES
BD71815AGW-E2	ROHM	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	80	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	15		BALL	1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B80		3.4 V	.62 mm	4 mm		1.5 V			NOT SPECIFIED	NOT SPECIFIED		4 mm	YES
BQ24165YFFR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	49	VFBGA	SQUARE	YES	PLASTIC/EPOXY	5 mA	1	1		BALL		4.2/18	BUCK	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,7X7,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B49	1	10 V	.625 mm	2.8 mm	Not Qualified	4.2 V		e1	NOT SPECIFIED	260	+3.8V	2.8 mm	YES
BQ25882YFFT	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	25	VFBGA	SQUARE	YES	UNSPECIFIED		1	2		BALL	5 V		BOOST	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-XBGA-B25	1	6.2 V	.625 mm	2.105 mm		3.9 V		e1	30	260		2.105 mm	YES
ISL91211BIIZ-T	Renesas Electronics	POWER SUPPLY MANAGEMENT CIRCUIT		54	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	4		BALL	3.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA54,6X9,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-B54		5.5 V	.55 mm	2.551 mm		2.5 V			NOT SPECIFIED	NOT SPECIFIED	+2.58V	3.67 mm	YES
TCK106AG,LF	Toshiba	POWER SUPPLY SUPPORT CIRCUIT		4	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1	CMOS	BALL	1.2 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,16		.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4		5.5 V	.59 mm	.79 mm		1.1 V						.79 mm	NO
BQ27742YZFT-G1	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	15	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.01 mA	1	1		BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B15	1	5 V	.625 mm	1.956 mm		2.8 V	ALSO OPERATES WITH SUPPLY 2.45 TO 2.8V; VG THR FOR ATTACHMENT DET IS 2.7V AND REMOVAL DET IS 1V	e1	30	260		2.776 mm	YES
FAN5400UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	20	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1			BALL	5 V	5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B20	1	6 V	.625 mm	1.87 mm	Not Qualified			e1	30	260		1.96 mm
FAN5403UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	20	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1			BALL	5 V	5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B20	1	6 V	.625 mm	1.87 mm	Not Qualified			e1	30	260		1.96 mm
FAN5405BUCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	20	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1			BALL	5 V	5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B20	1	6 V	.625 mm	1.87 mm	Not Qualified	4 V		e1	30	260		1.96 mm
MAX9634HERS+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1	BICMOS	BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	28 V	.69 mm	1 mm		1.6 V	RESET THRESHOLD VOLTAGE IS 28.5V	e1	30	260	+28.5V	1 mm	NO
MIC2782CLYCS-TR	Microchip Technology	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.575 mm	.8 mm		1.5 V			10	260		1.2 mm	NO
MIC2782ELYCS-TR	Microchip Technology	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.575 mm	.8 mm		1.5 V			10	260		1.2 mm	NO
TLV841SADL01YBHR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT		4	VFBGA	SQUARE	YES	PLASTIC/EPOXY	.001 mA	1	1		BALL	1 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,16		.4 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	6 V	.4 mm	.731 mm		.7 V		e1	30	260	+0.505V	.731 mm	YES
BQ27Z561YPHR-R2	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	12	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	5.5 V	.4 mm	1.6745 mm		2 V		e1	30	260		2.05 mm	YES
LP8725TLX-E/NOPB	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	9		BALL	3.6 V	3.6		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	4.5 V	.675 mm	2.56 mm	Not Qualified	2.6 V		e1	30	260		2.96 mm	NO
MAX20333CENL+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B15	1	22 V	.5 mm	1.518 mm		3.5 V		e2	30	260	1.5	2.098 mm	YES
MAX20333DENL+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B15	1	22 V	.5 mm	1.518 mm		3.5 V		e2	30	260	1.5	2.098 mm	YES
MAX20333ENL+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT		15	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1	BICMOS	BALL	9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-XBGA-B15	1	22 V	.5 mm	1.518 mm		3.5 V		e2	30	260		2.098 mm	YES
MAX20333ENL+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B15	1	22 V	.5 mm	1.518 mm		3.5 V		e2	30	260	1.5	2.098 mm	YES
MAX20333FENL+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B15	1	22 V	.5 mm	1.518 mm		3.5 V		e2	30	260	1.5	2.098 mm	YES
MAX20333GENL+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B15	1	22 V	.5 mm	1.518 mm		3.5 V		e2	30	260	1.5	2.098 mm	YES
MAX77840EWG+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	81	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.7 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA81,9X9,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B81	1	5.5 V	.69 mm	3.868 mm		2.5 V		e2	30	260	2.5	3.958 mm	YES
MIC2782FLYCS-TR	Microchip Technology	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.005 mA	1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.575 mm	.8 mm		1.5 V			10	260		1.2 mm	NO
BQ21061YFPT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	20	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B20	1	5.5 V	.5 mm			3.15 V		e1	30	260			YES
BQ27621YZFR-G1A	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.027 mA	1	1		BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.6205 mm	NO
GG25LJ	STMicroelectronics	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	10	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B10		4.5 V	.705 mm	1.37 mm		2.7 V	SEATED HT-CALCULATED		NOT SPECIFIED	NOT SPECIFIED		2.01 mm	YES
MAX16150CWT+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT		6	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.03 mA	1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	125 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-XBGA-B6	1	5.5 V	.69 mm	.828 mm		1.3 V		e2	30	260		1.238 mm	NO
MAX17302X+	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.05 mA	1	1		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,20		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B15	1	4.9 V	.69 mm	1.678 mm		2.3 V		e2	30	260		2.448 mm	YES
MAX17302X+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.05 mA	1	1		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,20		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B15	1	4.9 V	.69 mm	1.678 mm		2.3 V		e2	30	260		2.448 mm	YES
MAX9634WERS+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1	BICMOS	BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	28 V	.69 mm	1 mm		1.6 V	RESET THRESHOLD VOLTAGE IS 28.5V	e1	30	260	+28.5V	1 mm	NO
P9221-RAHGI8	Renesas Electronics	POWER SUPPLY SUPPORT CIRCUIT	OTHER	52	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	2		BALL				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B52	1		.65 mm	2.64 mm				e1	NOT SPECIFIED	260		3.94 mm	YES
TPS22924DYZPR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.35 mA	1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B6	1	3.6 V	.5 mm	.888 mm		.75 V		e1	NOT SPECIFIED	260		1.388 mm	NO
BD2204GUL-E2	ROHM	POWER SUPPLY SUPPORT CIRCUIT		6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.0525 mA	1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		4.5 V	.55 mm	1 mm		2.7 V			NOT SPECIFIED	NOT SPECIFIED		1.5 mm	NO
BQ24257YFFR	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	2000 mA	1	1		BALL	5 V	4.5/10		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B30	1	6.5 V	.625 mm	1.9875 mm	Not Qualified	4.35 V		e1	NOT SPECIFIED	260	+3.35V	2.3875 mm	YES
BQ25120YFPR	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	25	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B25	1	5.5 V	.5 mm	2.468 mm		3.4 V		e1	30	260		2.53 mm	YES
BQ27220YZFT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.6205 mm	NO
BQ27421YZFT-G1B	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V	3.6		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.625 mm	1.58 mm	Not Qualified	2.45 V		e1	30	260		1.62 mm	NO
FAN5405UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	20	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1			BALL	5 V	5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B20	1	6 V	.625 mm	1.87 mm	Not Qualified			e1	30	260		1.96 mm
FPF1204UCX-Z006	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,16		.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4		5.5 V	.539 mm	.76 mm		1.2 V						.76 mm	NO
FPF1504LUCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1	CMOS	BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,16		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	3.6 V	.625 mm	.96 mm		1 V		e1	30	260		.96 mm	NO
FUSB251UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	15	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B15	1	5.5 V	.612 mm	1.49 mm		2.7 V		e1	30	260		2.06 mm	NO
MAX16150AWT+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	5.5 V	.69 mm	.828 mm		1.3 V		e2	30	260		1.238 mm	NO
MAX4372FEBT-T	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.06 mA	1	1	BICMOS	BALL	12 V	2.7/28		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B6	1	28 V	.67 mm	1 mm	Not Qualified	2.7 V		e0				1.52 mm	NO
MAX4372FEBT+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	6	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.06 mA	1	1	BICMOS	BALL	12 V	2.7/28		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	28 V	.67 mm	1 mm	Not Qualified	2.7 V		e1	30	260		1.52 mm	NO

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.